IIC Shenzhen2024

AspenCore is committed to creating influential system design event in China.

Forward-looking innovative technology, industry information exchange and comprehensive coverage of industrial opportunities, International IC & Component Exhibition and Conference (Abbr.: IIC) is committed to creating an efficient and authoritative communication platform for the electronics industry. AspenCore is taking a global perspective and enthusiasm to serve local industries, assist local enterprises to communicate deeply with the world's leading technology manufacturers, quickly grasp the industry development trend, inspire innovative design ideas, assist Chinese engineers to complete emerging breakthrough technologies required for innovative design. This event has significantly promoted communication and collaboration within and outside the industry, playing a crucial role in advancing technology and upgrading the entire sector.

IIC Shenzhen 2024 brings together industry summit, high-end forum, innovative product display and technology exchange. Global Distributions & Supply Chain Leaders Summit, the 28th High Efficiency Power Management and Wide Bandgap Semiconductor Technology Application Forum, Wireless Connection Technology and Application Forum,EDA/IP and IC Design Forum, The 5th International Industry 4.0 and Technology and Application Forum will be held during IIC Shenzhen 2024. This forum will bring together electronics industry leaders, managers, design experts, and decision-makers from around the world. Through keynote speeches, discussions on industry trends, roundtable dialogues, high-quality product displays, and networking dinners, participants will engage with industry experts in-depth, fostering communication bridges and sharing in the industry's grand event.

Highlights

Focus on Industry Hotspots： Highlighting key emerging technologies and products such as AI, green energy, IoT, automotive electronics, smart industry, IC applications, EDA/IP, RF, and wireless technology. The event gathers a large community from China's electronics sector, offering insights into innovative applications and solutions, inspiring design creativity, and solving design challenges.

Opportunities for Technical Exchange and Collaboration： Facilitates technical discussions and partnerships, helping companies find new partners and business opportunities.

High-Level Summits and Technical Forums： Annual design and innovation events bring together industry leaders and experts to discuss future trends and demands in the semiconductor market.

Awards Ceremony and In-Depth Interactions： Provides opportunities for deep interaction with industry leaders, fostering networking and building communication bridges to share industry knowledge.

Premium Exhibition Area： Showcases domestic and international brands, including global giants and local tech pioneers, presenting the latest technologies and products and offering one-stop access to top industry resources.

Content

2024 Global CEO Summit
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Edge intelligence has revitalized sectors like the Internet of Things, autonomous vehicles, smart cities, and smart homes. This intelligence is powered by essential “Chip" elements that drive edge computing, allowing data to be processed at its source, facilitating real-time responses and intelligent decision-making. Sensor technology plays a pivotal role in data gathering and input for edge computing, strengthening the foundation of IoT and smart devices. Advanced power management techniques extend the operational lifespan of these edge devices. Through the deep integration and synchronization of various technologies at the edge, a future rich with possibilities is being forged. This summit will launch a forward-looking dialogue on the ‘Edge Computing: Embrace the Unlimited Future’, featuring keynote speeches from global leaders who will discuss the latest tech trends, key challenges, and strategic responses. Attendees will explore the limitless potential of edge technology and foresee the future paths of technological advancements.
2024 World Electronics Achievement Awards
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Wireless Connection Technology and Application Forum
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As generative AI rapidly gains popularity, communication technologies exemplified by 5G are achieving unprecedented system gains. It is foreseeable that the collaborative evolution of 5G and AI will unlock greater technological potential for each other, spurring revolutionary technological advancements and innovative applications. Yet, we must not overlook the significant innovations achieved by wireless technologies such as Wi-Fi, ultra-low power Bluetooth, UWB, and Matter. As crucial building blocks for a world of intelligent interconnected devices, these technologies profoundly illustrate the massive impact of the integration of the digital and physical economies. During IIC Shenzhen 2024, we will host the "Wireless Connection Technology and Application Forum" where we invite engineers and industry experts to discuss the latest trends in various wireless communication technologies, empowering digital transformation across all sectors.
The 5th International Industry 4.0 and Technology and Application Forum
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Industry 4.0 represents the future of manufacturing, seamlessly integrating advanced digital technologies into every production and industrial process. It builds on a foundation of diverse technologies, including the Internet of Things, cloud computing, artificial intelligence, big data, robotics, and automation. This integration aims to optimize the use of resources and information across both virtual and physical realms, striving for intelligent manufacturing with high flexibility and resource efficiency, and the creation of smart factories. Countries and regions around the globe are actively advancing the development of Industry 4.0. To further support this transformation, the "Fifth International Industry 4.0 Technology and Application Forum" will be held concurrently with the IIC Shenzhen 2024. This forum will bring together industry experts, scholars, and leading manufacturers to discuss the latest trends in Industry 4.0 and collaborate on its development and future outlook.
IIC Shenzhen 2024 Online Exhibition
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2024 Global Distribution & Supply Chain Leaders Summit
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In the era of new quality productive forces, the field of electronic component distribution and supply chain is brimming with new opportunities. Emerging technologies and innovation trends could reshape the supply chain ecosystem. The focus of "Challenging Boundaries: Pioneering New Landscapes." is on disruptive innovation within the realm of electronic component distribution and the digital transformation and innovative development of supply chain management. The discussion will explore how cutting-edge technologies such as blockchain, artificial intelligence, and smart factories can enhance the efficiency and sustainability of the supply chain ecosystem.
2024 Global Electronic Component Distributor Awards Ceremony
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The 28th High Efficiency Power Management and Wide Bandgap Semiconductor Technology Application Forum
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Recently, wide bandgap semiconductors have become a hot topic in power device technology. Known for their high efficiency, compact size, and cost-effectiveness in energy conversion, they have gained attention across various industries like data centers, smart buildings, home appliances, electric vehicles, and energy storage systems.. For instance, in a standard data center, electricity costs make up around 45% of the total operating expenses. A medium-sized data center may need about 50MW of electrical capacity, equivalent to powering 4,000 households. The energy consumption in data centers poses environmental challenges, emphasizing the importance of efficient power management solutions to address these issues. Moreover, to extend the battery life of end devices such as electric vehicles and smartphones, there is a need to increase the operating frequency of devices while minimizing losses. This is why, in addition to numerous startups targeting SiC and GaN, many established leaders in power devices are also actively exploring wide bandgap semiconductors through self-development or acquisitions.。 In response to this technological shift, the 28th High Efficiency Power Management and Wide Bandgap Semiconductor Technology Application Forum organized by AspenCore has served as a valuable platform for engineers to collaborate, share ideas, and learn from each other.
EDA/IP and IC Design Forum
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Right now, the world of EDA/IP and IC design technology is experiencing a critical period of swift growth. With cutting-edge technologies like artificial intelligence, 5G communication, and the Internet of Things on the rise, the need for sophisticated EDA/IP and IC designs is more pressing and complex than ever. In this environment, the industry is facing a variety of new trends and technical challenges. These challenges include integrating artificial intelligence and machine learning into design workflows, increasing requirements for radio frequency and millimeter-wave technologies, as well as the development of novel packaging designs and thermal management strategies. Additionally, as chips become more integrated and energy-efficient, there's a growing interest in the adoption of new materials and advanced manufacturing processes. Looking to the future, the development of EDA/IP and IC design technologies will significantly impact the evolution of markets in communications, computing, consumer electronics, automotive, healthcare, and industry. Therefore, gaining a deep understanding of these trends will help drive innovation, address competition, and prepare for future developments. In this dynamic backdrop, the upcoming EDA/IP and IC Design Forum, scheduled during IIC Shenzhen 2024, will serve as a vital gathering point. We will bring together top global experts and engineers to explore future trends, foster connections, and share the latest breakthroughs, challenges, and best practices in EDA/IP and IC design.
IIC Shenzhen 2024 Online Exhibition
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