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Sensing the World, Perceiving the Future

In the history of scientific and technological progress, we have been searching for a better way and a more comprehensive viewpoint to sense the world. The 5th Global CEO Summit hosted by AspenCore will bring together leaders from analog, digital, artificial intelligence, and other fields, outlining the future development blueprint from an international perspective, gaining insights into the trends, and anchoring the direction of the industry with breakthrough technologies and concepts.

Let's sense the world together, perceive the future, see far and go further.

KEYNOTE SPEAKERS

SUMMIT AGENDA

08:30-09:20

Guest Register

09:20-09:30

Welcome Remarks

Yorbe Zhang, Head of AspenCore APAC

09:30-09:45

Guest Address

Ganesh Moorthy, Microchip President & CEO

09:45-10:10

Agile Verification to Accelerate System Design and Architecture Innovation

Felix Cha, Chief Marketing and Strategy Officer of XEPIC

10:10-10:35

A Decade of Precision Current Sensing Device Development - The Transformation History of C&B Electronics

Baoping Yang, Chairman of C&B Electronics

Once a trader, now a leading high-end resistor manufacturing company, whose industrial chain involves the manufacture of alloy materials, electron beam equipment, process equipment technology, resistor and current sensor research and development and manufacturing. From a 50 sqm office to a 50,000 sqm R&D and manufacturing base, how did C&B Electronics complete its strategic transformation? What was the first step? What setbacks did it encounter?
10:35-11:00

Build the sense of data, enjoy the incoming digital lifestyle—XCC empowers components supply chain

Andy Xian, Deputy General Manager of iCEasy

The society has registered a high-speed development. The international situation varies from time to time. The electronic information industry chain is closely linked and has a huge synergy effect. A fire, a single order cut, a price reduction notice, etc. can cause a chain reaction, affecting the entire enterprise operation. Only by building scientific and accurate data perception and understanding various changes in emergency, delivery date, inventory, price, futures,etc, can we prevent the supply risk of components, ensure the safety and stability of the supply chain, and enjoy the digital and intelligent future. XCC Component Supply Chain Fluctuation Monitoring and Assurance System(SaaS and customized service WWW.XCC.COM)can solve users' pain points and difficult problems in multiple dimensions. In this speech, Andy Xian, deputy general manager of iCEasy, will give a detailed speech on " Build the sense of data, enjoy the incoming digital lifestyle—XCC empowers components supply chain".
11:00-11:25

Building EDA Ecosystem to Share Industrial Chain Value

Lianfeng Yang,Director and President

11:25-13:30

Lunch Break

13:30-14:00

The Growth of the IoT – Connectivity, Interoperability, Security. It Starts with Silicon.

Ross Sabolcik, Senior Vice President, Industrial and Commercial, Silicon Labs Anthony Zhou, China Country Manager, Silicon Labs

14:00-14:25

Sensing, Connectivity, Security, make our lives easier

Andy Lai, Renesas Electronics China President

14:25-14:50

IP for a new future

Wallace Pai, Chairman,Imagination China

14:50-15:15

Automotive-Grade CMOS Image Sensors, Unleashing the Power of Automotive Imaging towards Intelligent Vehicles

Mike Hu, Vice President of Technology and the President of SmartSens Technology Research Institute

With the fast-growing penetration of intelligent vehicles in the market, automotive cameras will fully benefit from the increasing demands for technology upgrades, thereby driving the accelerated development of the automotive CIS market. CMOS image sensors have been widely used in automotive imaging applications such as driving recording, surround/rear view imaging, intelligent sensing, which puts forward higher requirements for automotive-grade CISs’ capabilities including low-light imaging, high dynamic range, etc.
15:15-15:40

promoting collaborative innovation of the automotive industry with high-performance computing chips

Johnson Shan, Founder & CEO of Black Sesame Technologies

With the rapid development of the automotive industry, the change of automotive industry not only brings market opportunities, but also creates opportunities for the development of big computing chips. In the next 3-5 years, the intelligent driving field in China and the world will see rapid development. high-performance computing chips are the basis for the development of intelligent new energy vehicles. HuaShan-2 A1000 series chip is the first domestic chip already in pass production stage and single chip support the functions of high-level autonomous driving, and seamless connection of parking with power of 58 TOPS. With A1000 chip as the core, Black Sesame Technologies promotes the construction of localized system software stack, independently controllable tool chain and algorithm application.
15:40-16:05

Safe and sound. Sustainable: Perceiving the future with embedded AI and MEMS sensors

Dr. Stefan Finkbeiner, CEO Bosch Sensortec

Meanwhile almost no state-of-the-art mobile consumer electronics device exists that does not contain at least one MEMS sensor. From smartphones over tablets and notebooks to smartwatches and hearables MEMS sensors have taken over important key functions in these devices. MEMS sensors themselves are undergoing continuous developing processes to increase performance, reduce power consumption and shrink size. In parallel, more and more new sensor use cases are being developed with and around MEMS sensors. Either by intelligently combining them with other measurement technologies or by applying such leading-edge technologies like artificial intelligence and machine learning. In his talk, Dr. Stefan Finkbeiner, CEO at Bosch Sensortec will introduce latest solutions at different complexity levels of how new technological developments enrich sensor related use cases for consumer electronics and IoT devices.
16:05-16:30

Computing-in-Memory Chip WTM Series

Wang Shaodi, Founder and CEO

In the era of AI, the surge of data leads to the increasingly problem of storage walls. The computing-in-memory technology is considered to be an effective solution to the problem of storage walls, which can achieve ultra-high energy efficiency, ultra-low power consumption and reduce costs. Wang Shaodi, founder and CEO of Witmem(Zhicun) Technology, will take WTM computing-in-memory chips as examples to share the mass production experience and thinking from three aspects of technology, application and ecosystem building, to help realize more AI application scenarios.
16:30-16:50

Today & Tomorrow - “Mega Trends” & Innovation

Mr. Michael Pocsatko Senior Vice President and GM, Corporate Marketing & Incubation HQ, TDK Corporation

TDK’s venture spirit and value structure, which lead the company to numerous world class innovations in the field of passive components and electronic materials. - External challenges like Digital Transformation and Energy Transformation that offer opportunities for sustainable growth in developing applications for which TDK will offer new solutions beyond its existing product range. - Innovations for the Chinese market and from TDK sites in China.
16:50-17:30

Roundtable Topic: Global Semiconductor Cycle Variables and Coping Strategies

嘉宾: 曾霖,安谋科技汽车业务线业务发展与方案总监 王彤, 深圳华大九天科技有限公司总经理 杨宇欣,黑芝麻智能首席市场营销官 陈磊,东芯半导体股份有限公司 副总经理