IIC Shenzhen 2022

Company Awards
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Electronic Company of the Year
Startup of the Year
Outstanding Innovative Company of the year
Most Promising New IoT Company of the Year
Most Promising New AI Company of the Year
Most Promising Third Generation Semiconductor Technology of the Year

Unigroup Guoxin Microelectronics Co., Ltd.

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Guoxin Micro (Stock Code: SZ002049) is one of the largest listed companies involved in integrated circuit design in China. With smart chips as the core business, the company focuses on digital security, intelligent computing, power and power management, high-end chip components, highly reliable integrated circuits and etc.. It is a leading provider of chip products and solutions, which are widely used in finance, telecommunications, government affairs, automobile, industrial interconnection, Internet of Things and other fields. In terms of the chips for China's second-generation ID card, the company accounts for a quarter of the total market share. In the global SIM chip market, its market share ranks the first place, with overseas shipments exceeding 50%. It occupies a leading position in various business domains, including chips for China's SIM card, banking cards applying state cryptography, resident health card, new generation traffic card, ID card reader and POS SE chips. The company's products and applications are all over the world. To this date, the accumulated shipments of smart chips worldwide has exceeded 15 billion pieces. With the mission of the company“bring success to customers with chips and to create a smart world with joint efforts”, and the vision to become “a leading enterprise of smart chips”, we stick to the three approaches, namely, "leading technology, global development and efficient operation", and is dedicated to the fields of smart internet connection, smart industry, smart finance, smart city, smart life and smart transportation. We are committed to the building of a smart industry ecosystem and empowering all walks of life to become more intelligent. THD 89，our next generation high-performance security chip, is the first of its kind in China that has obtained SOGIS CC EAL6+ --- the highest security certificate in the world. As a major breakthrough in this field and a milestone in the history of chip security certificate in China, it has demonstrated to the world the great power of China in smart manufacturing of chips and has created a good momentum for Chips from China, with Chips from Unigroup as a representative, to explore the world market. THD89 features excellent RF performance, rich communication interfaces, ultra-low power consumption, large capacity space and ultra-fast transaction speed. With all the indicators above the international standard, it has improved China’s competitiveness in the international market of security chips. In addition, THD89 product adopts advanced technology, supports international and national encryption algorithms, and is compatible with mainstream standard interfaces. It adopts memory encrypted storage, bus encrypted storage, electrical environment monitoring, anti power consumption analysis and anti fault injection, making it extraordinary in security, reliability and ease of use. The product is suitable for finance security, mobile communication, automotive electronics, identity authentication and other fields, providing top level design for the smart connections to everything. In the context of 5G and new infrastructure construction, it has great great potential for development in IOT applications. For instance, in the field of financial security payment, the product can be applied in financial cards, urban transportation, social security cards, electronic licenses, resident health cards, etc.. Among them, hundreds of millions of chips for financial cards have been shipped to cover most major card vendors at home and abroad. Also, in the field of Internet of Vehicles, the solution offered based on this chip has created a real-time protection system for intelligent vehicles. It has been introduced into more than ten automotive electronics enterprises and gradually applied to many international well-known brand vehicles, providing information security guarantee for Vehicles subject to China Ⅵ Emission Standards and helping to build a safe ecological environment for the IOT. The company has mastered six core technologies related to intelligent security chip, including NFC, security algorithm, security attack and defense, embedded storage, embedded scheme and high reliability. It has a number of core patents, and has built four technology platforms, including design, testing, quality assurance and process outsourcing, which can ensure the R & D, manufacturing, testing and application development of a variety of process nodes. With leading process technology nodes and efficient design, the intelligent security chips of the company have significant advantages in performance, cost and reliability. It is widely used in financial payment, identity recognition, Internet of Things, mobile communication, intelligent terminal, Internet of Vehicles and other fields. the intelligent security chip THD89 passed the international SOGIS CC EAL6 + security test, making it the first chip in China that has been awarded the highest level of security certificate. Guoxin Micro provide basic support for the digital era. The company is firmly embracing the future trend and the forefront of technology to explore the broad market, and is expected to maintain current leading edge and achieve greater development.

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Shenzhen Longsys Electronics Co.,Ltd.

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Founded in 1999, Longsys is engaged in the R&D, design, and selling of Flash memory and DRAM. With its primary focus on storage products and applications, the company is strongly competitive in areas such as firmware algorithm development, storage chip testing, integrated package design, and storage product customization. It provides consumer, industrial, and automotive storage products along with software and hardware application solutions for industry storage. Longsys has formed four product lines: embedded storage, solid-state drive, mobile storage, and memory module, and also owns the industry storage brand FORESEE and the international high-end consumer storage brand Lexar. Longsys's storage products are widely used in smartphone, smart TV, tablet, computer, communication device, wearable device, the Internet of Things (IoT), security monitoring, industrial control, automotive electronics, and personal mobile storage. In 2021, Longsys grew its business rapidly and secured an operating income of 9.7 billion yuan and a net profit of more than 1 billion yuan. It has formed stable cooperative relations with Huaqin Technology, Wingtech Technology, Longcheer, Tinno Mobile, and other industry-leading original design manufacturers (ODMs) of devices. Its industry storage products have made it into the supply chain systems of Transsion Holdings, ZTE, ByteDance, EZVIZ, Tsinghua Tongfang, and other major industry leaders. JD.com, Amazon, Walmart, Best Buy, Office Depot, and many other well-known retailers are all clients of Longsys's consumer storage products. Following the release of FORESEE automotive eMMC (Grade 3) in 2020, Longsys has launched FORESEE automotive eMMC (Grade 2), one of the few domestic storage products that meet AEC-Q100 Grade 2 (the core standard system for the automotive electronics industry), for automotive electronics and other high-end application scenarios FORESEE automotive eMMC (Grade 2) comes in 4GB, 8GB, 16GB, 32GB, and 64GB capacity options and can work under temperatures ranging from –40℃ to 105℃. It can resist high and low temperature changes, has high environmental resistance, and performs well in harsh environments with static electricity, electromagnetic interference, and more. The mean time between failures (MTBF) exceeds 20 million hours. The high reliability and long service life ensures that the eMMC can operate around the clock for extended periods. Its unique device status monitoring system allows hosts to view the running status and lifespan of storage components at any time simply by using standard commands. In addition to facilitating maintenance and advance warnings, this system ensures both device and data security. Longsys's delivery center has deployed a professional production supply chain specifically to meet the grading requirements of automotive products, and is sufficient to support the professional production supply chain for current and future business development. Stocking and backup operations are strengthened by management in every step of the process, from client requirements, product development, and material selection to production and delivery, to ensure that clients' requirements are met. Longsys has realized the modularization of memory chip architecture, firmware development, hardware design, packaging technology, and system testing. This enables clients' ideas to be brought to life and applied to storage products without delay. The brand offers several technical customizations for its automotive storage products, such as mirror dash cams and automotive memory that is water-proof, dust-proof and shock-proof, among other innovative applications. It can therefore provide services with differentiated customization for different automotive clients. A wide range of customization options are available for automotive storage products, including but not limited to chip appearance, software partitioning, pSLC, and encryption. These tailored services offer clients several advantages including easy application, short production cycle, and controllable cost. FORESEE automotive eMMC (Grade 2) is primarily used in dash cam, in-vehicle digital video recorder (DVR), car entertainment system, mirror dash cam, T-box, advanced driver-assistance system (ADAS), panoramic camera, central control navigation system, electric vehicle charging infrastructure (EVCI), and other terminal devices. After years of technology accumulation and brand development, Longsys has won Excellent Supplier and many other honorary titles from Lenovo, Sangfor, ZTE, Tsinghua Tongfang, and other companies. It has also won Best Partner and other titles from Samsung Electronics, Western Digital (SanDisk), Silicon Motion Technology, Yangtze Memory, and other upstream manufacturers. As a comprehensive semiconductor storage company, Longsys adheres to the business bottom lines of brand, quality, compliance, and value, and continuously consolidates its market position. According to the rankings of eMMC embedded storage market share in 2020 published by ChinaFlashMarket (CFM), Longsys's eMMC products ranked seventh in the world in terms of market share. Omdia (IHS Markit) data shows that from January to September 2021, Lexar memory cards and flash drives came second and third respectively in the global market share rankings. Longsys focuses on the quality improvement and innovation of storage products, and continuously invests in R&D resources. At present, R&D personnel account for more than 50% of the company's total employees. The company has also obtained 438 patent authorizations (as of December 31, 2021), finished 4 integrated circuit layout designs, and accumulated a series of core technical capabilities in continuous innovation, firmware development, memory chip testing, and integrated packaging design. Relying on comprehensive technical strength accumulated over many years, the company has formed rich and complete product lines covering various application scenarios for semiconductor memory, with product performance and quality widely recognized by industry customers and the consumer goods market. Since 2017, Longsys has gradually upgraded from a technology-based product company to a technology-based brand company, on the solid foundation of industry storage market exploration. With technological innovation and product quality, the company continues to expand the influence of the FORESEE brand in the industry market, develop industrial and automotive embedded product, micro-storage product, SSD product and DRAM product, and form integrated solution capabilities for storage. In 2017, the company acquired the international high-end consumer storage brand Lexar, to comprehensively upgrade its personal data storage development strategy for mobile storage, SSD, memory module, and network storage, and make efforts in the high-end consumer storage market. At this stage, with the continuously increasing international influence of the FORESEE and Lexar brands, Longsys has formed a mechanism for continuous transformation of technological advantages into brand advantages, and built a comprehensive and rich product system to continuously highlight brand advantages.

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China Micro Semicon(Shenzhen)Co.,Limited

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GigaDevice Semiconductor Inc.

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GigaDevice Semiconductor Inc. is a global leading fabless supplier. The company was founded in April 2005 and headquartered in Beijing, China, with branch offices in many countries and regions around the world, providing local support at customers’ fingertips. Committed to building a complete ecosystem with three major product lines—memory, MCU and sensor—as the core driving force, GigaDevice can provide solutions for a broad set of applications in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice is currently ranked No. 1 SPI NOR FLASH® supplier in China and No. 3 in the world with accumulated shipments nearly 16 billion since its inception. GigaDevice GD32 MCU, a leader in China's high performance 32-bit general purpose microcontroller market, has more than 2,000 customers, with more than 1 billion units shipped, and over 450 part numbers from 35 family series in a variety of applications. In addition, GigaDevice delivers touchscreen controller sensor and fingerprint sensor to world-renowned mobile makers around the globe. It is currently one of the only two optical fingerprint sensor suppliers in China with mass production capability, with its touchscreen controller sensor ranked No. 4, and the optical fingerprint sensor ranked No. 3 in the world. GigaDevice provides a complete portfolio of SPI NOR Flash with capacity ranging from 512Kb to 2Gb, available in 1.8V, 3.3V and wide voltage ranges. It delivers multiple product series featuring high performance, low power, high reliability and small package to address the requirements of diﬀerent application markets. For example, GD25LE series features the industry’s lowest power consumption, as low as 0.2uA on sleep mode while only 5mA on read mode at a high frequency of 133MHz – its great energy-saving performance can significantly extends the standby time of battery-powered applications; WLCSP (Wafer-Level Chip Scale Package) products, its length and width dimensions can be within 1mm while the thickness can be 0.25 mm, allowing designer to embrace innovative solutions in smaller devices; Quad I/O GD25LT/GD55LT and Octal I/O, xSPI compatible GD25LX/GD55LX series with 400MB/s data throughput, provide high-speed Quad and JEDEC xSPI- & Xccela-compliant Octal SPI NOR Flash with various density from 512Mb to 2Gb, which are developed for applications in automotive, AI, IoT and other related areas that require large-capacity storage, high reliability & ultra-high-speed data throughput. For NAND Flash, GigaDevice has the proven process of 38nm node and advanced process of 24nm to provide the mainstream products with the density ranging from 1Gb to 8Gb. NAND product series are available in 1.8V and 3.3V with both traditional parallel and new SPI interfaces supported, enabling comprehensive solutions for embedded applications that require large capacity and high reliability of code storage. As one of the major product lines of GigaDevice, GD32 MCU, the largest ARM MCU family in China, is the forerunner in the high-performance general-purpose MCU market. Being the first to introduce its Arm® Cortex®-M3, Cortex®-M4, Cortex®-M23, Cortex®-M33 core and RISC-V general-purpose MCU product series, GD32 MCU has become the mainstream choice in China's 32-bit general purpose MCU market. All GD32 MCU product is compatible with each other in terms of software/hardware, pin, package, while fully applicable from entry-level, mainstream, to high-performance series that meet embedded control needs and beyond, with add-value of cost-effectiveness. GD32 is building an "MCU one-stop shop" to provide users with the most comprehensive system-level products and solutions. GigaDevice will continue to design and innovate the best-in-class GD32 MCU products and will strengthen the MCU ecosystem to anticipate what the future holds. Sensing is taking a crucial role by closing the gap between the physical and the digital, in the increasingly connected world. Adding intelligence to HMI (Human-Machine Interface) and passion to innovation, GigaDevice aim to enrich people’s lives. We create exciting innovations that enable our customers in the consumer, IoT, wearable and other technology sectors maintain their competitive edge. GigaDevice's GD30 analog solutions already have four product lines, incl. power management unit, motor driver, high-performance power IC and lithium battery management, which can be widely used in TWS headset charging compartment, motor drive, new energy battery charge & discharge management, Wi-Fi communication scenarios such as facilities and equipment, and are widely recognized by various manufacturers. Co-work with GD32 MCU, GD30 products have developed a variety of solutions, which can form effective synergy in key vertical markets that have been deeply cultivated and newly tapped. In 2021, GigaDevice has achieved revenue of 8.51 billion RMB, an increase of 89.25% compared with 2020. GigaDevice attaches great importance to technological innovation and continues to increase R&D investment. In 2021, the company’s R&D investment reached 940 million RMB, which is 11.05% of the revenue, and an increase of 73.77% compared with 2020, ensuring technological advancement. While launching a comprehensive series product with technical and cost advantages, GigaDevice has also accumulated large numbers of intellectual property patents. In 2021, 136 patents have been applied and 136 new patents have been authorized. At the end of 2020, the company has a total of 834 authorized patents.

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RIGOL TECHNOLOGIES CO., LTD.

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Founded in 1998, RIGOL has become a well-known high-tech enterprise specializing in the R&D, production, sales and service of general electronic test and measurement instruments. Its main products include oscilloscopes, waveform generators, spectrum analyzers, RF signal generators, DC power supplies, DC electronic loads, multimeters and data acquisitions, etc. RIGOL is currently the only Chinese enterprise equipped with self-developed digital oscilloscope core chipset and successfully realized product industrialization. The company has successfully listed on Shanghai Stock Exchange (SSE) STAR Market on April 2022. In recent years, RIGOL has developed rapidly, with a revenue growth of nearly 37% in 2021. Headquartered in Suzhou, RIGOL has 3 R&D centers in Beijing, Suzhou and Shanghai, and established overseas subsidiaries in Europe, the United States, Japan and Singapore. Its business covers more than 90 countries and regions and has won high recognition from many well-known customers. As of June 30, 2021, RIGOL has 386 authorized patents, including 346 invention patents, and has been listed in the Top 500 Chinese Enterprise patents in 2019 and 2020. RIGOL has won more than 60 awards, obtained the membership of international Bus LXI Alliance, CNAS certification laboratory and many other qualifications, participated in 1 national standard, led the drafting and formulation of 3 industry general specifications, and undertook 10 national and provincial projects including "National Torch Plan". RIGOL takes general electronic test and measurement instruments and their solutions as the core, providing scientific research, product development and manufacturing test and measurement guarantee for education and scientific research, industrial production, communication industry, transportation and energy, consumer electronics and other industries. The most influential products of RIGOL in the past 12 months are DS70000 series high-end digital oscilloscope and DG70000 series arbitrary waveform generator. 1、DS70000 series is the seventh-generation digital oscilloscope independently developed by RIGOL, giving full play to the excellent performance of the oscilloscope dedicated chipset "Phoenix" which is independently designed by RIGOL, to achieve a maximum 20GSa/s sampling rate and 5GHz real-time bandwidth. Based on the new generation technology platform UltraVision III, DS70000 has a maximum refresh rate of 1,000,000 wfm/s and supports 8bit~16bit variable resolution. The embedded RIGOL real-time spectrum analysis technology platform, UltraReal, enables the product to achieve FFT rate of 10,000/s. In addition, DS70000 also provides high-speed serial bus signal integrity measurement and protocol decoding analysis, bringing users a reliable measurement verification function, and high-quality user experience is ensured through the use of high-definition intelligent control feedback keyboard and wear-free and long-life photoelectric encoder. 2. DG70000 series is an industry-leading high performance arbitrary waveform generator, with a maximum sampling rate of 12GSA /s, 5GHz analog bandwidth, 16bit vertical resolution. With -70dBC spurious-free dynamic range and a single channel of up to 4G sample points, DG70000 provides users with clearer and purer signal. DG70000 supports to create up to 16384 advanced sequences, which can define a variety of complex waveform outputs. It can be cascaded to 224 channels with an interchannel delay of as low as 10ps, and it can directly synthesize RF signals up to 5GHz, and the real-time modulation bandwidth is up to 1.5GHz. DG70000 supports fast frequency modulation, and the hop interval is as low as 128ns. Using RIGOL’s waveform synthesis technique, SIFI III, DG70000 can generate arbitrary waveforms point by point, and restore the signal without distortion, and the random jitter is as low as 350fs. The product can meet the complex testing and diversified needs of application fields such as high-speed digital system design, quantum communication, Internet of Things (IoT), automotive bus, intelligent manufacturing, education and scientific research. With the launch of new products based on the StationMax® platform, RIGOL will gain huge blue ocean space in the context of national strategy of new infrastructure and localization. Products based on this platform will be able to meet the needs of efficient testing applications of different customers in industrial electronics, consumer electronics, communications and radio frequency, education and scientific research and other industries. R&D Project：In the past year, RIGOL has completed several product R&D projects including the new model of DP800 series, and has acquired a large number of technological accumulation and technological breakthroughs. In 2021, RIGOL upgraded the bandwidth of DS70000 series digital oscilloscope to 5GHz, which made China become the third country in the world to master the core technology of high-bandwidth oscilloscope. Product and Brand Promotion：In 2021, RIGOL participated in many large-scale exhibitions around the world, and actively held and participated in various industrial seminars to promote product and brand communication. Meanwhile, the continuous operation of online media such as Wechat, Bilibili and Zhihu, as well as overseas platforms such as LinkedIn, Twitter and YouTube, has also brought RIGOL sustained and rapid growth of brand sound and brand influence. Marketing Positioning：Since its establishment, RIGOL has been focusing on the development and breakthrough of cutting-edge technology in the field of general test and measurement instruments. With the mission of "Enabling Technology Exploration, Empowering Possibilities and More", the company has become a well-known high-tech enterprise in the field of test and measurement Industry. RIGOL takes solutions as the center, with chip, hardware, algorithm and software as the core foundation, to achieve independent product development. RIGOL focuses on the four golden circuits of semiconductor, communication, new energy and quantum, and focuses on solving the test and measurement challenges of industrial customers. Its own chipset is an important basic guarantee for RIGOL solutions. Financial Performance：In recent years, RIGOL's operating revenue has continued to grow, indicating the company's good profitability and future potential. In 2021, its operating revenue is 48,394.18 million RMB, with a year-on-year growth of 36.63%. The sales proportion of products equipped with self-developed chips in the total sales of digital oscilloscopes increased from 47.70% in 2020 to 54.54% in 2021. On April 8, 2022, RIGOL was officially listed on the STAR Market of the Shanghai Stock Exchange. Customer Service：RIGOL always focuses on the value of "customer success", defines competitive service strategies and service products according to customer needs, and provides excellent experience for customers by constructing customer service network and system. At present, the company has established overseas subsidiaries in the United States, Europe, Japan and Singapore, and achieved localized services and support for the main target markets around the world. Employment Promotion：With the rapid development of RIGOL, the demand for social and campus recruitment increases, providing hundreds of jobs every year; In 2018, RIGOL established RIGOL Academy, which is committed to cultivating elite talents for the test and measurement industry. In 2021, RIGOL Academy has offered 38 courses to help employees develop and grow.

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Dosilicon Co., Ltd.

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As a Fabless company, Dosilicon focuses on the design, production and sales of NAND Flash /NOR Flash /DRAM carrying independent intellectual property. Currently, Dosilicon is one of few memory companies who can provide NAND / NOR / DRAM design process and product scheme at the same time in China. Dosilicon's product line has been continuously enriched, the introduction of customers has been completed, and the products have been gradually in large quantities. Therefore, the sales scale has been expanded. At the same time, with the continuous recovery of the market and the rise of product prices, Dosilicon achieved an operating revenue of 1134.813 million yuan in 2021, an increase of 44.62% year-on-year With strong R & D capability and stable supply chain system, products have entered many well-known customers at home and abroad, and are widely used in 5G communication, IOT terminals, consumer electronics, industrial , automotive electronic products and other fields. With its outstanding performance, it has been certified by many well-known platform manufacturers. At the same time, it has entered the supply chain system of many well-known customers at home and abroad, and is widely used in terminal products such as communication equipment, security monitoring, wearable devices, mobile terminals, etc. At the same time, the company can provide customized design services and overall solutions for NAND, NOR, DRAM and other memory chips according to customers' specific needs, helping customers reduce product development time and cost and improve product development efficiency. In the process of customized design for customers, we constantly understand the functional requirements of the market for products, receive customers' feedback on terminal products, repeatedly verify and polish existing technologies, and establish a technology development cycle of "R & D - Transformation - innovation" to further enhance technical capabilities. As a leading memory chip design company in the mainland, Dosilicon continues to innovate and lead the memory chip industry in the mainland, focuses on domestic advanced processes, and has established a strategic cooperation relationship with SMIC, the largest wafer foundry in the mainland. The two sides have carried out in-depth technical cooperation for many years on the characteristic . Based in China and facing the world, Dosilicon is deeply involved in the world's largest storage chip application market, accurately perceives the rapidly changing market trend, closely follows the localization wave of storage chips, quickly responds to customers' personalized needs by virtue of all-round technical reserves from chips, application circuits to system platforms, and provides targeted complete memory solutions including NAND, NOR and DRAM. After years of experience accumulation and technology upgrading, Dosilicon has created a variety of storage chip products characterized by low power consumption and high reliability. In 2021, Dosilicon made an initial public offering and was listed on the science and innovation board, simultaneously enhancing the influence of local brands, and maintaining the Performance Leadership and competitive advantage of existing products through continuous R & D innovation, process upgrading and performance iteration; Relying on the advantages of multiple storage products, we will increase the layout and development of emerging fields such as the Internet of things, intelligent hardware applications, automotive electronics, medical health, etc., improve the market share of the company's products, and simultaneously improve the ability of customized products and services; Insist on taking storage products as the core, expand intelligent extension and application-oriented, develop characteristic storage products, and improve profit space through differentiation; Continue to develop high-quality domestic customers and serve important customers in the industry, start to expand overseas markets in a planned and step-by-step manner, and improve the company's market position and influence in Europe and the United States. The design of the company's projects under research, including 24nm NAND and 48nm NOR, are China's leading processes, which has achieved a technological breakthrough in domestic flash memory chips. At the same time, the lower process 1xnm product series, vehicle specification product series and LPDDR4x products are in the steady development stage. Dosilicon also has an excellent customer service team. In the process of customized design for customers, experienced on-site technical engineers and customer quality engineers can promptly deal with relevant problems encountered by customers when using products. Relevant problems will also be fed back to all links of product R & D and production at the first time, forming a good processing closed loop internally. The continuously improved quality control system promotes the continuous improvement of the company's products. Dosilicon pays attention to the construction of R & D echelons, who establishes a human resources system matching the business strategy, vigorously expands the talent team through internal training, joint training, talent introduction and other means, continuously replenishes fresh blood and continuously expands the R & D team based on the R & D framework, actively promotes the mechanism of bringing the old with the new through compensated rewards, builds a comprehensive training system, and speeds up the integration of the new. Continuously improve the knowledge structure, age structure and professional structure of employees, and establish a talent echelon that meets the needs of the rapid development of the enterprise. In conclusion, Dosilicon performed well in 2021, with rapid growth in operating performance and continuous improvement in profitability. In the case of global capacity shortage, the company actively responded, continued to promote diversified and multi-channel layout, and provided capacity guarantee for performance growth. In 2021,Dosilicon realized an operating revenue of 1.134 billion yuan, an increase of 44.62% over the same period of the previous year; The net profit attributable to the shareholders of the listed company was 262million yuan, an increase of 1240.27% over the same period of the previous year; The net profit attributable to the shareholders of the listed company after deducting non recurring profits and losses was RMB 255million, an increase of 1354.24% over the same period of the previous year.

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BYD SEMICONDUCTOR COMPANY LIMITED

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Shenzhen BASiC Semiconductor LTD.

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NVIDIA

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Since its founding in 1993, NVIDIA has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics and ignited the era of modern AI. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.  NVIDIA is built like a computing stack or neural network—in four layers: hardware, system software, platform software, and applications. Each layer is open to computer makers, service providers, and developers to integrate into their offerings however best for them. NVIDIA has shipped more than a billion CUDA-based GPUs. More than 3 million developers and 10,000 startups create thousands of applications for accelerated computing.  NVIDIA is becoming the new engine for the world’s AI infrastructure and providing the full stack of AI software. NVIDIA AI brings together skills like computer vision, conversational AI, recommender systems, AI avatars, robotics, and autonomous vehicles. NVIDIA’s work in AI is transforming 100 trillion dollars’ worth of industries, from gaming to healthcare to transportation, and profoundly impacting society.  In FY22, full year revenue was a record $26.91 billion, up 61%.   At GTC in March 2022, NVIDIA has unveiled several new chips, including the Hopper GPU architecture and H100 GPUs, AI and accelerated computing software, and powerful data center systems to help enterprises gradually transform into intelligent manufacturers. Built on the NVIDIA Omniverse real-time 3D collaboration and simulation platform, AI will usher in the next wave of development, and will be prosperous in various fields. Currently, NVIDIA is releasing new products across all four layers of the stack, including hardware, system software and libraries, software platform NVIDIA HPX, NVIDIA AI and NVIDIA Omniverse, AI and robotics application framework.  The NVIDIA Hopper architecture will power the next wave of AI data centers. The first Hopper-based GPU, the NVIDIA H100, comes packed with 80 billion transistors, and delivers an order of magnitude performance leap over its predecessor. The new chip, NVIDIA H100, will be the "new engine of the global AI infrastructure".  NVIDIA has also launched a variety of new Hopper GPU-based AI supercomputers-DGX H100, H100 DGX POD and DGX SuperPOD, which committed to building the world's most powerful AI systems.  NVIDIA Grace CPU Superchip with 144 CPU cores will be the ideal CPU for AI factories.  NVIDIA NVLink will be coming to all future NVIDIA chips—CPUs, GPUs, DPUs, and SOCs. NVLink is open for customers and partners to build custom processors.  NVIDIA AI platform is constantly being updated and making significant achievements, including the Triton inference server, the NeMo Megatron 0.9 framework for training large language models, and the Maxine framework for audio and video quality enhancement. NVIDIA AI platform includes NVIDIA AI Enterprise 2.0, a suite of end-to-end, cloud-native AI and data analytics tools and frameworks optimized and certified by NVIDIA, and now supports all major data center and cloud platforms.  The NVIDIA OVX computing system for driving large-scale digital twins is designed to run complex digital twin simulations in NVIDIA Omniverse, a real-time physical-level accurate world simulation and 3D design collaboration platform. The OVX system combines high-performance GPU-accelerated computing, graphics processing and AI with high-speed storage access, low-latency networking, and accurate timing to deliver the performance needed to create realistic digital twins.  NVIDIA's DRIVE Orin autonomous driving car computing platform begins mass production in March 2022. The new DRIVE Hyperion architecture, based on the Atlan computing platform, is designed to scale across generations, increasing sensor data processing performance to further enhance safety and extending to fully autonomous driving operations.   R&D: NVIDIA's research in AI is driving transformation across a wide range of industries and making a profound impact on society. These industries include gaming, healthcare and transportation, with a total value of $100 trillion. NVIDIA Earth-2 AI digital twin supercomputer is being used to predict future climate. With the help of NVIDIA accelerated computing, three physicists were awarded the Nobel Prize in Physics for their groundbreaking experiments and first detection of gravitational waves. NVIDIA accelerated computing enabled researchers to set a Guinness World Record for the "Fastest DNA Sequencing Technology": 5 hours and 2 minutes. Built to support interdisciplinary workflows, NVIDIA Clara Discovery combines the power of accelerated computing, AI and machine learning to empower the entire drug development process. NVIDIA Omniverse is profoundly changing the way we create and develop as individuals and collaborate as a team, bringing more creative possibilities for 3D creators, developers and enterprises.  Market Position: NVIDIA is built like a computing stack or neural network—in four layers: hardware, system software, platform software, and applications. Each layer is open to computer makers, service providers, and developers to integrate into their offerings however best for them.  Engineer Community Contribution: NVIDIA has been in close connection with the engineer community for more than 20 years. NVIDIA Developer Community is a community dedicated to "helping to change the world", helping registered developers to obtain the latest technologies, development tools, access to free SDKs, technical documents, to accelerate the development of artificial intelligence, deep learning, accelerated computing, professional graphics applications in key technical fields. NVIDIA has shipped more than a billion CUDA-based GPUs. More than 3 million developers and 10,000 startups create thousands of applications for accelerated computing.  Social Recognition: NVIDIA is committed to advancing human technology and providing technical support to the communities where people work and live. NVIDIA Wins Glassdoor's "Best Places to Work”, Fortune's "Top 100 Best Companies to Work For", Fast Company’s "Most Innovative Company", MIT Technology Review’s “Global Top 50 Smartest Companies” and other awards.  Financial Performance: For fiscal 2022, revenue was a record $26.91 billion, up 61% from the previous fiscal year, with growth across the board in gaming, data center, professional vision, automotive and robotics.

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Texas Instruments

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Allwinner Technology CO., Ltd.

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Shenzhen Hangshun Chip Technology Developmemt CO.Ltd

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OmniVision

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OmniVision Group is a global leading IC design company in China. With worldwide Research & Development centers and business networks, OmniVision's headquarter is in Shanghai. By delivering Sensor Solutions, Analog Solutions as well as Touch and Display Solutions, OmniVision Group is committed to helping customers in mobile, security, automotive, wearable devices, loT, computing, consumer electronics, industry and medical to solve technical challenges and meeting increasing demands for artificial intelligence (Al) and green energy. “Empower the Sensing by Technology." OmniVision Group aspires to fully improve its global strategic presence, leveraging the complementary advantages, resource sharing and synergy of continuous innovation, high synergy for supply chains and clients and diversified talents to enable scale effect. Adhering to technological innovation to improve customers’ satisfaction and stickiness, OmniVision Group will continuously provide superior products and service to create greater value for our global customers. In 2021, OmniVision Group exceeded 12.3 billion in annual shipments, accumulated more than 4,400 authorized patents and achieved 24.104 billion yuan in turnover. OMNIVISION Leads Pixel Shrink Race with the Development of World’s Smallest 0.56-micron Pixel With a pixel size now smaller than the wavelength of red light, OMNIVISION’s R&D team has validated that pixel shrink is no longer limited by the wavelength of light. The pixel is based on OMNIVISION’s PureCel®Plus-S stacking technology, and deep photodiode technology is applied to carefully embed the photodiode deeper into the silicon. These advanced technologies have enabled OMNIVISION to develop the smallest pixel, allowing for higher resolutions in the same optical format, and further enabling the image sensor to have more ISP functions, lower power consumption and faster read out speed. The technology achieved the world’s smallest 0.56-µm pixel, with uncompromising high quantum efficiency (QE) performance, excellent quad phase detection (QPD) autofocus capabilities and low power consumption. This ultra-small pixel technology will address the increasing demand for high-resolution and small pixel pitch image sensors for multi-camera. The first 0.56µm pixel die will be implemented in 200MP image sensors for smartphones OmniVision has the advantages of R&D ability, and achieved significant R&D results in 2021, for example: - Mobile: Following OV64B, OmniVision introduced 50 megapixel, 60 megapixel, and 200 megapixel products. - Automotive: OmniVision launched a number of new products from 3 megapixel to 8 megapixel. The HALE (HDR and LFM engine) algorithm provides both HDR and LFM function, and DeepWell™ dual conversion gain technology significantly reduces motion artifacts. - Healthcare: OmniVisin unveiled the first 8-megapixel resolution sensor for disposable and reusable endoscopes, innovatively introducing Nyxel® near-infrared technology to the healthcare industry. - Security: OmniVision’s OS02H10 integrates Nyxel® and PureCel®Plus technologies, bringing high quality NIR and improved performance in lowlight conditions. Nyxel® technology brings excellent quantum efficiency to OS02H10. This enables it to achieve better shooting effect and longer shooting distance at both 850 nm and 940 nm NIR wavelengths. Overall, in the field of CMOS image sensor, OmniVision is one of the earliest companies engaged in CMOS image sensor design, development and sales, and has established brand influence and market awareness worldwide. OmniVision is one of the top three suppliers of CMOS image sensors in the world, has established long-term and stable relationships with downstream customers, and has a leading market share in a wide range of segmented application markets. In the field of touch control and display chips, OmniVision’s TDDI Solutions cover the mainstream Android smartphone at home and abroad, and its market share is rapidly increasing. OminiVision’s Analog Solutions has also achieved a wide layout in mobile, security, IoT, with the accumulation of technology in related fields and cost-effective advantages. OmniVision’s TVS and MOSFET were honored as Shanghai Top 100 High-tech Projects for many times.

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Silicon Motion, Inc.

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"Silicon Motion Technology Corporation (NasdaqGS: SIMO) is the global leader in developing NAND flash controllers for SSDs and other solid state storage devices. We have over 20 years of experience developing specialized processor ICs that manage NAND components and deliver market leading, high-performance storage solutions widely used in data centers, PCs, smartphones and commercial and industrial applications. We have one of the broadest portfolios of controller intellectual properties developed from our deep understanding of NAND characteristics, which enables us to design both unique, highly optimized configurable IC plus related firmware controller platforms and complete turnkey controller solutions. More NAND flash components, including current and up-coming generations of 3D flash produced by Kioxia, Micron, Samsung, SK Hynix, Solidigm, Western Digital and YMTC, are supported by Silicon Motion controllers than any other company. Our customers include NAND flash makers, module makers, hyperscalers and OEMs. We are the world's leading supplier of SSD controllers used in PCs and other client devices and leading merchant supplier of eMMC/UFS controllers used in smartphones and IoT devices. We also leverage our controller expertise to supply custom-designed high-performance Open-Channel data center SSDs to China's leading hyperscalers and customized small single-chip form factor SSDs for industrial, commercial and automotive applications. We market our controllers under the ""SMI"" brand, ""Shannon Systems"" for enterprise-grade SSDs and ""FerriSSD"", ""Ferri-eMMC"" and ""Ferri-UFS"" for industrial-grade single-chip SSDs and related modules. As electronics content and data grow exponentially in today's vehicle, automakers are now beginning to incorporate PCIe NVMe SSDs, which will be more widely implemented in the next few years. We've designed our latest automotive-grade PCIe NVMe SSD controllers from the ground up with PCIe Gen4 technology and innovative hardware features optimized for true Gen4 performance, low power consumption, and advanced error correction combined with data path and EMI protection. Using 12nm process technology for high throughput, lower power consumption, and rigorous data protection, our controllers provide ultra-high performance and reliability for automotive applications — including a cost-effective PCIe NVMe SSD solution for automotive storage. Ideal for automotive computing environments, we now offer controllers with built-in SR-IOV capability, delivering a direct, high-speed PCIe interface supporting up to eight virtual machines that are capable of fulfilling multiple requirements and functions. The idea of centralized architecture is to integrate all electronic systems into a centrally controlled platform, which requires a higher-end transmission system and various storage applications. When it comes to implementing virtualization in high-speed data networks with a PCIe bus, SR-IOV allows for greater software functionality and easier remote management — and it's capable of interfacing directly, at high speed and independently, to each virtual machine (VM) via a dedicated virtual function (VF) implemented in the SSD controller. This can only be delivered by PCIe SSDs, which can support future vehicles requiring implementation in a centralized architecture. Here are the competitive advantages our SSD controllers provide for the automotive industry: Data Path Protection • End-to-end data path protection • SRAM ECC for SRAM soft/hard errors TSMC Automotive Service Package • Tightened process control and scrap criteria • Documentation and failure analysis Extended Temperature and Voltage • -40°C to +85°C (Grade 3) • -40°C to +105°C (Grade 2) production test • High-voltage SRAM test Traceability • OTP controller die stores unique ID to trace back wafer map or wafer lot All of our automotive-grade flash products undergo rigorous testing to meet the qualifications that the industry and our customers demand, including AEC-Q100 compliance, ISO 26262, supplier chain certification by IATF 16949 certification, and ASPICE compliance SW development process. In addition, Silicon Motion provides product supply longevity to reduce costs for additional qualifications. The industry is rapidly transforming with technology driving innovation, automotive standards shaping requirements, and consumer preferences changing demands. Since the car on the road is now its own data center, the need for data storage has grown exponentially — and so has the role of NAND flash to support mission-critical functions in automotive applications and entertainment features. As electronic content becomes a larger and larger part of the vehicle, storage technologies employing NAND flash must be able to ensure optimized performance, reliability, and longevity. Silicon Motion provides dependable high-performance automotive-grade storage solutions, including controllers and single-chip solutions for in-vehicle infotainment, navigation, ADAS, DVR, and autonomous driving applications. With over 20 years of experience in developing specialized processor ICs that manage NAND components, our expertise delivers best-in-class automotive-grade storage solutions. All of our automotive-grade flash products undergo rigorous testing to meet the qualifications that the industry and our customers demand, including AEC-Q100 compliance, ISO 26262, supplier chain certification by IATF 16949 certification, and ASPICE compliance SW development process. In addition, Silicon Motion provides product supply longevity to reduce costs for additional qualifications.

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Leaguer MicroElectronics Corp.

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Shenzhen Powlicon Microelectronics Co.,LTD

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NOVOSENSE Microelectronics

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SHENZHEN SHICHUANGYI ELECTRONICS CO.,LTD

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Chengdu KSW Technologies Co.,Ltd.

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Chengdu KSW Technology Co., Ltd. is a high-tech enterprise focusing on the research and development of high-end wireless test simulation instruments and system solutions. It is a listed company on the Science and Technology Innovation Board of Shanghai Stock Exchange (stock code: 688283). Company focused on mobile communications, wireless networking, car networking, navigation and other fields, to provide high-end radio equipment performance, function testing simulation test instruments, such as wireless channel simulator, RF & microwave signal generator and vector signal analyzer, vector signal transceiver apparatus, telemetry remote control receiver machine and other test simulation instruments, and system solutions for various radio and electronics industries. In 2021, the company achieved revenue of 162.89 million yuan, a net profit of 50.72 million yuan, and a compound growth rate of revenue of 24.28% from 2019 to 2021. The company's products are widely used in domestic mobile communication operators and global equipment manufacturers, scientific research institutes, universities and laboratories, etc. The company's products and technologies have been widely recognized by the customers in wireless test and simulation. Our wireless channel simulator helps simulate the real complex environment, for large-scale network wireless ad-hoc network equipment, mobile communication 4 G / 5 G phased array base station and mobile phones, GPS/Beidou navigation equipment, simplifies the costs/ time consuming field test at lab, greatly accelerates the research and development process, reduced the cost and uncertainty of field test. As a quality evaluation instrument for mobile communication system, wireless networking equipment and navigation equipment, the company's wireless channel simulator accurately evaluates the performance of the manufacturer's equipment, and has been widely recognized by the tier one wireless equipment manufacturers and operators in terms of technology and service. With the continuous extension of the application field of the new generation of mobile communication technology, the gradual deepening of the application of complex electromagnetic environment simulation system in wireless research, and the increasing investment in the R&D of extended products in WIFI, vehicle radio application, emergency communication, etc., the diversity and complexity of various wireless communication simulation scenarios are increasing，that sheds the light for the future growth. In the past year, KSW continued focusing on the high-end radio test and simulation, and the market share of core products has steadily been increasing. Research and development investment continues increasing, actively deploys the multi-product line research and development strategy, including the wireless channel simulator applied in multi-scenario and MIMO, vector signal generator, spectrum analyzer, vector network analyzer, complex electromagnetic environment performance evaluation system technology and other projects of research work. Continue to enrich the company's high-end radio test simulation instrument product line, constantly improve product performance to match with the global leading products, build strong competitive advantages versus the local peers. The company aims to help users in wireless and electronics address the test and simulation challenges in product development, and gradually establishes the brand image of the company as a top “China-made” high-end wireless test and simulation instruments supplier. Our products are widely used in domestic mobile communication operators and global equipment manufacturers, scientific research institutes, universities and laboratories, etc. Our products and technologies have been widely recognized by customers in wireless test and simulation. The company was awarded "Excellent supplier" by China Mobile Research Institute. In terms of personnel construction, the company pays attention to the training of all kinds of talents needed in the field of radio simulation testing, and has established a stable R&D team with professional and technical capabilities, which can insight into market development needs and rapid productization. The technical staff of the team has now become a professional talent in the design of system architecture in the field of radio equipment test and simulation, algorithm research, core signal processing firmware design, RF microwave design, high performance digital circuit design, product structure design. In the process of rapid development, the company continues to provide a number of job opportunities for fresh college graduates and related engineers in various industries in China. At the same time, the company always takes employees as an important source of the company's core competitiveness, creates a good working and learning atmosphere for employees, a fair growth path, and a diverse and inclusive corporate culture, and establishes a reliable platform for the long-term development of employees. Relying on excellent quality, reliable performance, perfect after-sales service and fast response mechanism, Chengdu KSW Technologies Co., Ltd. helps customers to meet various testing challenges in the process of product development and accelerates technological innovation. The company always adheres to the enterprise spirit of "Driving high-quality development with technological innovation", and is committed to becoming the promoter of leading technology in the future.

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China Micro Semicon Co.,Limited

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Shenzhen Muxin technology Co., Ltd

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Canaan Inc.

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Canaan’s AI reasoning chip, the Kendryte K510, is equipped with a self-developed visual neural network accelerator (KPU2.0), Canaan’s proprietary computing data flow technology, and a computing array that integrates 3D dimension and multi-level storage structure. Through dynamic chip management and utilization of high-frequency data, the benefits are twofold: improved computing efficiency of the processor and reduced power consumption of the chip. These provides viable solutions to the storage and performance challenges currently plaguing conventional terminal AI chip design. Canaan is an industry pioneer when it comes to CPU design, deploying RISC-V instruction set (ISA) to develop its terminal SoCs. Specifically, the Kendryte K510 has a dual-core 64-bit RISC-V CPU and a digital signal processor (DSP) with up to 800Mhz frequency equipped, to support the growth of AI-related applications. The Kendryte K510 integrates the latest generation of image processing ISP in its visual subsystem design, supporting TOF depth camera access, 2D/3D noise reduction, wide dynamic range WDR, RGB & IR fusion, hardware 3A and other complete functions. TOF sensor solutions are also supported by our 3D ISP. Common chip applications include: AI IPC, drone aerial photography, professional photography, robots, AI STEAM, edge computing boxes and other scenarios.

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Unicmicro(Guangzhou)Co.,Ltd

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GUANGDONG DAPU TELECOM TECHNOLOGY CO., LTD

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XIAMEN PENGPAI MICROELECTRONICS CO.,LTD.

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HPMicro Semiconductor Co.,Ltd.

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KOWIN TECHNOLOGY CO.,LTD

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KOWIN is an important part of the semiconductor industry of KONKA Group. Company focuses on the research and development, design and sales of embedded memory chips, modules, mobile storage and other products. The main products cover eMMC, eMCP, ePOP, nMCP, UFS, LPDDR, DDR, SSD, PSSD, etc. Widely used in Intelligent Terminals, Smart Wearables, Smart Homes, HCI, Internet of Things, Industrial Control, WIT120, Automotive Electronics and other fields. With the advantages of high starting point, high quality and high efficiency, adhering to the core values of "integrity, reliability, efficiency, innovation and enterprising" and the business philosophy of "based on high quality, driving new technology", Kowin is committed to becoming an ultra-reliable storage module innovation solution provider, making storage more efficient, data more reliable, and building a Internet of Everything world. In June 2021, the DRAM product line was released. In January 2022, the UFS3.1 product line was released. In March 2022, the eMCP, ePOP, and nMCP product lines were released. In October 2021, a joint certification agreement was signed with Qualcomm. In November 2021, it passed the certification of the Guoke micro-platform. In December 2021, a joint laboratory was established with MediaTek In May 2022, eMCP products passed the Zhanrui platform certification. In 2021, since the launch of embedded memory chip, quickly recognized by the market, in many fields and the head of well-known enterprises to establish cooperation, such as Konka, Baidu, TCL, 360, Cultraview, Unionman, Changhong and so on. At present, the company has more than 100 customers in volume production, and there are more than 50 customers are doing test verification. In the future, Kowin will make great efforts in the dimensions of embedded memory chip technology innovation, product upgrade, industrial application, etc., and focus on "core" cohesion with all parties in the industry to boost the prosperity and development of China's semiconductor industry！

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RiVAI

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RiVAI is a RISC-V-based chip company that provides core processers to mid-to-high end market. The founder is one of the original researchers at UC Berkeley that developed RISC-V. The executive team consists of professionals with one of the strongest backgrounds in RISC-V and AI. Currently, over 85% of RiVAI team are R&D engineers who have many years of R&D experiences in semiconductor companies. The majority of the team are graduates of world-famous universities such as UC Berkeley, Stanford, and Carnegie Mellon. On June 20th 2022, RiVAI announced its high-performance RISC-V vector processors with its first successful application case in DSP. This DSP IP has been integrated and verified in the world’s giant company’s products and has mass-production-ready quality before it was introduced to the public. This recently announced products marked a technological breakthrough in the commercialized products and its readiness for mass production. In addition to its technical capabilities, RiVAI enjoys academic and industry resources from world-class universities, semiconductor and tech giant companies and RISC-V International. Developing locally designed and locally sourced chips are beneficial to the critical technology's supply chain security in China with RISC-V being the only viable ISA to achieve this end. RiVAI, as a local R&D team led by a co-developer of RISC-V, will be the leader of this technology advancement and production of made-in-China chips. RiVAI actively collaborates with the RISC-V International Open-source Laboratory at TBSI, to produce R&D talents in the field. With its distinctive advantages in RISC-V technologies and professional experiences, RiVAI is confident and determined to lead the construction of China’s RISC-V ecosystem and the development of China’s chip design technology.

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Shenzhen SlkorMicro Semicon Co.,Ltd.

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Hangzhou Nano-Core Chip Electronic Technology Co., LTD

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Tsingmicro

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Coarse-grained Reconfigurable Architecture（CGRA） is a new type of chip architecture technology, which can flexibly reconfigure hardware resources according to different application requirements. As the most promising future computing architecture, it is one of the disruptive technologies in the post-Moore era, and it is also a technological commanding height that countries are scrambling to seize. The US Defense Advanced Research Projects Agency proposed in 2017 that the core technology for the United States to maintain its leadership in the field of science and technology for the next two decades is reconfigurable computing. The work plan of the Ministry of Science and Technology shows that in the next 10-15 years, the national strategy will support the development of the integrated circuit industry, and CGRA will be listed first. CGRA has the following advantages:  On-demand instant reconfiguration, high energy efficiency, low power consumption.  It can be flexibly reconfigured according to algorithms and applications, suitable for various scenarios and applications, and has strong versatility  Reconfigurable and flexible application architecture reduces chip tape-out costs and chip costs.  Products have been widely used in smart security, financial payment, smart wear, smart robots, aerospace and other fields. The CGRA team of Tsingmicro has published nearly 200 related papers in international authoritative journals and top conferences, and has authorized more than 130 patents and inventions. The core technical indicators lead the world. Based on CGRA, the company has mass-produced 3 high-efficiency smart chips within 3 years, with a market share of over 60% in sub-sectors. It is the world's first CGRA chip company with the largest shipment volume.

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HOUMO.AI

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HOUMO.AI is the first domestic company dedicated to the large computing power chips based on Compute-In-Memory (CIM). Aiming at the "Memory Wall" problem and performance bottlenecks caused by the separation of computing units and memory in traditional AI computing chip architecture, HOUMO.AI has made a huge breakthrough of the chip performance and power-consumption bottleneck, taking advantages of the frontier CIM technology.HOUMO.AI provide chips high in computing-power, low in power-consumption, together with industrial solutions, which can be generally applied to edge-computing terminals such as unmanned vehicles 、generic robots，as well as cloud reasoning. In May 2022,Houmo AI’s first SRAM-based large computing power Compute-In-Memory (CIM) AI chip proves to work normally,and has completed a run-through of autonomous driving algorithm model. It is the first AI chip that adopts SRAM-based CIM structure design. The sample chip’s performance can be up to 20TOPS, and can be scalable to 200TOPS, with an energy efficiency ratio for the computing unit up to 20TOPS/W. In terms of the compatibility, Houmo AI’s large computing power CIM AI chip is well designed to adapt to the fast iteration of algorithms, as it supports mainstream algorithms and custom operators. Backed by optimization and innovation on memory components and structures, the unit computing power of chips can be scaled up to 1000TOPS. HOUMO.AI aims to use subversive technology to create AI chips with "Tenfold Effect" that can meet the needs of super computing power in artificial intelligence and change the world with infinite computing power.

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LINEARIN TECHNOLOGY CORPORATION

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KUNLUNXIN（Beijing）Technology Co.Ltd

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GuangDong Leapfive Technology CO.,Ltd.

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Witmem

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Witmem is a leading computing-in-memory chip enterprise in worldwide. Founded in 2017, Witmem focuses on the field of computing-in-memory chip, innovatively uses Flash memory to complete the storage and operation of neural networks, solves the problem of AI's memory wall. In January 2022, the world's first computing-in-memory SoC chip WTM2101 launched by Witmem realized mass production. Which means Witmem had successfully explored and accumulated experience in material selection, design, process and other aspects during the mass production, creating a successful case for the global computing-in-memory chip mass production. WTM2101 chip can perform large-scale deep learning operations using microwatt to milliwatt power consumption, which is mainly used in the intelligent voice, intelligent health and lightweight vision markets.

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Anhui Listenai CO.,LTD.

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As an industry-leading intelligent terminal system level (SoC) chip design company, Listenai technology has established an industry-leading chip design team, as well as an experienced AI algorithm team. Its core capability is to deeply couple the independent and leading chip design with the industry-leading artificial intelligence algorithm, so as to achieve the integration of software and hardware to create a single chip solution with the highest cost performance, and promote the rapid and large-scale development of the era of internet of everything. In 2021, the company launched a new generation of terminal intelligent SoC chip for the AIoT field, focusing on intelligent voice processing and taking into account image and visual processing. It has the advantages of strong AI coupling, high integration, high computing power and low power consumption. It adopts a multi-core heterogeneous architecture, integrating ARM Star MCU, HiFi4 DSP, and the AI neural network processing core NPU newly designed by Listenai, with a computing power of 128GOPS. It also adopts key technologies such as circuit design of special chip for multi-level perceptual AI processing and joint design of "chip" and "algorithm". It has become a special chip for artificial intelligence in many fields such as home appliances, office education, consumer electronics and intelligent vehicles. At the same time of designing chips, Listenai technology has built an all-round chip ecosystem, including full link processing tools and underlying systems. It has created hundreds of AI scenario algorithms on the edge, which can effectively solve the core pain points of development in the field of the Internet of things, such as fragmentation and difficulty in development, and fully promote the development and ecological construction of terminal intelligent hardware.

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Jiangsu Runic Technology Co., Ltd.

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C&B ELECTRONICS (SHENZHEN) CO., LTD.

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With the development of electric vehicles and industrial energy storage, current sensors based on shunt have been recognized by more and more vehicle manufacturers and battery manufacturers. High precision current sensors play a crucial role in improving the range of BEV and HEV, and also play a key role in the accurate electricity estimation for energy storage power stations and DC charging piles. C&B Electronics Shenzhen Co.,Ltd. owns the CB series high-precision current sensor with complete independent IP. After years of technical accumulation, a complete set of mathematical models for current sensing based on independently developed shunts is developed. Take CB350 as an example, which has automotive grade and industrial grade, and has superior overcurrent sensing capability with high precision current sensing capability, with the following characteristics: (1) CB350 has extremely high precision current sensing mathematical model, which brings great convenience to the update of products, and can quickly correspond to the various needs of the market. (2) The product is developed on a common platform and has strong adaptability. No matter automotive or industrial grade, the CB350 requires no changes to hardware or housing, just simple changes in accordance with customer requirements. (3) CB series has self-developed fully automatic production line, which can complete the production with less labor. The production rate can be as high as 45 seconds per piece for product production off-line calibration and re-inspection, which greatly saves labor cost and guarantees superior production capacity. (4)The modular design of CB series automatic production line can be quickly replicated and expanded according to market and customer needs.

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SHENZHEN ICM MICROELECTRONICS CO.,LTD.

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Geehy Semiconductor Co., Ltd.

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Introduction of new products of Geehy in the past year： In 2022, the APM32F103RCT7 / APM32F072RBT7 automotive grade MCU launched by Geehy passed the AEC-Q100 automotive grade certification by virtue of low power consumption, high performance, high integration, high reliability and other product performance as well as strong environmental adaptability and anti-interference,It can be widely used in the core application fields of automobile such as body control, safety system, intelligent cockpit and power system, which can help to ease the tight supply of automobile electronic chips and accelerate the development and innovation of domestic automobile electrification, intelligence and digitization. The latest high-performance & high security APM32F405 / 415 Series MCU launched by Geehy takes into account high computing, high real-time and ease of use, conforms to the industrial enhanced level high reliability standard, supports a variety of international and national security encryption algorithms, has stable performance and excellent quality, and can achieve an effective breakthrough in the core key chips in the high-end industrial control field. Core technology and innovation capability: Geehy is one of the few companies with secure embedded eSE chip design technology in China. The chip technology ensures the safety and stability of the data information and equipment of the core key nodes of the Internet of things. Geehy security embedded ese chip design technology adopts special security processor, supports multi-layer combined protection mechanism such as physical circuit, cryptographic algorithm and system, and can realize hardware level security protection of multi bit integration; At the same time, it breaks through the core IP authorization constraint and solves the separation constraint between the application system and the security chip, so that a single chip has security, master control and other customized functions at the same time, which can effectively resist the Internet of things security threats such as side channel attacks, remote software attacks, physical attacks, and fault injection attacks.

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Zhejiang Starshine Semiconductor Co., Ltd.

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1) Technical advantages The technical team of Starshine is top-notch in China, and has many years of experience in filter research and development in the field of filters. The academic background and industrial experience are top-notch in China, and have rich experience in theoretical foundation, design, simulation, and technology. In terms of RF modules, the R&D team has a high academic level and has the most cutting-edge technical experience in the world. Our RF module team has the highest domestic level. 2) Customer resource advantage Starshine has obtained strategic investment from 4 customers of Huaqin, Longcheer, Tinno and Yiqing Group, and the 4 customers have given strong support to the company. 3) Product advantages Starshine also has the research and development capabilities of SAW, TC-SAW, BAW and RF modules. The RF product line is complete, and the combination of high, medium and low-end products is conducive to the company's market development and differentiated competition.

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Newsight Imaging

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Newsight Imaging is an Israeli semiconductor startup founded in 2016 with the goal of making 3D technology accessible for mass market applications across many industries. Newsight is a designer, developer, and manufacturer of advanced 3D CMOS sensor chips and spectral sensors – from chip to full sensing unit. Newsight develops advanced imaging sensor chips and solutions for two business units: Machine vision and Spectral Analysis. One small sensor serves countless applications. From Automotive, Industry 4.0, Smart City & Robotics to Water Safety & Healthcare. Newsight’s unique combination of great performance and attractive price is granting the company growing recognition as one of the leading companies to watch in the semiconductor industry. For example, the company was awarded the Frost and Sullivan 2022 Leadership Award for the leading European automotive sensor category and was selected as one of the 100 startups to follow in 2022 by EETimes Magazine. Since its incorporation, the company has released 5 sensors to the market and is expected to release 2 additional sensors in 2022. The Company has over 50 employees working under the 2 business units, of whom more than 50% are talented females. The R&D team is composed of top industry electrical and optical engineers, algorithmic engineers as well as other talents that take part in the creation and implementation of our technology. The qualities of our chips, especially our flexibility and pricing, help us gain engagement and business opportunities from many verticals and applications that benefit from our solutions. Under our machine vision business unit, we develop, design, and manufacture 3D sensors that are already being used in several applications. The company’s unique enhanced Time of Flight (eTOF™️) technology enhances the short distance iTOF and provides accurate depth sensing for longer distances even outdoors. Newsight’s eTOF™ patented technology allows unparalleled distance measurement with less than 1% error rate. In the automotive sector, we have active collaboration with a big headlight manufacturer, ZKW, to develop smart headlights for major European brands. The solution is already integrated into an Audi demo car, expected to be seen in vehicles on the road in the next 2 years. In Smart Manufacturing, we recently signed a commercial agreement for the purchase of 100,000 sensors with SSZN, a leader in developing smart industry 4.0 solutions. Under Newsight’s Spectral business unit, we create unique spectral sensing sensors that enable lab-quality analysis, available in the palm of your hands. The technology has resulted in the launching of 2 JV's based on Newsight's Technology, both with highly respected governmental companies. The first JV, called Virusight, was launched with Sheba medical center, named one of the top 10 hospitals in the world, is leading the commercialization of the SpectraLIT™ (Newsight’s portable spectrometer) as an AI-driven pathogen diagnostic test, including COVID-19. Virusight announced the results of a major clinical trial that confirm the SpectraLIT device instantly (under 20 seconds) detects COVID-19 with 96.3% accuracy. The second JV, Watersight, was launched with Mekorot – Israel’s national water company, to utilize the spectral technology for water quality monitoring.

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BEIJING GALAXY-CAS TECHNOLOGY CO., LTD.

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SemiDrive

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Impact on the industry: 1. The intelligent cockpit chip Infotainment SoC X9 can simultaneously drive up to 10 high definition displays including instruments, central control, rearview mirror and rear seat entertainment through a single chip, and support multi-screen sharing and interaction to meet the functional demands of intelligent cockpits in the future; 2. SemiDrive is one of the few companies which can provides automotive-grade Gateway SoC; 3. The frequency of automotive-grade MCU E3 CPU is up to 800MHz, with up to 6 CPU cores.What’s more,the automotive-grade reliability standard reaches AEC-Q100 Grade 1 level and the functional safety standard reaches ISO 26262 ASIL D level; with the adoption of dual-core lock-step Cortex-R5, it has achieved up to 99% of diagnostic coverage; and that above-mentioned two automotive-grade standards MCUs are met at the same time can be second to none even on a global scale. Business model innovation: 1. SemiDrive Technology has focused on providing high-performance and high-reliability automotive-grade chips and is also the first provider of “full-scenario and platform-based” chip product and technical solutions in the world. The products have included intelligent e-cockpits, autonomous driving, gateways and MCUs, and covered the most core chip categories of automotive electrical / electronic (E/E) architecture in the future. 2. In terms of automotive-grade certification, SemiDrive Technology has successively obtained such certifications as ISO 26262 functional safety process, AEC-Q100 reliability ISO26262 functional safety product and national secret, so that it has become the first four-certificate-in-one domestic automotive-grade chip enterprise.

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Unigroup Guoxin Microelectronics Co., Ltd.

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Guoxin Micro (Stock Code: SZ002049) is one of the largest listed companies involved in integrated circuit design in China. With smart chips as the core business, the company focuses on digital security, intelligent computing, power and power management, high-end chip components, highly reliable integrated circuits and etc.. It is a leading provider of chip products and solutions, which are widely used in finance, telecommunications, government affairs, automobile, industrial interconnection, Internet of Things and other fields. In terms of the chips for China's second-generation ID card, the company accounts for a quarter of the total market share. In the global SIM chip market, its market share ranks the first place, with overseas shipments exceeding 50%. It occupies a leading position in various business domains, including chips for China's SIM card, banking cards applying state cryptography, resident health card, new generation traffic card, ID card reader and POS SE chips. The company's products and applications are all over the world. To this date, the accumulated shipments of smart chips worldwide has exceeded 15 billion pieces. With the mission of the company“bring success to customers with chips and to create a smart world with joint efforts”, and the vision to become “a leading enterprise of smart chips”, we stick to the three approaches, namely, "leading technology, global development and efficient operation", and is dedicated to the fields of smart internet connection, smart industry, smart finance, smart city, smart life and smart transportation. We are committed to the building of a smart industry ecosystem and empowering all walks of life to become more intelligent. The company has mastered six core technologies related to intelligent security chip, including NFC, security algorithm, security attack and defense, embedded storage, embedded scheme and high reliability. It has a number of core patents, and has built four technology platforms, including design, testing, quality assurance and process outsourcing, which can ensure the R & D, manufacturing, testing and application development of a variety of process nodes. With leading process technology nodes and efficient design, the intelligent security chips of the company have significant advantages in performance, cost and reliability. It is widely used in financial payment, identity recognition, Internet of Things, mobile communication, intelligent terminal, Internet of Vehicles and other fields. the intelligent security chip THD89 passed the international SOGIS CC EAL6 + security test, making it the first chip in China that has been awarded the highest level of security certificate. Guoxin Micro provide basic support for the digital era. The company is firmly embracing the future trend and the forefront of technology to explore the broad market, and is expected to maintain current leading edge and achieve greater development.

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China Micro Semicon Co.,Limited

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RIGOL TECHNOLOGIES CO., LTD.

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Founded in 1998, RIGOL has become a well-known high-tech enterprise specializing in the R&D, production, sales and service of general electronic test and measurement instruments. Its main products include oscilloscopes, waveform generators, spectrum analyzers, RF signal generators, DC power supplies, DC electronic loads, multimeters and data acquisitions, etc. RIGOL is currently the only Chinese enterprise equipped with self-developed digital oscilloscope core chipset and successfully realized product industrialization. The company has successfully listed on Shanghai Stock Exchange (SSE) STAR Market on April 2022. In recent years, RIGOL has developed rapidly, with a revenue growth of nearly 37% in 2021. Headquartered in Suzhou, RIGOL has 3 R&D centers in Beijing, Suzhou and Shanghai, and established overseas subsidiaries in Europe, the United States, Japan and Singapore. Its business covers more than 90 countries and regions and has won high recognition from many well-known customers. As of June 30, 2021, RIGOL has 386 authorized patents, including 346 invention patents, and has been listed in the Top 500 Chinese Enterprise patents in 2019 and 2020. RIGOL has won more than 60 awards, obtained the membership of international Bus LXI Alliance, CNAS certification laboratory and many other qualifications, participated in 1 national standard, led the drafting and formulation of 3 industry general specifications, and undertook 10 national and provincial projects including "National Torch Plan". RIGOL takes general electronic test and measurement instruments and their solutions as the core, providing scientific research, product development and manufacturing test and measurement guarantee for education and scientific research, industrial production, communication industry, transportation and energy, consumer electronics and other industries. 普源精电（RIGOL）在产品方面积极布局，不断创新，在2021年10月推出了线性直流电源新机型DP813A和DP822A，满足光通讯模块测试、芯片和集成电路测试、半导体测试和工业ATE测试等多个行业及应用测试需求。在2022年6月推出了DSG5000系列微波信号发生器，能够提供高质量信号、准确信号电平和宽输出功率范围，满足如超导量子计算、雷达信号生成、MIMO、EMS等复杂测试需求。截至2021年6月30日，普源精电已有授权专利386项，其中发明专利346项，并在2019年、2020年连续两年荣登中国企业专利500强。2021年普源精电发明专利荣获苏州市“优秀专利奖一等奖”；并因在专利申请、管理、运营和保护方面的突出表现，被授予“知识产权工作先进单位”荣誉称号。多年来，普源精电深耕数字化转型，在文化引导、组织建设等方面探索数字化管理模式，全面实施IT系统。公司凭借这样的架构优势，实现了组织快速响应，在疫情期间保障生产，并提升了公司运营效率、经营指标与客户满意度。2021年12月，普源精电以 “RIGOL数字化转型实践与探索”，荣获“2021中国管理年度价值案例”，入选《管理蓝皮书：中国管理发展报告（2021）》，为中国企业提供了在数字化转型方面具有参考价值的管理案例。公司的快速发展，社招和校招需求增大，每年提供数百个工作机会。 2018年公司成立普源书院，致力于为测试测量行业培养精英人才。2021年，普源书院提供课程达38节，帮助员工发展与成长。同时，普源精电长期关注中国高等教育的发展，并携手高校开展广泛的交流与合作。在过去的12个月内，RIGOL已先后与多所高校开展了“教育部产学合作协同育人”项目合作，促进了高校新工科创新体系建设，为测试测量行业培养优秀人才。 RIGOL is active in product layout and keep innovating. In October 2021, DP813A and DP822A, new models of linear DC power supply, were launched to meet the requirements of optical communication module testing, chip and integrated circuit testing, semiconductor testing, industrial ATE testing and other industries and applications. In June 2022, RIGOL launched DSG5000 series microwave signal generator, which can provide high quality signal, accurate signal level and wide output power range to meet complex testing requirements such as superconducting quantum computing, radar signal generation, MIMO, EMS and so on. As of June 30, 2021, RIGOL has 386 authorized patents, including 346 invention patents, and has been listed in the Top 500 Chinese Enterprise patents for two consecutive years in 2019 and 2020. In 2021, RIGOL's invention patent won the first prize of Suzhou Excellent Patent Award; It was awarded the honorary title of "Advanced Unit in Intellectual Property Work" for its outstanding performance in patent application, management, operation and protection. Over the years, RIGOL has been engaged in digital transformation, exploring digital management mode in cultural guidance and organizational construction, and comprehensively implementing IT system. Relies on this structural advantage, RIGOL has achieved rapid organizational response, ensured production during the epic, and improved the company's operational efficiency, operating indicators and customer satisfaction. In December 2021, RIGOL was awarded the "2021 China Management Annual Value Case" for "RIGOL Digital Transformation Practice and Exploration", and was selected in the "Management Blue Book: China Management Development Report (2021)", providing Chinese enterprises with management cases with reference value in digital transformation. With the rapid development of the company, the demand for social and campus recruitment has increased, providing hundreds of job opportunities every year. In 2018, the company established RIGOL Academy, which is committed to cultivating elite talents for the test and measurement industry. In 2021, RIGOL Academy offered 38 courses to help staff develop and grow. At the same time, RIGOL has been paying close attention to the development of Higher education in China, and has carried out extensive exchanges and cooperation with universities and colleges. In the past 12 months, RIGOL has successively carried out cooperation with many universities in the "Ministry of Education, Industry-University Cooperation and Education" project, promoting the construction of new engineering innovation system in universities and cultivating excellent talents for the test and measurement industry.

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YEESTOR Microelectronics Co., Ltd.

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Unicmicro(Guangzhou)Co.,Ltd

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UNICMICRO (Guangzhou) Co., Ltd. focuses on low-power IoT chips design, offering customers with low-power 8-bit MCU，32-bit MCU, Sub-GHz RF transceivers, PD SoC, and analog chips for IoT applications. At present, there are tens of millions of MCU shipped. UNICMICRO (Guangzhou) Co., Ltd.. is the chairman unit of ZETA China Alliance. ZETA technology is a LPWAN communication protocol with China's independent intellectual property rights. ZETA alliance is a cross industry alliance for LPWAN 2.0 Internet of things. At present, ZETA alliance has about 400 members in China, Japan and Southeast Asia, including mobile operators in China and Japan like China Tower, China Mobile, NTT DoCoMo, TDDI, members of ZETA alliance cover semiconductor, communication, industry, agriculture, electric power, logistics, real estate and other fields. Unicmicro cooperates with alliance members to promote the internationalization of ZETA technology.

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Quectel Wireless Solutions Co., Ltd.

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Quectel’s main business includes the design, research and development, production and sales of wireless communication modules and their solutions in the Internet of Things field. It can provide one-stop IoT solutions including wireless communication modules, antennas and IoT cloud platform management. The company's diverse products and its rich functions can meet the various needs of different smart terminal markets. Quectel's products can be widely used in intelligent transportation, smart energy, wireless payment, smart agriculture and environmental monitoring, smart city, wireless gateway, smart industry, smart life, medical health and smart safety and other fields. In 2021, the company achieved an operating income of 11.262 billion yuan, a year-on-year increase of 84.45%. As a technological innovation company, Quectel reserves and launches a variety of innovative products that meet market demand with high quality, complete portfolio and good service. In terms of 5G modules: In February 2021, Quectel took the lead in launching the second-generation 5GNR communication modules that comply with the 3GPP R16 requirements—Sub-6GHz modules Rx520F series, Rx520N series and millimeter wave (mmWave) modules RM530N, RG530F series. These modules feature ultra-reliability and low-latency, which further improves 5G service capabilities and efficiency, and can meet industry application scenarios that have higher requirements for enhanced mobile broadband and reliable communication capabilities, such as industrial Internet, fixed wireless access, mobile Computing, smart medical care, private network, etc. In terms of automotive modules: Quectel continues to provide a rich and powerful automotive product portfolio based on new technologies and new platforms. The newly launched LTE-A automotive grade module AG519M, and the AG56xN and AG57xQ modules supporting 5G NR and 5G NR+NR V2X, meets the needs of customers who are increasingly rich in the Internet of Vehicles ecology and balanced in the supply chain. Automotive-grade Wi-Fi 6 module AF50T and WiFi 6E AF68E support customers and cellular communication modules to form multiple access points in the car to meet the needs of private networks. AG800D and AG600K in-vehicle Android smart modules developed based on Qualcomm's high-performance chips have ultra-high video and AI processing capabilities, and are suitable for 360 surround view, OMS/DMS, AR navigation and other scenarios. Automotive-grade high-precision positioning GNSS module LG69T-AM, equipped with Point One positioning engine, uses RTK and SSR technology to achieve centimeter-level positioning, is well used in micro-transportation and other fields. In addition, in order to comply with the wave of AIoT intelligent application innovation, the company has also launched a series of module products that support AI algorithms. Among them, the new generation flagship SG865W-WF smart module has powerful performance and a comprehensive computing power of up to 15TOPS. The module can be used in computing-intensive IoT applications such as smart cameras, video collaboration and smart retail. Quectel attaches great importance to intellectual property protection, and has applied for and obtained intellectual property certification. As of the end of 2021, the company has obtained 209 authorized patents, 104 trademarks, and 189 software copyrights. In addition, as a member of China Communications Standards Association (CCSA), the company participated in the formulation of the 5G general module line standard, and as a member of 3GPP (an international standards organization that studies and formulates communication technical specifications), the company actively participated in the formulation of 3GPP international standards to promote the Internet of Things industry.

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Dosilicon Co., Ltd

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As a Fabless company, Dosilicon focuses on the design, production and sales of NAND Flash /NOR Flash /DRAM carrying independent intellectual property. Currently, Dosilicon is one of few memory companies who can provide NAND / NOR / DRAM design process and product scheme at the same time in China. Dosilicon's product line has been continuously enriched, the introduction of customers has been completed, and the products have been gradually in large quantities. Therefore, the sales scale has been expanded. At the same time, with the continuous recovery of the market and the rise of product prices, Dosilicon achieved an operating revenue of 1134.813 million yuan in 2021, an increase of 44.62% year-on-year With strong R & D capability and stable supply chain system, products have entered many well-known customers at home and abroad, and are widely used in 5G communication, IOT terminals, consumer electronics, industrial , automotive electronic products and other fields. With its outstanding performance, it has been certified by many well-known platform manufacturers. At the same time, it has entered the supply chain system of many well-known customers at home and abroad, and is widely used in terminal products such as communication equipment, security monitoring, wearable devices, mobile terminals, etc. At the same time, the company can provide customized design services and overall solutions forNAND, NOR, DRAM and other memory chips according to customers' specific needs, helping customers reduce product development time and cost and improve product development efficiency. In the process of customized design for customers, we constantly understand the functional requirements of the market for products, receive customers' feedback on terminal products, repeatedly verify and polish existing technologies, and establish a technology development cycle of "R & D - Transformation - innovation" to further enhance technical capabilities. As a leading memory chip design company in the mainland, Dosilicon continues to innovate and lead the memory chip industry in the mainland, focuses on domestic advanced processes, and has established a strategic cooperation relationship with SMIC, the largest wafer foundry in the mainland. The two sides have carried out in-depth technical cooperation for many years on the characteristic process platform of high reliability and low power memory chips, and developed a variety of standard processes involving flash memory chips. So the product yield and production efficiency of wafers have been improved. After the joint development of the first NAND flash process production line in the mainland, the NAND flash process has been promoted to 19nm, which also means that Dosilicon has accumulated experience and technical reserves to further advance to the 1x nm process, promote the further upgrading of the company's product process, and increase the product market competitiveness. Based on the successful development experience with various process platforms, and combined with the repeated debugging and optimization of market demand, Dosilicon has successively enriched the SLC NAND series product line, and achieved higher product performance in the continuous improvement and R & D. The first SLC NAND Flash successfully tape out on 19nm process technology line of SMIC in 2021. At the same time, the 24nm NAND and 48nm NOR designed, developed and mass produced by Dosilicon are currently the leading processes in the mainland, achieving a breakthrough in flash chip technology in the mainland. In addition, Dosilicon is also continuously increasing the development of vehicle specification level products. SLC NAND Flash are stable in terms of durability and data retention characteristics. Not only has the erasure times of a single chip exceeded 100000 times in the industrial temperature control standard, but also the data validity can be maintained for 10 years in the extreme environment of -40 ℃ to 105 ℃. The product reliability is gradually moving from the industrial standard to the vehicle specification level standard. Through continuous innovation, we constantly update iterative products, continue to miniaturize the process and improve the yield, lead the evolution of products from consumer and industrial level to vehicle specification level, and continue to lead the memory chip industry in the mainland. In 2021, Dosilicon made an initial public offering and was listed on the science and innovation board, simultaneously enhancing the influence of local brands, and maintaining the Performance Leadership and competitive advantage of existing products through continuous R & D innovation, process upgrading and performance iteration; Relying on the advantages of multiple storage products, we will increase the layout and development of emerging fields such as the Internet of things, intelligent hardware applications, automotive electronics, medical health, etc., improve the market share of the company's products, and simultaneously improve the ability of customized products and services; Insist on taking storage products as the core, expand intelligent extension and application-oriented, develop characteristic storage products, and improve profit space through differentiation; Continue to develop high-quality domestic customers and serve important customers in the industry, start to expand overseas markets in a planned and step-by-step manner, and improve the company's market position and influence in Europe and the United States. Dosilicon will always focus on its core advantages, combine internal and external resources, take independent innovation as the driving force, continuously improve its core technology, create a development path extending from multi category general-purpose products to characteristic products, improve its comprehensive competitiveness, and is determined to become a leading memory company serving customers all over the world.

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SmartSens Technology (Shanghai) Co., Ltd.

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SmartSens Technology (Shanghai) Co., Ltd. (Stock Code: 688213) is a high-performance CMOS image sensor (CIS) chip design company. It is headquartered in Shanghai and has research centers in many cities around the world. In May 2022, SmartSens was successfully listed on the SSE Science and Technology Board, and its market value exceeded 20 billion yuan. At present, SmartSens has gained “FIVE trophies” in global security CIS shipments and is at the forefront of the emerging machine vision sector, as well as developing business in the emerging automotive electronics and smartphone sectors, with applications all over the world. SmartSens has maintained a high level of technological innovation and has introduced several cutting-edge core imaging technologies for four major applications. SmartSens’ proprietary SFCPixel® technology, NIR+ technology, low noise reading circuit design, dark current optimization technology for high temperature scenarios, several professional HDR technologies, LFS technology and PixGain technology are widely used in many of its products. SmartSens is committed to continuous innovation of products and fueling growth in numerous industries by delivering a more comprehensive portfolio of image sensors. In the past 12 months, SmartSens has achieved comprehensive expansion in four application areas: smart security, automotive, machine vision and smartphones, launching several innovative CIS based on customers' core needs. In the field of smart security, SmartSens launched several new products in the Advanced Imaging (AI) series focusing on new security applications, including the 8 MP SC830AI and 3 new products in the upgraded version of 4MP series. That completes a full line of AI product upgrades covering mainstream 2MP to 8MP imaging solutions. At the same time, for ultra-low light scenarios, SmartSens launched its first Stack Rolling Shutter 8MP CMOS image sensor SC850SL, which is equipped with SmartSens’ second-generation NIR+ technology, rendering clear, visible-like HD images even in environments with only weak starlight. In the field of automotive electronics, SmartSens has launched several new high-performance CIS products for three major automotive types: viewing, sensing and in-cabin. Among them, the latest SC220AT combines the four major performance advantages of on-chip ISP, high sensitivity, high dynamic range and excellent LED flicker suppression (LFS) performance and meets the requirements of AEC-Q100 Grade 2 and ASIL-B functional safety, with excellent imaging performance. So far, SmartSens has launched six high-performance CIS covering 1MP~8MP automotive imaging solutions and has started the R&D planning for the second and third generation of automotive products, which will further lay out the smart automotive on all fronts. In the field of machine vision, as applications such as obstacle avoidance systems and optical flow ranging are directly related to the safety of drone flight, these applications have extremely high requirements on the imaging performance of CIS. With the launch of SmartGS®-2 technology, which is suitable for machine vision applications with fast moving object scenarios, SmartSens has further opened up the drone machine vision market. Currently, SmartSens has become one of DJI's key suppliers, and its CIS products have been adopted by the full range of new DJI models (including the newly launched Marvic 3, Air 2S and Mini3 Pro this year), being used in obstacle avoidance systems, optical flow and gesture recognition applications. Finally, in the smartphone segment, after the successful mass production of its first 1.0μm pixel size product, the SC1600CS, SmartSens has created a milestone - SmartSens' first 50MP ultra-high resolution 1.0μm pixel size image sensor, the SC550XS, which uses the advanced 22nm HKMG Stack process, equipped with many of SmartSens’ cutting-edge imaging technologies, AllPix ADAF® technology to achieve 100% all pixel all direction auto focus coverage, equipped with MIPI C-PHY 3.0Gsps high-speed data transmission interface, to meet the flagship smartphone main camera imaging performance requirements. In addition, in the past 12 months, SmartSens has won many national and international awards, including: CCIDnet | 16th "China Core" Excellent Technological Innovation Product Award, CPSE | 18th CPSE Security Expo Golden Tripod Award, a&s | 2021 Global Security Top 50, ASPENCORE | EE Times - China IC Design Achievement Award for China Innovative IC Design Company of the Year, etc.

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2Pai Semiconductor Co.,Limited.

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Founded in 2017, 2Pai Semi has become the leader in digital isolation. The main products of the company are 3kV and 5KV standard digital isolators, digital optocouplers, single channel isolated gate drivers, dual channel isolated gate drivers, non-isolated high voltage half-bridge gate drivers and opto-compatible solid state relays, etc. These products are widely used in industrial control, photovoltaic, electricity meters and new energy electric vehicles and so on. All these products have won consistent praise from customers. The annual shipments are tens of millions of products, and sales shall be more than 100 million YUAN this year. The company also pays great attention to talent team building. Graduate students account for 44%, and R&D colleagues account for more than 50% in the company. 2Pai Semi adheres to the two-legged mode of direct supply and agent supply in the terms of business. While strengthening close cooperation with important customers, the company expands sales channels and increases the number of customers. In addition, the company has also carried out in-depth cooperation with some important customers, such as developing customized products together, binding fabs and packing plants together to ensure stable supply. All these measures have greatly improved the research and development capacity. 2Pai Semi adheres to the vision and concept of "creating new value with IC", and strives to provide high-performance, cost-effective analog integrated chips that bring value to customers. The company attaches great importance to scientific and technological innovation. Up to now, it has 22 domestic and 11 international invention patents. In the past two years, the company has raised great reputation as it won the honors of Shanghai Patent Pilot Enterprise and KPMG China "IC Technology" Emerging Enterprises 50 list. 2Pai Semi is leading digital isolator technology in the world, with complete independent intellectual property rights. There is no intellectual property conflict with any company or individual in the world. At present, the digital isolator π 1XXX & π 2XXX series products have been on the market, which have excellent comprehensive performance and fill the blank in the field of digital isolator in China, and greatly expand the application range of digital isolators. The single-channel and dual-channel isolated gate drivers are in mass production recently. And these two devices are very popular as they have won a large number of orders in OBC application for new energy vehicles, providing a favorable solution for the replacement of domestic ICs. Opto-compatible solid-state relay is the first semiconductor enterprise in China to produce products based on digital isolation technology. The performance is much better than PhotoMOS devices. It broke the monopoly of American and Japanese enterprises in PhotoMOS for vehicles.

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Eyang Technology Development Co., Ltd.

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Shenzhen Thinkplus Semiconductor Co., Ltd.

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Shenzhen Thinkplus Semiconductor Co., Ltd.,founded in 2011, is leading enterprises of power management chip in TWS field which is a national high-tech firm.We focuse on the design of POWER+ power management system chips for battery applications, and is committed to providing leading battery management system level chips and solutions for smart wear, consumer electronics, industry, energy storage systems, new energy vehicles and other fields. Its main products include TWS headset power management chips, mobile power SoC chips, lithium battery charging chips, power management pmics, wireless charging chips, etc. In recent years, the market share of our products in the SoC chip market of TWS Bluetooth headset charging bin ranks first in China, with more than 700 million pieces sold. We have won the 2022 China IC Top 'New Company of the Year Award', the 2021 6th China IoT Innovation Award and so on. Our customers include Xiaomi, OPPO, vivo, OnePlus, realme, Transsion, MEIZU, 1MORE, Baidu, NetEase, Rambler, JBL, Harman, Lenovo and other well-known domestic and foreign brands. Our products have served hundreds of millions of consumers around the world. Our headquarters is located in Shenzhen, and we have set up R&D centers in Shanghai, Chengdu and Zhuhai. The R&D staff of our company accounts for about 62%. In our company, the employees with master's degree or above account for more than 50%. At the same time, among our employees, some of them graduated from famous universities such as Hong Kong University of science and technology, Shanghai Jiaotong University, Xi'an Jiaotong University, Huazhong University of science and technology, University of Electronic Science and technology, Xi'an University of Electronic Science and technology. Up to now, we have applied for, obtained more than 130+ IP rights. In the past year, Shenzhen Thinkplus Semiconductor Co., Ltd. has won such honors as 'The Best New Company of the Year' from China Semiconductor Investment Alliance, The 6th China IoT Innovation Awards in 2021', 'Core Partner of Anker Innovations' ,'AIoT Excellence Award', etc, which mean that the industry, medias and partners have fully recognized Thinkplus Semiconductor's achievements and contributions to the chip field. In the meanwhile, Thinkplus Semiconductor as a national high-tech enterprise, is continuously increasing research and development investment, actively cultivating industry talents, committed to product innovation and other measures, and many chip enterprises to work together to promote the vigorous development of 'China chip'.

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Zhuhai Jieli Technology Co.,Ltd

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Jieli Technology was established in August 2010. It is the world's leading system-on-chip (SoC) design enterprise for smart RF product and smart multimedia product. The company's chip sales have exceeded 8 billion pieces, forming a strong brand influence, and it is one of the main suppliers of Bluetooth audio SoC chips in the world. The company's products are mainly used in IoT smart devices such as AI smart speakers, Bluetooth speakers, Bluetooth headsets, smart voice toys, HD recorders, smart video surveillance, health care, education counseling, etc; covered huge amount of application types and market. Jieli R&D team has the advantages of being close to the market and rapid R&D. After more than 10 years of technology and market accumulation, it has a complete set of design platforms and software protocols for RF, video, audio, medical and health, IoT and generic MCUs. In addition, chip products have a strong competitive advantage in the industry. Jieli Technology products have the characteristics of high integration, high performance, high-cost-performance, multi-function. Jieli Technology will take advantage of existing industry experience, research and development, products, services, location and other advantages, with the Internet of Things, Internet of Vehicles, artificial intelligence Cultivation and development of emerging industries such as Bluetooth, Wi-Fi, smart video surveillance, IoT, AI and neural network pattern recognition and other market fields and realize the vision of "becoming a world-class integrated circuit design enterprise". Jieli Technology is the world's leading system-on-chip (SoC) design company for RF smart products and multimedia smart products. The company's chip sales have exceeded 8 billion, forming a strong brand influence, and it is one of the main suppliers of Bluetooth audio SoC chips in the world. Under the background of foreign sanctions on China's IC technology, the localization of some company’s clients has been effectively realized; helps the company won multiple national and global awards. The company proactively grasps the development direction of the international and domestic IC design industry, builds an IC design research center, and builds a first-class R&D platform. Further improve the technical level of the core products of RF smart terminal chips and multimedia smart terminal chips, strengthen the technical research on RF technology, digital-analog hybrid integrated circuit design technology, software and hardware collaboration technology, etc., to maintain the company's core competitiveness. The company adheres to independent research and development, appropriately purchases advanced equipment and technology license authorization, strengthens research on advanced technology levels, realizes the extension and expansion of existing technologies, the research and development and application of new technologies, and actively and steadily sets foot in new technologies and product fields. The company pays caution to the layout and protection of intellectual property rights, has always adhered to the independent research and development mode, and has formed a system with independent intellectual property rights and core technology. By the end of June 2022, a total of more than 400 intellectual property rights of various types have been obtained. Through continuous technological innovation and technology accumulation, the core technology and intellectual property system have been established, and certain intellectual property barriers have been established.

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JLQ Technology Co., Ltd.

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As a leading integrated circuit design enterprise in China, JLQ Technology Co., Ltd.(JLQ Technology） is committed to building an intelligent world of mobile Internet with innovative chip design capabilities. Its business focuses on the two core areas, i.e., mobile communication and smart Internet of things, aiming to provide customers and partners with high-performance chip products, targeted industry solutions and high-quality technical services. JLQ Technology has excellent capability and profound technology foundation in R & D, engineering and applications of chip technology. Its chips and technology applications have been applied in various products such as smart phones, mobile PC, smart vision and smart travel. Guided by value innovation, the company will cooperate with its partners to create an open and win-win ecosystem and promote technology progress and industry development of China's integrated circuit. JLQ announced the launch of the 4G smartphone ICs platform JR510 in June 2022. This ICs platform is mainly for the field of mobile communication, and it is the second heavyweight ICs platform launched by JLQ after its establishment. Based on the octa-core architecture, the JR510 has balanced performance and power consumption, and has powerful image and AI processing performance, which can meet the diverse application needs of the mobile era and empower mobile intelligent terminal products to benefit more users and scenarios. At present, JLQ JR510 has entered the stage of mass production and has been adopted by Xiaomi's brand POCO C40. The successful launch of the JR510 ICs platform and the ability to face the market in a short period of time, obtain the adoption of the industry’s leading customers and enter the stage of large-scale mass production, is a very challenging project. This means that JLQ has accumulated depth and breadth in its long-term cultivation, and has a strong scientific research strength from the technical end to the product end.With its excellent performance, the JLQ JR510 4G smartphone ICs platform will bring a better mobile communication experience to consumers around the world, and also bring more choices of chip solutions to the industry, adding vitality to the industry and creating new value.

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Shenzhen Reexen Technology Limited Company

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Shenzhen Reexen Technology Limited Company, founded in 2018, is committed to the design of high-performance mixed-signal chips. It is a global leader in the field of new sensor-memory-computing integrated architecture technology. It has received investment and funding of hundreds of millions of yuan from the Chinese and European governments. The existing team has nearly 100 people, including 7 young scientists (Shenzhen Peacock Talent Team) and more than 70% of the chip R&D team. Other core members have worked in Tl, ADI, HiSilicon, IMEC, Qualcomm, STMicroelectronics, Realtek, etc. A well-known semiconductor company with 10 to 25 years of experience in chip design and development, computing architecture and deep learning. Reexen's spatiotemporal processing chip based on digital-analog hybrid SRAM memory and computing (CIM) technology came into being. Reexen's SRAM-based CIM processor is 5-10 times more energy efficient than traditional digital NPUs. Through the circuit micro-architecture design of the memory-computing array and the high-energy-efficiency and high-precision ADC design, each bit of digital input and analog signal can achieve 1-to-1 accuracy; and the SRAM computing unit has the advantages of easy process iteration, fast operation speed, and high computational efficiency. The advantages of high precision. The architecture based on spatiotemporal multi-domain redefinition enables the chip to handle tasks such as dynamic camera (DVS) asynchronous event streaming, ultra-wide-domain audio, sensor time-series signal conditioning and fusion tasks, taking into account traditional vision and depth, angular, velocity/optical flow Field, and dToF/FMCW lidar point cloud and other spatial information processing functions, truly realize multi-modal signal processing and efficient neural network operation in one chip. Therefore, the integrated space-time processing chip of Reexen has well solved the intelligent application requirements of human-computer interaction systems under the current ultra-low power consumption requirements such as XR SLAM, and is a product with the significance of the times.

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RiVAI

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RiVAI Technologies (Shenzhen) Co. Ltd., established in 2018, is a chip design company that provides RISC-V-based core processors for mid-to-high end markets. The company has its origins in the UC Berkeley RISC-V project, with its founder and CEO coming from the original RISC-V team. The management team consists of professionals with strong academic and R&D experiences in RISC-V and AI chips. RiVAI’s key product is a high-performance and low power-consumption processor IP. The company provides customized DSA processors and customized chip solutions for the high-end applications needed in industries, such as auto drive, data center, servers, cloud book, audio electronics, wearable devices, and smart security systems. Since its establishment, RiVAI has been endorsed by top investment institutions, and its customers include many well-known domestic and foreign companies. In 2021, RiVAI completed the A+ round of financing, led by ByteDance and Hillhouse Venture, and followed by Lenovo Capital and Incubator Group, Wu Capital, Waterwood Investment Holdings Limited, ZhenFund, and so on. Previous shareholders such as Northern Light Venture Capital and Baidu Ventures continued to increase their stakes. Headquartered in Shenzhen (China), RiVAI also has offices in Chengdu (China) and Silicon Valley (U.S.). RISC-V, as an emerging open ISA, provides an opportunity to develop made-in-China chips which improves regional supply chain security, especially in a deglobalized era. Dr. Tan, the president and the CEO of RiVAI, has actively participated in the creation, development, verification, and promotion of RISC-V. As the first Chinese scientist with extensive knowledge of RISC-V, he has leveraged his knowledge to lead early development efforts in China. Currently, over 85% of RiVAI’s employees are R&D engineers with many years of chip design experience. Many received their education from the world’s top universities such as Berkeley, Stanford, and Carnegie Mellon. RiVAI announced its RISC-V-based high-performance vector processors on June 20th 2022, with its first implementation designed for the smart video and audio industry. In addition to its technological capabilities, RiVAI has strong academic and industry network with the world’s top universities, semiconductor and tech giant companies, and RISC-V International. Achieving high-end CPU’s technological independence is highly desirable to China’s chip industry but the complete independence must be achieved from bottom up, leaving RISC-V the only viable pathway. Being the only China’s R&D team that is led by the co-developer of RISC-V, RiVAI will be the leader of this technology revolution. Talent supply in China’s semiconductor industry is severely short of its demand which directly slows down the technology development and innovations in the industry. RiVAI enjoys academic and industry resources from many world-class universities, semiconductor and tech giant companies, and RISC-V International. It actively collaborates with the RISC-V International Open-source Laboratory at TBSI, to produce R&D talents in the field. Since its foundation, RiVAI has attracted many tech industry professionals from Silicon Valley and master and Ph.D graduates of top university across the world to join its team, continuously bringing in the most front-end technologies, theories, skills, and knowledge in CPU instruction set architecture, SoC chip design, verification, tape-out, silicon photonics, and software algorithms. RiVAI is building an international team, consisting of senior RISC-V engineers and managers. With its distinctive advantages in RISC-V technologies and professional background, RiVAI is confident and determined to lead the construction of China’s RISC-V ecosystem and the development of China’s chip design technology.

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NXP Semiconductors

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Fortior Technology(shenzhen)Co.,Ltd

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Shenzhen Lowpower Semiconductor CO.,LTD

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Shenzhen Bronze Technologies Ltd.

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Black Sesame Technologies

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Black Sesame Technologies is a world-leading company in image processing, perception algorithm, and SoC design for Advanced Driver Assistance Systems and autonomous driving solutions. Founded in 2016, Black Sesame Technologies have released two generations of chip products: Huashan No. 1——A500， and Huashan No. 2——A1000/A1000 L/ A1000 Pro. The computing power of the A1000 Pro reaches up to 196 TOPS. Huashan Chips can support L2+ to L4 automated driving. Our chip products and solutions are integrated into automakers and Tier1 companies: China FAW, SAIC, Bosch, and more. Black Sesame has over 800 employees worldwide who have more than 15 years of experience and expertise in image processing, vision algorithms, chip design, and automotive-grade product & application development. BST launched the HanHai Autonomous Driving Middleware Platfinm at May 2022. Based the on HuaShan series embedded system development platform, it includes development toolkits like Target(SoC) SDK, X86(Host) SDK、Target(MCU) SDK, which perfectly support the development of vehicle-side, road-side, other intelligent driving, and V2X scenarios. With the high performance of HuaShan series chips, the key modules of the autonomous driving system and other basic software components are packaged into open APIs, allowing users to access and use the processing capabilities of the Huashan series chips quickly and easily. It also assists developers in agile development and deploying solutions of autonomous driving.

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WeEn Semiconductors Co., Ltd

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WeEn’s global footprint has an operational headquarters in Shanghai and wholly owned subsidiaries and centers in Jilin & Hongkong, north east China (Front-End Fabrication) Shanghai and Manchester, UK (Research & Development) , Dongguan(Warehouse and Distribution), and cities throughout the world (Sales Offices and Customer Service Access). With global sales offices in 12 countries and regions in Greater China, Europe, Asia Pacific and America, we can provide timely and efficient professional service and support to customers. Since span off from NXP in 2015Y, the company operation is very well and keeps quick growth. By increasing the investment in power semiconductors, WeEn has expanded the capacity and released more new products to meet the demand of customers and market. With a heritage of over 50 years in semiconductor development and manufacturing, WeEn as a key player has focused on developing a wide and deep portfolio of industry-leading power products including Silicon Carbide Power Devices, Silicon Controlled Rectifiers and Triacs, standard and fast recovery Power Diodes , TVS and ESD protection Devices and IGBTs and modules. All these products are widely used in the markets for telecommunications, computers, consumer electronics, intelligent home appliances, lighting, automotive and power management applications. Based on recent reports published by Omdia, WeEn has ranked the second place in the global market share of Thyristors and Number One in China. In the market segment of silicon carbide rectifiers, WeEn also ranked the fifth place in the world and first place in China. "Efficient, reliable, and innovation" has always been the principle of WeEn and our vision is to become the leading China-based global power semiconductor supplier and seeks to help our customers achieve improved cost and production efficiency and contribute to the development of global intelligent manufacturing. In the past year, WeEn Semiconductor has been deeply engaged in the field of power semiconductor. While consolidating the existing market, WeEn has also maintained high R&D investment to launch new products. WeEn has successively released the G4 Fast Recovery Diodes and G5 Soft Recovery Diodes and gradually enriched the product layout on the new platform. In particular, the G5 diode is match with the application of high-frequency market trend and can improve the system EMI. At the same time, WeEn is also further developing the sixth generation diode platform, which can be better used in modules with IGBT, as well as in frequency converters, solar inverters and other applications. Overvoltage clamp Thyristor (ACT/ACTT series) released by WeEn adopts the latest generation of planar passivation process and has the function of overvoltage clamp protection. Compared with traditional Thyristor, ACT/ACTT products have stronger voltage transient processing ability, better device high temperature performance and higher stability and reliability. As an international semiconductor company, WeEn always aims to lead the newest technology development of Silicon Carbide. Based on the 3rd generation technology, WeEn developed the newest 1200V SiC MOSFET which exhibit 40% smaller cell pitch than other products in the market, the specific on-resistance is lower than 3.0 mOhm.cm2, the maximum junction temperature could reach 200℃，which is very competitive in the electric vehicle and photovoltaic applications. Since the outbreak of Coronavirus, the entire semiconductor industry's supply chain has been greatly affected, while at the same time, a lot of opportunities have emerged. In the field of Thyristors and fast recovery diode replacement, with excellent product quality and performance as well as good supply chain management, WeEn has won a lot of opportunities to replace the international well-known brands at home and abroad. At the same time, WeEn Semiconductor follows the idea that “base in China, serve the Global” , and has joined many global electronic exhibition, such as the PCIM Europe, Electronica India and Electronica Shanghai to bring the information about the latest product and industry market trend, showing very good performance on the international stage. In the past year, WeEn has held and participated in several important industry seminars, published technical articles on professional industry media, which deepened the communication with engineers and work together on the continuous development of the global electronics industry.

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Semiment Technology Co.,Ltd

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Established in 2011, Semiment Technology (Shanghai) is head-quartered in Lingang Special Area, Shanghai, and has R & D and sales centers in Shanghai Caohejing Development Zone, Xi'an and Shenzhen. Semiment is one of the earliest integrated circuit (IC) design companies in China for automotive and industrial applications. Company is committed to providing customers with automotive qualified IC solutions. Its main products include sensor ICs, power drive ICs, isolation interface ICs and other high-performance mixed-signal ICs, which are widely used in automotive, industrial, IoT and other fields. In 2021, NXP and Infineon as ABS wheel speed sensor suppliers in the automotive industry encountered serious shortage to China auto OEM, with increasing pricing. ABS wheel speed sensor is a mandatory component for vehicle, and each generally requires 4 modules/chips. The shortage affected the production of the whole vehicle. Semiment's SC9641/SC9642, self-innovated and AECQ100 certified, with strict auto-level control procedures and domestic & controllable supply chain to meet demands from Auto OEMs regarding performance, safety, supply, and cost. The domestic replacement of the wheel speed sensor chip partially solves the problem of “KaBoZi” project. In 2021, Semiment already engaged and supported most Tier1/Tier2 of ABS wheel speed sensor. Based on 4ea per vehicle, Semiment already deployed ABS speed sensor IC on more than 6 million vehicles, and the growth rate will exceed 50% in 22 years. In 2022, the delivery time of Allegro/Melexis ‘s LT extends to 52 weeks especially for auto position sensor IC. Semiment SC244X series products can meet the application of car seat motor, window sunroof motor, tailgate motor, thermal management pump/valve and other applications. Those products alleviate shortage of foreign brands and won many projects and shipped huge quantities. At the same time, Semiment is penetrating into power supply, driver, isolation and interface products in the high-end analog Automotive IC segment, and continuously supports domestic substitution.

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RoboSense

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RoboSense (Suteng Innovation Technology Co., Ltd.) is a world-leading provider of Smart LiDAR Sensor Systems. With a complete portfolio of LiDAR sensors, AI perception and IC chipsets, RoboSense transforms conventional 3D LiDAR sensors with comprehensive data analysis and interpretation systems. Its mission is to innovate outstanding hardware and AI capabilities to create smart solutions that enable robots, including autonomous vehicles, to have perception capabilities superior to humans. RoboSense deploys globally with talent from top global companies and scientific research institutions, empowering the team’s innovation capabilities. As of 2021, RoboSense owns more than 700 patents globally. Its leading products are built on its multi-disciplinary strengths in technology across diverse level of the business. With a market-oriented strategy, RoboSense provides customers with various Smart LiDAR perception system solutions, including MEMS LiDAR, mechanical LiDAR, fusion hardware, and perception software. RoboSense’s portfolio has been globally recognized with the AutoSens Awards, Audi Innovation Lab Champion and CES Innovation Award, signaling its market success. To date, RoboSense LiDAR systems have been widely applied to future mobility solutions, including autonomous driving passenger cars, commercial vehicles, automated logistics vehicles, robots, the company’s own Robotaxi, Robotruck, Robobus, as well as new smart transportation infrastructures. Among them, the pre-installed mass production projects cover supercars, coupes, and SUVs, heavy-duty trucks and other types of vehicles. Since the traditional mechanical lidar system did not consider the mass production requirements of vehicle specifications at the beginning of its design, it is limited by factors such as complex structure, difficult assembly, large number of components, and high cost. high-speed, low-cost and other vehicle-mounted mass production requirements. By 2020, the new energy vehicle industry has gradually begun to seek automotive-grade high-performance lidars to upgrade advanced assisted driving systems. RoboSense began to deploy at the end of 2016. After more than 5 years of R&D iterations, it developed a new generation of MEMS LiDAR technology platform, and launched a second-generation MEMS LiDAR based on this platform. The generation of smart solid-state LiDAR RS-LiDAR-M1. In 2021, M1 will enter the stage of mass production of vehicle specifications, and in 2022, M1 started to mass production. In March 2021, RoboSense completed the first automotive-grade solid-state LiDAR production line in China; in June, RoboSense achieved the first vehicle-grade mass production SOP of the second-generation smart solid-state LiDAR RS-LiDAR-M1, delivering luxury new energy in North America Lucid Motors, started the "Era of mass production of LiDAR". In September 2021, Yole Développement, a world-renowned semiconductor research and consulting company, released the annual "Lidar for Automotive and Industrial Applications" industry research report, stating that RoboSense design wins accounted for 10% of the global market, ranking first in China, 2nd in the worldwide. At the same time, RS-LiDAR-M1 won the PACE Awards from Automotive News. RoboSense always adheres to clients’ needs as the first rule, constantly breaks through the technical limits, continues to expand the innovation frontier of the LiDAR industry, and continues to empower autonomous driving industry partners with products that are closer to the market, more innovative technology, and more extreme performance , strive to promote the comprehensive commercialization of autonomous driving technology, and join hands to create a smart era empowered by autonomous driving technology.

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BIWIN STORAGE TECHNOLOGY CO., LTD.

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Founded in 2010, BIWIN Storage Technology Company Limited (hereinafter referred to as "BIWIN") is a storage product manufacturer focusing on IC packaging and testing. Recognized as the National High-Tech Enterprises, National Specialized And New "Little Giants", BIWIN has received the strategic investment in the 2nd Phase of the National Fund. Being locally dedicated with international scale, BIWIN integrates storage media characteristic analysis, firmware algorithm development, memory design and simulation, packaging and testing, test equipment development and algorithm development, brand operation, etc., thus building a partially integrated business model. The company's memory products are widely used in smart mobile terminals, PCs, industrial terminals, data centers, smart cars, mobile storage and other information technology fields, making itself a leading actor in being a part of the global TOP-level brand supply chain. Credited with excellent overall competitiveness, the company has won the titles of "National Specialized and New "Little Giants", "National High-Tech Enterprises", "Top Ten Best Chinese Chip Manufacturers", "Guangdong Complex Memory Chip R&D, Packaging and Testing Engineering Technology Research Center", "2018 Provincial Key IC Projects in Guandong", "Shenzhen Well-known Brand", "AEO Advanced Authorized Enterprises". And BIWIN’s products have been awarded as "The Best Memory of 2021 China IC Design Achievement Award" and "AspenCore World Electronics Achievement Awards". BIWIN continues to improve product development and semiconductor packaging process, being an active part in the formulation of relevant standards in the domestic memory field. We actively contribute to the formulation of product specifications and test standards initiated by ITMA, and make forward-looking suggestions on the specifications for next-generation products. Also, the company established a NM card test laboratory for setting testing standard and developing testing samples in the product certification, entering the first batch of qualified test laboratory with certification. In the development of the packaging process for memory chip products, BIWIN has been working to improve its process capabilities and has provided corresponding solutions for the multi-layer stacking technology of the new-gen LPDDR5 chips and the automated test technology of high-speed chips. In response to the relative backwardness in the field of server storage products, the company has developed server system SSDs fabricated with homemade electronics, being on a par with international competitive products in terms of technical specifications and compatible with mainstream enterprise operating systems.

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C&B ELECTRONICS (SHENZHEN) CO., LTD.

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In 2016, C&B Eureka established a high-end resistor brand whose name is called "RESI", inlcuding high precision resistor, current sensing resisitor, shunt, high voltage resistor, power resistor, AEC-Q200 qualified resistor, ignition resistor, current sensing module and etc. In 2018, the Changsha RESI Electronics Technology CO., LTD. subsidiary is established, with AEC-Q200 laboratory in it, it is regarded as the R & D and production base of C&B corp. In 2021, Suzhou RESI Smart Factory started operation, which greatly increased the production capacity of RESI resistors; in the same year, C&B Advanced Measurement Center(AMC) was also established, focusing on the production of current detection module products, provide domestic and foreign customers new precision current sensing solution. Now these modules have been favored by many new famous EV companies in China. At the end of 2021, C&B Electronics has completed the acquisition of two companies, Guilin Strong and Shanghai Tongli Alloy Co., Ltd.，and realized the whole industry chain layout in which alloy raw material, electron beam welding, automated production, testing and inspection are fully autonomous and controllable. And now C&B corp has become a high-tech company with strong core technology and industrial advantages. Since the central government redefined the concept of new infrastructure at the end of 2018, China's 5G, artificial intelligence, industrial Internet and Internet of Things industries have flourished and even reached a world-leading level in some areas. However, with the rise of unilateral trade protectionism and increased uncertainty in the international political and economic environment, China's current situation of being constrained in high-tech manufacturing has become more prominent. At present the best resistors almost from Japan, Europe and the United States of America companies, the domestic production is mostly low-end products, in the process, materials, quality control is relatively weak.The future world is an electronic world, the domestic electronics industry from consumer electronics to upgrade to automotive electronics, medical electronics, aerospace and other high-end fields is inevitable, high-end resistors are essential to high-end manufacturing of basic materials. As the Western countries' blockade of China's high-end component manufacturing intensifies, supply chain security has become an enduring topic. How to ensure the security of the supply chain so that Chinese high-end manufacturing companies will not stop production or disconnect due to lack of materials? C&B Electronics, as a high-end electronic component manufacturer, completed the acquisition of a key upstream and downstream process manufacturer of alloy current detecting resistors in late 2021.Separately,they are Guilin Strong and Shanghai Tongli Alloy Co., Ltd.，and the new 15,000 sq. ft. intelligent manufacturing plant in Suzhou has been opened to ensure that these products, from raw materials to core manufacturing equipment, from R&D to production testing, from technical support to professional sales, are all done within the Group, which has greatly improved product quality, delivery timeliness and service professionalism.The direction of the world is precision measurement and control, and high precision low temperature floating flow detection resistors are the 'cement and sand' to build the new world. C&B Electronics always upholds the philosophy of down-to-earth, innovative and customer-oriented, and strives towards the goal of leading the world and contributing to the Chinese electronics industry in a small way.

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Chipone Technology(Beijing) Co.,Ltd.

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Chipone Technology （Beijing）Co., Ltd.. is the world's leading provider of overall display control chip solutions, with the most complete display chip solutions in China, and the only chip design company with both LCD/OLED panel display and LED display strategies, including drivers , Touch, fingerprint recognition, timing control, power management, etc. As at 31 December 2021, the Company has accumulated a rich reserve of core technologies and owns 423 overseas patents (including 399 invention patents), 365 domestic patents (including 189 invention patents), 36 exclusive rights for integrated circuit layout designs, 10 software copyrights, participated in the formulation of 8 national standards, and has independently undertaken or participated in many major national research projects, including 863 projects of the Ministry of Science and Technology of the People’s Republic of China, national science and technology major special projects, and national key R&D projects. The company has been recognized as a high-tech enterprise, set up a "post-doctoral research station", and won the "Ministry of Industry and Information Technology of the People’s Republic of China Manufacturing Single Champion Demonstration Enterprise (2020-2022)", "Beijing Science and Technology Award", "Beijing Invention Patent Award", "Beijing Enterprise Technology Center", "Beijing High-precision Industrial Design Center", " Beijing Zhuan jing te xin Little Giant Enterprise“ (means Professionalism, refinement, distinctiveness and novelty)" and many other awards and honors. Chipone has been ranked as the number one global or mainland Chinese manufacturer in several segments of display chips. In the field of panel display driver chips, according to Omdia 2021, the company ranked No. 1 in the market share of global smartphone LCD driver chips and smartphone LCD TDDI chips in the world, and ranked No. 2 in the market share of global large-size LCD panel display driver chips in the world. In the field of power management chips, according to Cinno Research 2021, the Company ranked No. 1 in the market share of display panel power management chips in mainland China In the field of LED display driver chips, according to TrendForce, the Company will continue to rank No. 1 in the global market share of LED display driver chips in 2019, 2020 and 2021.

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Zhuhai iSmartWare Technology Co., Ltd.

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Zhuhai iSmartWare Technology Co., Ltd. was established at the end of 2014. Its headquarter located at Zhuhai, Guangdong. It has branches in Shenzhen, Shanghai, Chengdu. iSmartWare Technology is a digital-analog hybrid chip design enterprise focusing on the field of power management chips, and its main business is the research and development, design and sales of power management chips. iSmartWare Technology has been deeply involved in digital-analog hybrid chips for many years, and its products are widely used in power bank, car charger, GaN charger, outdoor energy storage power supply, intelligent plug and other equipment. iSmart has exclusive patents in fast charging, wireless charging, low-power and high-efficiency power management IC domain. Our fast charge products rank among the top market shares in consumer electronics and 3C accessories. Our customers include Huawei, OPPO, Lenovo, Bull, ANKER, ASUS and other top brands. Our product concept is “Intelligence, Innovation and Integration”, we will continuously provide first-class quality and superior smart chip products and solutions to our customers. Our corporate vision is to develop into a top national IC company.

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Andes Technology

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Primary Product and Services Seventeen years in business and a Founding Premier member of RISC-V International, Andes Technolgoy is a leading supplier of high-performance/low-power 32/64-bit embedded processor IP solutions, and the driving force in taking RISC-V mainstream. Andes’ fifth-generation AndeStar™ V5 architecture adopted the RISC-V as the base. Its V5 RISC-V CPU families range from tiny 32-bit cores to advanced 64-bit cores with DSP, FPU, Vector, Linux, superscalar, and/or multicore capabilities. Overall Operations and Achievements  Andes achieved record high annual revenue of NT$819 million in 2021, which represents 41 percent year-over-year growth. The fourth quarter revenue hit record high of NT$269million.  Annual shipment of SoCs embedded with Andes CPU cores reached 3 billion in 2021 which represents over 50 percent year-over-year growth. Since inception, the cumulative shipments surpassed a remarkable record of 10 billion.  As of 2021, the cumulative number of IP license contracts exceeded 370. Design wins included many leading companies, such as MediaTek, Renesas, SK Telecom, EdgeQ, HPMicro, Kneron and many others.  The applications of Andes’ licensees are diversified. The top five customer applications are AI, Touch Panel, Wireless/IoT, MCU and 5G in 2021.  More than 500 ecosystem partners.  Andes issued its overseas Global Depositary Receipt (GDR) on the Luxembourg Stock Exchange, making Andes the only international public RISC-V CPU IP supplier.  Andes won “Featured IoT Cybersecurity Chip Supplier” of 2021 EE Awards Asia hosted by EE Times and EDN. Its vector processor IP NX27V also won “Best EDA/IP of the Year” in the product category.  Frankwell Lin, Chairman and CEO, was awarded “Outstanding Manager Award” by Professional Management Association of Hsinchu, Taiwan.  Dr. Charlie Su, President and CTO, won RISC-V Technical Contributor Award in recognition of his contribution as Vice Chair of the RISC-V International Technical Steering Committee. Focus on CPU IP The strategic technology of CPU IP is indispensable in SoC design. Andes Technology has been devoted to developing CPU IP technology for over 17 years and it is one of the few companies in the world that provides commercial CPU IP and has customers producing high-volume SoC constantly. The annual shipment of SoCs embedded with Andes CPU cores surpassed 3 billion in 2021 and the cumulative shipments hit the milestone of more than 10 billion. Andes keeps driving innovation and launches comprehensive RISC-V CPU IP series, including entry-level 32-bit N22, mid-range N25F/D25F/A25/A27 and 64-bit NX25F/AX25/AX27 and multicore A(X)25MP, vector processor NX27V and the latest superscalar 45-series with 32-bit N45/D45/A45, 64-bit NX45/AX45, and multicore A45MP and AX45MP. Its world-leading RISC-V processor cores with DSP instruction set and vector extension become the best solutions for emerging applications such as 5G, AI/ML, ADAS, AR/VR, blockchain, cloud computing, data center, IoT, storage, security and wireless devices. Active Role in Promoting RISC-V Andes is the Founding Premier Member of RISC-V International Association. Frankwell Lin, CEO of Andes, is the Board Director of RISC-V International. Charlie Su, President and CTO of Andes, was Vice Chair of RISC-V International Technical Steering Committee in 2021. Every year Andes hosts events including RISC-V CON in Taiwan, China and the US as well as over 30 Chinese and English webinars which attracts audience around the world with more than 10 thousand views online. Andes also participates major industry exhibitions, such as Embedded World, DAC, TSMC Symposium and promotes them through social channels to increase awareness of RISC-V. Certification Test Andes Certified Engineer Test (ACET™) Program, hosted by Andes since 2013, issues nearly 200 certificates to engineers who pass the test every year as a reference of recommendation for recruitment in the industry. Emphasis on Corporate Responsibility and Industry–Academia Collaboration With emphasis of corporate responsibility and sustainable values, Andes has devoted itself to developing low power/high performance green power-saving CPU in order to increase power efficiency and protect the environment. For industry–academia collaboration, Andes has provided AndesCore™ processor IP to universities around the world for courses, research projects and established joint laboratories with many universities. The total number of contracts with universities (mainly EE and CS departments in Taiwan, China and the US) is over 150. By establishing long term industry–academia collaboration, Andes aims to cultivate talents, communicate with higher education institutions and fulfill corporate responsibility.

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Linearin Technology Corporation

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Wayon Electronics Co., Ltd.

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Established in 1996, WAYON is the domestic top company in circuit protection by revenue, specializing in the design, manufacture and sales of circuit protection & power control components and semiconductor solutions. With rapid growth in business, the sales revenue in 2021 is RMB1.2 billion. As a global circuit protection and power semiconductor device supplier, WAYON has three product lines: circuit protection, power semiconductors, and IC products. Circuit Protection: PTC, FUSE, SCF, ESD&EOS, ESD&EMI, PTVS and TSS; Power Semiconductor: SJ MOSFET, LV/MV MOSFET, Diode, Transistor; IC Products: OCP, OVP, OTP, Type C, E-Fuse, LDO, DC/DC, Charge IC, PMIC; Signal Chain IC: CAN, RS485 transceivers. WAYON products are widely used in consumer electronics, industry, IoT, automotive, new energy and network communications etc. WAYON is the largest circuit protection company in China, with PTC ranking 1st in China, 3rd in the world; three-terminal self-control fuse ranking 1st in China, 3rd in the world; both TVS & SJ MOSFET being internationally advanced, domestic leading. Specifically, in the circuit protection market, WAYON is the largest domestic company in terms of sales revenue, and the one with the most comprehensive product lines in China. On the one hand, WAYON has assumed domestic substitution responsibility in many circuit protection areas (sometimes the only company with domestic substitution capability in some areas); on the other hand, the company's market share is growing as the concentration of the circuit protection industry itself increases. In the power control market, WAYON SJ MOSFET are widely recognized by customers. Adhering to the technological innovation policy, WAYON has a promising future in the power control field. WAYON has numerous self-developed core patented technologies. Most of them are more advanced than the industry mainstream technologies. 1. Low resistance high current PPTC technology (self-developed, international invention, Shanghai Invention Patent First Prize, China Invention Patent Excellence Award) By using the low resistivity special-structure conductive particles, WAYON has made a low resistivity PPTC composite materials to control the PPTC resistance within 1.5 milliohms when chip size at 3.0 * 4.0mm. A single-layer 1210 package can achieve 4.5A current carrying. Compared to the mainstream level, Wayon technology is domestically and internationally advanced. 2. IPD-based EMI filtering protection technology (self-developed, utility model patent) The use of integrated silicon-based common-mode coils and ESD chip technology can significantly reduce the PCB board area, and increase the differential-mode bandwidth (up to 4GHz). The common mode rejection can reach 23dB at 1GHz. The industry mainstream LC/RC mostly uses discrete devices, which occupies a large PCB area (expensive & performance affecting). The capacitors are mainly ceramic type, large in size & of poor temperature stability. Our technology is domestically leading and internationally advanced. 3. Ultra-high voltage SJ MOSFET design and process technology (self-developed, utility model patent) WAYON 1000V & 1050V ultra-high voltage SJ MOSFET features low switching losses and high power density. For conventional TO-252 package, the Rdson can reach as low as 1 ohm, which facilitates the miniaturization of power supply systems. While the industry 1000V MOSFET Rdson is usually at 3 ohms for TO-252, not suitable for high-power and small volume power supply systems. Compared to the mainstream level, Wayon technology is domestically leading and internationally advanced. 4. High-precision intelligent protection chip technology (self-developed, utility model patent) High current product’s current limit accuracy is ±10%. The overvoltage threshold accuracy can reach ±0.84% by using the measurement trimming technique which eliminates the tolerance caused by wafer-test & package test. The industry current limit accuracy of high current products is controlled within ±20%, over-voltage threshold accuracy around ±2%. Compared to the mainstream level, Wayon technology is domestically leading and internationally advanced. ….. In 2021, the total shipment is more than 10 billion units. Wayon has established stable and long-term cooperative relationships with many well-known downstream manufacturers. WAYON has also maintained very good interaction with its end customers for customer product design & development, which greatly increases our product competitiveness and customer stickiness for a better industry chain ecology building.

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SIGLENT TECHNOLOGIES CO., LTD

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M31 Technology Corporation

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M31 Technology Corporation is a professional silicon intellectual property (IP) provider. With over ten years of extensive knowledge in IP development, M31 specializes in high-speed interface IPs, including USB, MIPI, PCIe, SATA, SerDes, etc., as well as Fundamental IPs, including cell library design, memory design, and GPIO for the advanced process. Based on a strong customer portfolio and in-depth understanding of the needs of IC designers, M31 also provides IP integration services that enable customers to focus more productively on differentiation and system-level integration of chip designs rather than configuring standards-based IPs, thus helping our customers accelerate IC design implementation and improve SoC products’ competitiveness in terms of performance and cost in the shortest possible time. M31 delivers a broad portfolio of silicon-proven IP to meet the diverse IC design needs of trending application markets, including AI accelerator, Edge computing, Customized IoT, 5G, Automotive, and Data-centric computing.

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Shanghai Yizhu Intelligent Technology Co. Ltd.

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SemiDrive

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SemiDrive Technology has focused on providing high-performance and high-reliability automotive-grade chips and is also the first provider of “full-scenario and platform-based” chip product and technical solutions in the world. The products have included intelligent e-cockpits, autonomous driving, gateways and MCUs, and covered the most core chip categories of automotive electrical / electronic (E/E) architecture in the future, thus achieving “four-chip-in-one, empowering the vehicle with a soul”. SemiDrive Technology has had an international-level team with nearly 20 years of experiences in automotive-grade mass production, and is also one of the few complete-system teams with automotive-grade core chip product definition, technology research and development and mass production implementation in the country. In terms of automotive-grade certification, SemiDrive Technology has successively obtained such certifications as ISO 26262 functional safety process, AEC-Q100 reliability ISO26262 functional safety product and national secret, so that it has become the first four-certificate-in-one domestic automotive-grade chip enterprise. At present, SemiDrive Technology has completed the tape-out of four-series chips, the highest specification automotive-grade certification and the mass production implementation, served more than 260 clients and covered more than 90% of auto manufacturers in China.In 2021, in the midst of the chip crisis, Infotainment SoC X9, Intelligent Driving SoC V9, and Gateway SoC G9 developed by SemiDrive were shipped in batches, addressing the urgent needs of customers. The intelligent cockpit chip Infotainment SoC X9 can simultaneously drive up to 10 high definition displays including instruments, central control, rearview mirror and rear seat entertainment through a single chip, and support multi-screen sharing and interaction to meet the functional demands of intelligent cockpits in the future. SemiDrive is one of the few companies which can provides automotive-grade Gateway SoC. G9 Gateway can support seamless data exchange between different vehicle body networks such as CAN, LIN and Ethernet, but also support the access of 5G/C-V2X networks, thus establishing a stable and reliable data channel inside and outside the vehicle and realizing high-traffic and low-latency information exchange. On April 12, 2022, SemiDrive released the automotive-grade MCU E3 microcontroller series products with high performance and high reliability, which may be comprehensively applicable to the applications that require extremely high security and high reliability, including drive-by-wire chassis, brake control, BMS, ADAS / autopilot motion control, LCD instruments, HUD and streaming media vision system CMS. The automotive-grade reliability standard of E3 reaches AEC-Q100 Grade 1 level and the functional safety standard reaches ISO 26262 ASIL D level; with the adoption of dual-core lock-step Cortex-R5, it has achieved up to 99% of diagnostic coverage; and that above-mentioned two automotive-grade standards MCUs are met at the same time can be second to none even on a global scale. Before it is officially released, nearly 20 clients have designed their products in advance based on E3. At present, the samples have been open to the clients and the development models applied in terms of full series of E3 products, and it is expected to achieve mass production in the third quarter of this year. SemiDrive Technology has provided a complete tool chain support for design solutions from chips to development kits, and been committed to creating a complete ecosystem for the users. It is well known that “Central Computing Platform” is the general trend of automotive electronic / electrical architecture in the future. As the only chip manufacturer in China that can provide the full-platform-level solutions and be compatible with various domain control architectures of mainstream vehicle manufacturers, SemiDrive Technology also took the lead in releasing the future-oriented “SemiDrive Technology central computing architecture SCCA 1.0” . The architecture not only supports the safe and reliable task deployment but also has a flexible system expansion capability.

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Shanghai Eigencomm Technologies Co., Ltd.

Cellular IoT Chip

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Silicon Labs

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Horizon Robotics

Horizon Hobot Platform

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In July 2021, Horizon Robotics announced its third-generation Journey 5, designed for all level of autonomy, delivering 128 TOPS at less than 30W. Journey 5 is ASIL-B, Cybersecurity ISO 21434 compliant and will be the heart of central computers, to realize the promise of AI in automated driving, integrated with intelligent cockpit interactions. The Horizon Journey 5 has powerful deep learning computing capabilities, high energy efficiency, low latency, and provides the strongest real AI performance. Diverse computing with efficient combinations, integrated optimized programmable computing resources, and flexible hardware acceleration. In addition, Horizon Journey 5 is equipped with rich sensor access and communication interfaces, complete I/O configuration and system support to adapt to driving scenarios, and has internationally certified safety and reliability, functional safety, expected functional safety, network security, software development, vehicle regulation reliability, etc., which can fully meet the requirements of high-level, automatic driving mass production. Horizon Journey 5 is the first to achieve front-loading mass production of the domestic top 100 TOPS level large computing power AI chip, with its official launch, Horizon has become the industry's only provider that can cover from L2 to L4 intelligent driving chip solutions.

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Hangzhou Nano-Core Chip Electronic Technology Co., LTD

Asynchronous event-driven AIoT chip architecture, Adaptive voltage and frequency scaling, Dynamic charge-domain analog signal chain, Analog DAC/ADC-free computing-in-memory AI technology

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Bouffalo Lab (Nanjing) Co., Ltd.

Wifi6, BT, Zigbee and Thread wireless connection all-in-one

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Newsight Imaging

NSI9000 eTOF™ (enhanced Time-of-Flight)

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Newsight Imaging is an Israeli semiconductor startup founded in 2016 with the goal of making 3D technology accessible for mass market applications across many industries. Newsight is a designer, developer, and manufacturer of advanced 3D CMOS sensor chips and spectral sensors – from chip to full sensing unit. Newsight develops advanced solutions for two business units: Machine vision and Spectral Analysis. One small sensor enables 3D vision for countless applications - Automotive, Industry 4.0, Smart City & Robotics, Metaverse, and Surveillance. Newsight’s unique combination of great performance and attractive price is granting the company growing recognition as one of the leading companies to watch in the semiconductor industry. For example, the company was awarded the Frost and Sullivan 2022 Leadership Award for the leading European automotive sensor category and was selected as one of the 100 startups to follow in 2022 by EETimes Magazine. Newsight day viewed its patented eTOF technology using the NSI1000 sensor in 2020, gaining traction and interest from big industry players across all sectors. During these 2 years, we have had opportunities to learn the markets’ needs and develop our product line and technology accordingly, and we are proud to present our new flagship sensor launching this month, the NSI9000. With a full matrix of 1024 x 480 global shutter pixels, the depth resolution will be nearly 500K pixels. The NSI9000 is an advanced eTOF sensor, using new eTOF patents to enlarge the range and accuracy for longer distances (up to 100 meters). Returned pulse sampled in 4 windows, Distance is calculated by the ratio of window A and window B, or window B and window C. Each frame accumulates charge from many sub-frames, even 100K times, according to the accumulated exposure needed, to get optimal signal per distance and reflectivity. The eTOF technology is based on short pulses that save power consumption. This resourceful method of calculation enables LiDAR level performance without affecting the price. The sensor is durable and has gated imaging technology for accurate detection in any environment and lighting condition, supporting laser Range-Gated Imaging – slicing the scenery to observe through obscurants (rain, fog, smoke, haze). A key selling point for customers is the sensor’s flexibility, with unique features like multi-set feature, allowing a configuration per frame to mix different modes like 3D and camera and achieve high dynamic range. It can also sync with other camera units and avoid interference. The full board design allows AI and IoT connectivity for the sensor and transmitted data, enabling real-time decision support. The most important feature that was pre-designed into the sensor with the client's need in mind is the event-based capabilities, meaning the sensor uses dynamic event detection and transmits the data only when a change in the pixel is detected. This feature is crucial for lowering the bandwidth, especially in major IoT applications (programmable threshold pre-programmed value).

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Beijing Smartchip Microelectronics Technology Company Limited

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SCA AI Video Integrated Chip is a pure domestically produced AI multi-core heterogeneous chip with build-in codec module based on independently designed SoC architecture with the AI multi-core heterogeneous processor. It is safe, reliable and has high energy efficiency with excellent image processing effect. A variety of AI algorithms is adapted to the chip, and an IDE development tool and a SDK tool chain are independently designed. The chip is functional and easy to use. Typical power consumption of the product is less than 2.5W（ 4k@30fps +Conventional neural network reasoning). The NPU is up to 1GHz, maximum 2Tops@int8 Computing power. It supports int16, int8 fixed-point reasoning, multiple deep learning frameworks, complete APIs and tool chains. It contains reconfigurable computing units, which can support up to 0.25tops programmable computing power and can flexibly customize various operators. It can support maximum 4K@30fps and has the ability of 3D noise reduction and hardened 6-tof digital anti shake. The technology of this product improves the image processing ability through AIISP. It contains reconfigurable hardware, more complete open tool chain, and supports the efficient transplantation of algorithms. The main advantages are as follows: 1. Chip independence: Pure domestic production; Independent intellectual property rights; Third party IP authorized in China; Stable Supply. 2. Intelligent improvement of image quality: ISP unit integrated with AI, which has obvious noise reduction effect in night vision environment; Super wide dynamic, digital anti shake, photosensitive noise reduction, which realizes high-quality image output in dark light, backlight, motion and other scenes. 3. Ecological opening: having visual debugging tools that can realize visualization and reduce the difficulty of customer development; Adapting to more sensors, and having strong compatibility and wider application range; Supporting IDE development environment - Smart studio, with which the cloud training model can be quickly transplanted to the chip through visual development tools, reducing the difficulty of customer model deployment. . Reconfigurable hardware: software code and hardware structure can be dynamically optimized for input data, which has strong flexibility; Supporting hardware reuse for new problems and algorithms; Flexible response to various fragmented application requirements. 5. Operating system autonomy: a fully autonomous operating system - Hub OS; 6. Higher security: supporting terminal identity authentication based on SM algorithms and encrypted transmission of key information. The technology of this chip is superior to other chips of the same type in image processing effect, energy efficiency ratio and power consumption, as shown in the following table. Main technical indicators This project Domestic similar technology Foreign similar technology Comparison results energy efficiency (Tops/W) 0.8 0.4 0.667 0.6 Industry leading level Power Consumption (W) 2.5 2.5 3 3 Throughput (Top/s) 2 1 2 1.8 The application of this technology can improve the intelligent level of operation and maintenance management, and improve the intelligence and efficiency of video monitoring. It can effectively improve the autonomous and controllable level of artificial intelligence chips in the industrial control field, and lead a new direction for the development and application of AI chips in the industrial control field.

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Silicon Labs

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Silicon Labs announced the BG24 and MG24 families of 2.4 GHz wireless SoCs. This new co-optimized hardware and software platform will help bring AI/ML applications and wireless high performance to battery-powered edge devices. First Integrated AI/ML Acceleration Improves Performance and Energy Efficiency IoT product designers see the tremendous potential of AI and machine learning to bring even greater intelligence to edge applications like home security systems, wearable medical monitors, sensors monitoring commercial facilities and industrial equipment, and more. But today, those considering deploying AI or machine learning at the edge are faced with steep penalties in performance and energy use that may outweigh the benefits. The BG24 and MG24 alleviate those penalties as the first ultra-low powered devices with dedicated AI/ML accelerators built-in. This specialized hardware is designed to handle complex calculations quickly and efficiently, with internal testing showing up to a 4x improvement in performance along with up to a 6x improvement in energy efficiency. Because the ML calculations are happening on the local device rather than in the cloud, network latency is eliminated for faster decision-making and actions. The BG24 and MG24 families also have the largest Flash and random access memory (RAM) capacities in the Silicon Labs portfolio. This means that the device can evolve for multi-protocol support, Matter, and trained ML algorithms for large datasets. PSA Level 3-Certified Secure VaultTM, the highest level of security certification for IoT devices, provides the security needed in products like door locks, medical equipment, and other sensitive deployments where hardening the device from external threats is paramount. AI/ML Software and Matter-Support Help Designers Create for New Innovative Applications In addition to natively supporting TensorFlow, Silicon Labs has partnered with some of the leading AI and ML tools providers, like SensiML and Edge Impulse, to ensure that developers have an end-to-end toolchain that simplifies the development of machine learning models optimized for embedded deployments of wireless applications. Using this new AI/ML toolchain with Silicon Labs's Simplicity Studio and the BG24 and MG24 families of SoCs, developers can create applications that draw information from various connected devices, all communicating with each other using Matter to then make intelligent machine learning-driven decisions. For example, in a commercial office building, many lights are controlled by motion detectors that monitor occupancy to determine if the lights should be on or off. However, when typing at a desk with motion limited to hands and fingers, workers may be left in the dark when motion sensors alone cannot recognize their presence. By connecting audio sensors with motion detectors through the Matter application layer, the additional audio data, such as the sound of typing, can be run through a machine-learning algorithm to allow the lighting system to make a more informed decision about whether the lights should be on or off. ML computing at the edge enables other intelligent industrial and home applications, including sensor-data processing for anomaly detection, predictive maintenance, audio pattern recognition for improved glass-break detection, simple-command word recognition, and vision use cases like presence detection or people counting with low-resolution cameras.

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CEVA, Inc.

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NeuPro-M, its latest generation processor architecture for artificial intelligence and machine learning (AI/ML) inference workloads. Targeting the broad markets of Edge AI and Edge Compute, NeuPro-M is a self-contained heterogeneous architecture that is composed of multiple specialized co-processors and configurable hardware accelerators that seamlessly and simultaneously process diverse workloads of Deep Neural Networks, boosting performance by 5-15X compared to its predecessor. An industry first, NeuPro-M supports both system-on-chip (SoC) as well as Heterogeneous SoC (HSoC) scalability to achieve up to 1,200 TOPS and offers optional robust secure boot and end-to-end data privacy. NeuPro–M compliant processors initially include the following pre-configured cores: • NPM11 – single NeuPro-M engine, up to 20 TOPS at 1.25GHz • NPM18 – eight NeuPro-M engines, up to 160 TOPS at 1.25GHz Illustrating its leading-edge performance, a single NPM11 core, when processing a ResNet50 convolutional neural network, achieves a 5X performance increase and 6X memory bandwidth reduction versus its predecessor, which results in exceptional power efficiency of up to 24 TOPS per watt. NeuPro-M is capable of processing all known neural network architectures, as well as integrated native support for next-generation networks like transformers, 3D convolution, self-attention and all types of recurrent neural networks. NeuPro-M has been optimized to process more than 250 neural networks, more than 450 AI kernels and more than 50 algorithms. The embedded vector processing unit (VPU) ensures future proof software-based support of new neural network topologies and new advances in AI workloads. The CDNN offline compression tool can increase the FPS/Watt of the NeuPro-M by a factor of 5-10X for common benchmarks, with very minimal impact on accuracy. The NeuPro-M heterogenic architecture is composed of function-specific co-processors and load balancing mechanisms that are the main contributors to the huge leap in performance and efficiency compared to its predecessor. By distributing control functions to local controllers and implementing local memory resources in a hierarchical manner, the NeuPro-M achieves data flow flexibility that result in more than 90% utilization and protects against data starvation of the different co-processors and accelerators at any given time. The optimal load balancing is obtained by practicing various data flow schemes that are adopted to the specific network, the desired bandwidth, the available memory and the target performance, by the CDNN framework. Highlights include: • Main grid array consisting of 4K MACs (Multiply And Accumulates), with mixed precision of 2-16 bits • Winograd transform engine for weights and activations, reducing convolution time by 2X and allowing 8-bit convolution processing with <0.5% precision degradation • Sparsity engine to avoid operations with zero-value weights or activations per layer, for up to 4X performance gain, while reducing memory bandwidth and power consumption • Fully programmable Vector Processing Unit, for handling new unsupported neural network architectures with all data types, from 32-bit Floating Point down to 2-bit Binary Neural Networks (BNN) • Configurable Weight and Data compression down to 2-bits while storing to memory, and real-time decompression upon reading, for reduced memory bandwidth • Dynamically configured two level memory architecture to minimize power consumption attributed to data transfers to and from an external SDRAM

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Axera Semiconductor (Shanghai) Co., Ltd

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KUNLUNXIN（Beijing）Technology Co.Ltd

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Canaan Inc.

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Canaan’s AI reasoning chip, the Kendryte K510, is equipped with a self-developed visual neural network accelerator (KPU2.0), Canaan’s proprietary computing data flow technology, and a computing array that integrates 3D dimension and multi-level storage structure. Through dynamic chip management and utilization of high-frequency data, the benefits are twofold: improved computing efficiency of the processor and reduced power consumption of the chip. These provides viable solutions to the storage and performance challenges currently plaguing conventional terminal AI chip design. Canaan is an industry pioneer when it comes to CPU design, deploying RISC-V instruction set (ISA) to develop its terminal SoCs. Specifically, the Kendryte K510 has a dual-core 64-bit RISC-V CPU and a digital signal processor (DSP) with up to 800Mhz frequency equipped, to support the growth of AI-related applications. The Kendryte K510 integrates the latest generation of image processing ISP in its visual subsystem design, supporting TOF depth camera access, 2D/3D noise reduction, wide dynamic range WDR, RGB & IR fusion, hardware 3A and other complete functions. TOF sensor solutions are also supported by our 3D ISP. Common chip applications include: AI IPC, drone aerial photography, professional photography, robots, AI STEAM, edge computing boxes and other scenarios.

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Hangzhou Nano-Core Chip Electronic Technology Co., LTD

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Shanghai Yizhu Intelligent Technology Co. Ltd.

CIMD （Computing-in-memory Digital) technology based on ReRAM (RRAM)

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Shanghai Kuxin Microelectronics Limited Co., Ltd.

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STMicroelectronics

Gen3 SiC MOSFET: Big innovation and breakthrough in high-voltage switching

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Generation 3 SiC MOSFET technology has: A. Outstanding features 突出的特点 1. Designed also for automotive-grade (AG) 适用于汽车级（AG） 2. Very high operating temperature (max. TJ = 200 °C) 极高工作温度（最大Tj=200°C） 3. Very high switching frequency operation and very low switching losses 开关频率极高，开关损耗极低 4. Low on-state resistance 低导通电阻 5. Gate drive compatible with existing ICs 与现有集成电路均兼容的栅极驱动 6. Typical Vgs=18V 典型Vgs值为18V 7. Very fast and robust intrinsic body diode 速度非常快且坚固的本征体二极管 Reduced form factor and increased power density 减小了形状因子并提高了功率密度 8. Optimized Rdson*chip Area and Rdson*Qg for very low total energy losses 优化Rdson* chip area和Rdson*Qg，实现极低的总能量损耗 9. Wide voltage range 650V, 750V, 900V, 1200V 宽电压范围650V、750V、900V、1200V 10. Easy paralleling for even higher power 易于并联，功率更高 B. Technical specs 技术规格 1. Planar technology平面技术 2. Ron*A FoM: 750V (1.8mΩ*cm2) 1200V (2.8mΩ*cm2). 3. Broad range of breakdown voltages: 650V, 750V, 900V, 1200V 击穿电压范围广：650V、750V、900V、1200V 4. Technology qualified automotive 车规级技术 5. First products available is the 650V SCT040H65G3AG in H2PAK-7. 首批产品：采用H2PAK-7封装，650V的SCT040H65G3AG The new third-generation devices will be offered in various forms, including bare dice, discrete power packages such as STPAK, H2PAK-7L, HiP247-4L and HU3PAK and power modules of the ACEPACK family. 全新第三代器件将以各种形式提供，包括了裸片、分立功率包装，如STPAK、H2PAK-7L、HiP247-4L和HU3PAK，以及ACEPACK系列的功率模块。 C. Key application benefits vs. Silicon 与硅基产品相比的关键应用优势 1. Increase power efficiency with 50% lower losses and 5x frequency 提高功率效率，损耗降低50%，频率提高5倍 2. 20% Reduced Total Cost of ownership 降低20%总拥有成本 3. 70%~80% reduced / smaller size with an average weight reduction of 50% 尺寸缩小70%-80%，平均重量减轻50% 4. Simplified cooling system 简化的冷却系统 D. Key applications 主要应用 1. This 3rd generation of STPOWER silicon-carbide (SiC) MOSFETs, advancing the state-of-the-art in power devices for electric-vehicle (EV) powertrains and other applications in the industrial domain where power density, energy efficiency, and reliability are important target criteria. 这是第三代STPOWER碳化硅（SiC）MOSFET产品，推动了电动汽车（EV）动力系统和其他工业领域应用的最先进功率器件，其中功率密度、能效和可靠性是重要的目标标准。 2. ST’s new SiC devices are specifically optimized for these high-end automotive applications including EV traction inverters, on-board chargers, and DC-DC converters, as well as e-climate compressors. The new generation also suits industrial applications by boosting the efficiency of motor drives, renewable-energy converters and storage systems, as well as telecom and datacenter power supplies. ST的新型碳化硅产品专门针对高端汽车应用进行了优化，包括电动汽车牵引逆变器、车载充电器、直流-直流转换器以及电子空调压缩机。新一代产品还通过提高电机驱动、可再生能源转换器和存储系统以及电信和数据中心电源的效率，适合工业应用。 E. Potential impact on electronics design and the electronics industry. 对电子设计和电子行业的潜在影响 With this 3rd generation of STPOWER SiC MOSFET, the effort continues to drive the transformation of the EV and industrial markets. With the acceleration of the EV market many car makers and automotive suppliers are now embracing 800V drive systems to achieve much faster charging and help reduce EV weight. These new systems allow the car makers to produce vehicles with longer driving ranges. ST’s new SiC devices are specifically optimized for these high-end automotive applications including EV traction inverters, on-board chargers, and DC-DC converters, as well as e-climate compressors. The new generation also suits industrial applications by boosting the efficiency of motor drives, renewable-energy converters and storage systems, as well as telecom and data-center power. 凭借第三代STPOWER SiC MOSFET产品，我们将继续推动电动汽车和工业市场的转型。随着电动汽车市场的加速发展，许多汽车制造商和汽车供应商现在正在采用800V驱动系统，以实现更快的充电并帮助减轻电动汽车的重量，而这些新系统使汽车制造商能够生产行驶里程更长的汽车。ST的全新碳化硅产品专门针对这些高端汽车应用进行了优化，包括电动汽车牵引逆变器、车载充电器、直流-直流转换器以及电子空调压缩机。新一代产品还通过提高电机驱动、可再生能源转换器和存储系统以及电信和数据中心电力的效率，适合工业应用。

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Leadtrend Technology Corporation

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The following products are the new technologies and products released in the past December. The following product technologies can be used with GaN solutions for overall application to achieve the purpose of miniaturization and performance improvement, including application to PD fast The matching of the overall plan 1. LD5555 ( QR/CCM Flyback for PD application / Compatible with GaN MOS) EFFICIENCY TRACKING METHOD OF A CONTROLLER APPLIED TO A FLYBACK POWER CONVERTER An smart efficiency tracking method is proposed, including that before the controller starts buffering, the controller outputs an initial frequency reduction curve setting detection current to an initial frequency reduction curve setting detection resistor. The initial frequency reduction curve setting voltage generated by the detection resistor can be determined The frequency reduction curve of the flyback type power converter can be used to adjust the initial frequency reduction curve to set the resistance value of the detection resistor to achieve the purpose of optimizing the efficiency; and the controller controls the flyback type power converter according to the efficiency tracking method The operating output voltage of , tracks the maximum power point of the flyback power converter for efficiency optimization purposes. Therefore, compared with the prior art, because the present invention does not adjust the current detection resistor applied to the primary side of the flyback power converter, the efficiency tracking method provided by the present invention is used in the flyback power converter. When the secondary side outputs different charging conditions, the output power of the secondary side of the flyback power converter can still be maximized. The smart efficiency tracking method is used to optimize the efficiency, so that the system can obtain the best conduction and switching loss. Take the 65W system as an example: under the condition of input voltage 230Vac & system load 5V/10W, the efficiency will be improved to +10.92% compared with the original system .LD7798 (PFC + QR Flyback Combo) 2. LD7798 (PFC + QR Flyback / Compatible with GaN MOS ) a. Optimization and Analysis of Power Factor Corrector Controller This paper proposes a PFC + Flyback architecture and multi-output voltage application in USB PD, which can detect input voltage, output load voltage and current through IC, and intelligently switch PFC ON/OFF to optimize efficiency, improve light-load efficiency, and at the same time Above 75W load and can meet harmonic specifications. b. The active sink current of OUT pin for high freq. How to detection the duty cycle!! As following Fig 2 & Fig 3. 1. We use the ton time to set down current. a. If the ton is higher than 35%, then V132 will pull to high level. à Isink b. If the ton is lower than 35%, then V132 will pull to low level. à Isink 2. The active sink current of OUT pin. a. This feature appears only in low line input; reduce the effects of EMI. (Fig 4 & Fig 5.) b. Result Comparison. 3. LD6612 (USB Power Delivery) Limited Power Source (LPS) for USB Power Delivery (PD) Application – This proposal proposes to use the PD IC to control the MOS at the output end to cut off the output power of the switch segment to achieve compliance with the safety standard IEC 60950 Limited Power Source (LPS) specification. – The PD IC LPS ADC detection scheme has the following three (1) The method of detecting the voltage of the transformer TR (2) The method of detecting the VCC voltage of the synchronous rectifier IC (3) Detecting synchronous rectification IC driving voltage method 4. LD7593 (BCM PFC / Compatible with GaN MOS) Novel Multi-control output (DSCP, OCP, ZVS, Vo OVP) CS PIN with Power Factor Correction Circuits – This proposal proposes to use 1 PIN input detection, through Gate ON & OFF timing, to DSCP, OCP, Vo OVP protection, and ZVS detection to improve system efficiency. (a)PFC Gate ON + PFC Diode Off (1): 1 VCSZCD > VOCP => Over Current Protection 2 VCSZCD > VDSCP => Output Diode Short Circuit Protection (b) PFC Gate Off + PFC Diode On (2): 1 VCSZCD > VOVP => Output Over Voltage Protection (c)PFC Gate Off + PFC Diode Off(3): 1 ICSZCD < IVZCD => ZCD Detect & Turn on PFC Gate 5. LD7781E1 (LLC IC) A fixed cycle burst mode control method used in LLC topology • In burst mode, the burst period can be fixed, and the burst frequency can be controlled outside the audio frequency to reduce the noise generated by the operation in the burst mode • The ton of the MOSFET can be freely adjusted after entering the burst mode to control the energy transferred to the secondary in the next switching cycle of the burst mode to reduce the number of switching in the burst mode and reduce the input power consumption • To maintain the burst mode cycle, the minimum number of switches is set to 1

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Navitas Semiconductor Limited

Navitas GaNSense™ Technology

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Sensor
Amplifier / Data Conversion
Processor/DSP/FPGA
RF/Wireless/Microwave
Microcontroller/Interface
Power Management/Voltage Converter
Power semiconductor / Drive
Memory
High performance passive/Discrete Devices
EDA/IP/Software
Test & Measurement

Hitronics Technologies, Inc.

Solid state photomultiplier module/SPM456SE-00-2

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Solid-state Photodetector Module (SPM) can be called more pixels photon counters (MPPC) are solid-state semiconductor chips, through the semiconductor technology, each probe chip integration of tens of thousands of APD avalanche diode unit, can be induced, timing and quantitative low light signal, and the traditional vacuum tube type of photomultiplier tube (PMT), compared with unparalleled price advantage.Hitronics can package different SPM sensors into modules with low pressure operation, high sensitivity, small size inserts, robustness and excellent linearity and dynamic range. The module is mainly used in the field of biomedical weak light detection, sampling photomultiplier semiconductor technology, its photoelectric gain can reach 10⁶power, used to replace traditional vacuum tube type photomultiplier PMT, more low driving voltage, higher sensitivity, photoelectric easily embedded in a smaller size, more solid and reliable advantages. Can be used in ranging, lidar, high-energy physics, optical instruments and medical diagnostic equipment (such as flow cytometry analyzer, blood count, digital PCR detector, chemiluminescence immunoanalyzer), food safety detection and other fields. By integrating the low-light detection capabilities of PMT into compact, reliable and economical solid-state sensors, SPM is the direction of future development and application of very low light level detectors. Features • Solid-state semiconductor detector with scalability and reliability • Flexible configurations and package • High sensitivity with selective peak sensitivity • Built in temperature compensation, with optional TEC cooling • Ultra-compact size, low cost

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GigaDevice Semiconductor Inc.

GigaDevice Capacitive Fingerprint Sensor GSL6186 Series

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GigaDevice Capacitive Fingerprint Sensor GSL6186 Series adopts dual-chip technology, of which two chips can work independently or in turn, thus effectively reducing the operating power consumption of the chip. This series can be widely applied to fingerprint lock, bicycle lock, padlock, fingerprint USB disk and notebook and other market fields.  Type: Matte / Glossy coating  LGA Size: - Square: 13×13mm (max), 10.5×10.5mm (min) - Round: φ13mm (max), φ10.5mm (min)  Sensing Size: 6.4×3.2mm  Pixel Array: 128×64

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Melexis

3D-magnetometer MLX90397

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Melexis introduces the MLX90397, a 16-bit 3-axis sensor device that has a magnetic field range reaching 50mT (with an adaptive range on the z-axis of up to 200mT). The user can choose the fields to measure among BX, BY, BZ, temperature or a combination. The sensing element relies on the proven Triaxis® 3D Hall effect technology. Captured data is converted into a digital form and then transferred over an I2C interface. MLX90397 is designed to address 1.8/2.2/3.3V applications. The key benefits are: · The signal-to-noise (SNR) figures outperform other products on the market with a typical RMS noise of 2µT for a 50mT range. · The combination of a low 7nA power down current and a wide voltage supply range (1.7V to 3.6V) is ideal for battery powered applications. It not only provides maximum flexibility on the selection of the battery type (Alkaline, Lithium..), but also ensures an extended usage. The adaptive Bz field range up to 200mT simplifies customer designing with a back bias magnet (e.g. joystick) as it removes the constraint on the saturation. Another benefit is the inclusion of a pin. It allows the customer to set the output at a different voltage level than the main supply. This feature avoids the need to place extra level shifters to interface with the µC. The MLX90397 comes in a compact surface-mount 8-pin UTDFN package, with a footprint of just 2.0mm x 2.5mm and a height of only 0.4mm. This makes the devices easy to integrate - even into highly space-constrained electronic designs. A supported operational temperature range of -40°C to 105°C allows the use in demanding industrial applications. Among the most prominent applications are handheld power tools, gaming consoles, computer peripherals, home automation systems (window/door opening detection), energy metering (for anti-tampering purposes) and the controls of domestic appliances.

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Melexis

Unique plug-and-play magnetic switch MLX92362

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Melexis has introduced the MLX92362 and MLX92361 floating switches for continuous level sensing. The tiny, contactless and programmable ICs are claimed to provide better assembly yield and reliability in fluid level measurements. The isolated floating output of the MLX92362 only requires power to directly drive the load. Assembly is facilitated due to CMOS testability, solder reflow and contactless operation. A series of ICs can be synchronised via the same three-wire interface. Based on Triaxis technology, the patented floating switches deliver continuous level sensing. Programmability allows customers to fine-tune modules to optimise them for a specific application. These devices can be factory trimmed (MLX92361) or adjusted by the customer (MLX92362). The Hall switch devices directly replace reed switches, without the need for implementation changes or additional wiring, explained Melexis. They have smaller dimensions compared to reed switches – providing a five times reduction in form factor. Without moving parts, these solid-state components offer greater reliability and longer working lifespans, the company added and eliminate mechanical wear and tear issues. The high failure rates that reed switches often exhibit during module assembly are eliminated. The MLX92362 and MLX92361 both feature fully isolated output for direct load driving, with currents up to 100mA being switched. They offer a high supply rail versatility with a 4.5V to 28V voltage range. Multiple sensors can be connected in a single module and synchronised via the built-in daisy-chain functionality. Both the MLX92362 and MLX92361 are housed in six-lead TSOT packages. The surface mount format simplifies the assembly process through reflow soldering. They support an operational temperature range of -40 to +150 degrees C.

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ShenZhen Hoverbird Electronics Technology Co.,Ltd

NTC temperature sensor for New energy electric vehicles，type：HT6Q103NT

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The NTC temperature sensor product for new energy automotive motor developed by the company has the features of high accuracy, fast response, strong anti-electromagnetic interference (EMI), good consistency, strong anti-mechanical Strike ability and high reliability. It meets the requirements of long-term stable operation under very harsh environment such as oil pollution, EMI, mechanical pressure, high vibration, etc. inside the motor. The NTC temperature sensor is installed on the coil stator of the motor, and converts the temperature variable of the motor operation into the required electronic signal, which is transmitted to the motor controller for processing. The temperature of the motor motor is continuously monitored to ensure its long life and optimal performance. Each new energy automotive motor needs to be equipped with 2-4 temperature sensors, and the market prospects are good.

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SmartSens Technology (Shanghai) Co., Ltd.

SC850AT

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The SC850AT is designed to meet the growing demand of automotive customers for ADAS front-view cameras with four main advantages compared with the industry's mainstream 8MP CMOS automotive CIS: 1. The SC850AT features SmartClarity®-2 technology, which is supported by SmartSens’ proprietary SFCPixel® technology and PixGain technology with high gain, facilitating the SC850AT to increase its sensitivity by more than 50% compared to products of its type in the industry. Besides, the SC850AT's low noise reading circuit design and upgraded color process can significantly reduce the SC850AT's power consumption by more than 15%. Therefore, the SC850AT provides clear and detailed night vision with full color imaging at night, enabling dark light applications for night driving. 2. The SC850AT’s upgraded algorithm in Raw domain enables more details to be retained in high dynamic range image data, thus improving driving safety. 3. The SC850AT incorporates SmartSens’ innovative PixGain HDR® technology, which creates high quality HDR imaging without motion artifacts during fast moving by combining High Gain and Low Gain at the same exposure. The SC850AT also supports 3-exposure Staggered HDR at more than 120dB. The combination of the two high dynamic range technologies enables the camera to capture highlights and dark details more accurately, thus providing rich scene details. 4. The SC850AT is equipped with SmartSens’ self-developed LFS (LED Flicker Suppression) technology, which is designed with an advanced dual pixel structure, with the large pixel maintaining normal exposure time and the small pixel reducing sensitivity and extending exposure time to average out the flicker, resulting in a final output of LED flicker-free images. This ensures that the product meets OEMs’ rising demand for cameras to mitigate the flicker from LED lighting in cars, signs, buildings and other various outdoor illumination to ensure driving safety. Additionally, the SC850AT is developed based on the ASIL-D functional safety process standard and meets the requirements of AEC-Q100 Grade 2 and functional safety ISO 26262 ASIL B. It fully satisfies the automotive safety standards and ensures the reliability of the product.

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Texas Instruments

AWR2944 automotive radar sensor

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Empowering automakers to develop vehicles with increased visibility of their surroundings, the high-resolution 77-GHz AWR2944 single-chip automotive radar sensor can help automakers meet the latest automotive safety regulations and provides best-in-class radio frequency performance in a small form factor – approximately 30% smaller compared to radar sensors today. For automated parking and driving, being able to see farther with devices like the AWR2944 sensor leads to improved awareness and safety. The AWR2944 radar sensor can help automakers meet stringent safety regulations and provides best-in-class radio frequency performance in a small form factor – approximately 30% smaller compared to radar sensors today. By integrating a fourth transmitter, the AWR2944 can provide 33% higher resolution than existing radar sensors, enabling vehicles to detect obstacles more clearly and avoid collisions. In addition, the new sensor’s unique hardware supported by Doppler division multiple access (DDMA)-based signal processing improves the ability to sense oncoming vehicles at distances up to 40% farther away. TI’s AWR2944 radar sensor adds to the company’s extensive portfolio of analog and embedded processing products and technologies, giving automotive engineers more tools that can fuel vehicle innovation. The increased ability to quickly detect objects, monitor blind spots, and efficiently navigate turns and corners paves the way for automakers to achieve their vision of a collision-free future.

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Analog Devices, Inc.

ADPD6000——Multimode VSM Sensor Front End

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The ADPD6000 is a highly integrated analog front end (AFE) designed for measuring various vital signals. The optical channel is designed as an optical transceiver, stimulating up to four light emitting diodes (LEDs) and measuring the return signal on up to four separate current inputs. The signal chain rejects signal offsets and corruption from asynchronous modulated interference, typically from ambient light, eliminating the need for optical filters or externally controlled dc cancellation circuitry. The electrocardiography (ECG) signal acquisition is designed to support low noise, diagnostic level measurement in the presence of a variety of interferers. The ECG signal chain has a number of complementary features supporting ECG measurement, such as driven reference for common-mode rejection and lead off detection to identify a fallen electrode. The body impedance analysis (BIA) signal chain is designed for body impedance measurement with a configurable excitation path and measurement path. A 12-bit digital-to-analog (DAC) is used in the excitation path to generate the sinusoid wave and high precision measurement, with configurable filters used to measure the body response of the stimulus. The data output and functional configuration use a serial port interface (SPI) on the ADPD6000. The control circuitry includes flexible LED signaling and synchronous detection, digital filters, digital wave generators, and configurable filters. The ADPD6000 is available in a 2.6 mm × 2.6 mm, 0.4 mm pitch, 36-ball wafer level chip scale package (WLCSP). • Optical channel o 4 input channels with multiple operation modes for various sensor measurements o Dual channel processing with simultaneous sampling o 12 programmable time slots for synchronized sensor measurements o Flexible input multiplexing to support single-ended sensor measurements o 4 LED drivers, 2 of which can be driven simultaneously o Flexible sampling rate from 0.004 Hz to 9 kHz using internal oscillators o SNR of transmit and receive signal chain: 117 dB (with off-chip filtering) o AC ambient light rejection: 78 dB up to 100 Hz o 400 mA total LED peak drive current o Individual ambient light rejection DAC at TIA input with 9-bit control up to 300 μA o Individual LED dc cancellation DAC at TIA input with 7-bit control up to 190 μA • ECG channel o 0.75 μV rms RTI noise at diagnostic filter bandwidth (150 Hz) o High input impedance: 3 GΩ o Accepts up to 1.2 V of dc differential input range o Common-mode rejection ratio: 116 dB o Two-electrode and three-electrode configurations o AC lead off detection and dc lead off detection • BIA channel o Low power, high accuracy excitation path o Configurable output frequency up to 250 kHz o Sine wave excitation with a 12-bit DAC o High accuracy with large imbalance contact impedance o Configurable receive filters with low noise design o Complex impedance measurement engine o Supports both external calibration and internal calibration • SPI communications supported • 640-byte FIFO

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Prophesee

Evaluation Kit 4 HD

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Ultra-light and compact, Metavision Evaluation Kit 4 HD is the first to be specifically developed to enable the design of machine vision systems that use the breakthrough Sony IMX 636ES HD stacked event-based vision sensor released by Sony Semiconductor Solutions and realized in collaboration between Sony and PROPHESEE. The kit gives developers early access to the state-of-the-art Event-Based Vision sensor, which features an industry leading 4.86μm pixel pitch and 1280 x720 pixel resolution. It is ideal for full performance evaluation, supporting full sensor bandwidth of up to 1.6Gbps and maximum power of 1.5W via a USB 3 interface. The kit has been extensively tested to ensure it will perform in a wide range of challenging conditions, including change of temperature, damp heat, steady state, rough handling shocks, and is designed to manage electrostatic discharge effectively. The high precision engineering behind the kit ensures perfect optical alignment between the sensor, optical barrel and camera body. Developers can switch seamlessly between any C / CS mount compatible lens, from 8mm objective lens to microscopes’ or telescopes’ imaging ports. The underlying sensor leverages Prophesee’s event-based vision technology, making it ideally suited to industrial applications and use cases that require extremely high performance, low power operation and/or operation in challenging lighting conditions. KEY FEATURES •High Quality Aluminum alloy casing •Ultra-compact and light: 30x30x36mm, weighing just 40g •Built to endure (IEC certifications for T° / Heat / Shocks / Electrostatic discharge) •Easy to embed: 4x M2 front + 2x M2.6 back fixing points •C/CS mount •USB 3.0 Type-C connectivity •Maximum system bandwidth: 1.6 Gbps •Maximum system power 1.5W, powered via USB •Synchronization interface Free access to the most comprehensive Event-Based Vision software suite: Metavision Intelligence 2.3 onward

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WUHAN MENGXIN TECHNOLOGY CO.,TLD.

TYLOO MXT2708A GNSS Baseband and RF Integrated SoC

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ams OSRAM

Mira220 global shutter image sensor

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Growing demand in emerging markets for VR and augmented reality equipment depends on manufacturers’ ability to make products such as smart glasses smaller, lighter, less obtrusive and more comfortable to wear. This is where the Mira220 brings new value to the market, providing not only a reduction in the size of the sensor itself, but also giving manufacturers the option to shrink the battery, thanks to the sensor’s very low power consumption and high sensitivity at 940nm. The Mira220’s advanced back-side illumination (BSI) technology gives the sensor very high sensitivity and quantum efficiency with a pixel size of 2.79μm. Effective resolution is 1600px x 1400px and maximum bit depth is 12 bits. The sensor is supplied in a 1/2.7” optical format. The sensor supports on-chip operations including external triggering, windowing, and horizontal or vertical mirroring. The MIPI CSI-2 interface allows for easy interfacing with a processor or FPGA. On-chip registers can be accessed via an I2C interface for easy configuration of the sensor. The sensor combines excellent optical performance with very low-power operation. The Mira220 will support 2D or 3D sensing implementations in augmented reality and virtual reality products, in industrial applications such as drones, robots and automated vehicles, as well as in consumer devices such as smart door locks. The Mira220’s high quantum efficiency allows device manufacturers to reduce the output power of the NIR illuminators used alongside the image sensor in 2D and 3D sensing systems, reducing total power consumption. It enables wearable and portable device manufacturers to save space by specifying a smaller battery, or to extend run-time between charges.

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OmniVision

OX05B1S

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OX05B1S is the automotive industry’s first 5 megapixel (MP) RGB-IR BSI global shutter sensor for in-cabin monitoring systems (IMS). With a pixel size of just 2.2µm, it achieves the quantum efficiency (QE) of 36% at the 940nm NIR wavelength for the best performance in extremely low light conditions. The sensor comes in an OMNIVISION stacked a-CSP™ package that is 50% smaller than competitive products and allows for higher-performance image sensors in tighter camera spaces. The new OX05B1S brings dramatically improved resolution as well as overall enhanced efficiency and design flexibility to automotive OEMs. It has a wide field of view and enough pixels to view both the driver and occupants. So customers only need one camera instead of two for simultaneous driver and occupant monitoring systems, reducing complexity, cost and space. It is the first RGB-IR sensor for in-cabin monitoring to feature integrated cybersecurity, and has an “always on” optional feature.

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MEMSIC Semiconductor Co., Ltd.

Acceleration sensor MC3630

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The MC3630 is an ultra-low power, low-noise, integrated digital output 3-axis accelerometer with a feature set optimized for wearables and consumer product motion sensing. Applications include wearable consumer products, IoT devices, user interface control, gaming motion input, game controllers, remote controls and portable media products. Low noise and low power are inherent in the monolithic fabrication approach, where the MEMS accelerometer is integrated in a single-chip with the electronics integrated circuit. In the MC3630 the internal sample rate can be set from 14 to 1300 samples / second. Specific tap or sample acquisition conditions can trigger an interrupt to a remote MCU. Alternatively, the device supports the reading of sample and event status via polling.

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Renesas Electronics China

Ultra-Low Power ZMOD4510 Outdoor Air Quality Sensor Platform

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The enhanced ZMOD4510 is the industry’s first fully calibrated, miniature digital OAQ sensor solution with selective ozone measurement capabilities, offering visibility into the air quality in users’ immediate environments for a personalized experience. Ozone gas is a significant cause of poor outdoor air quality that poses health risks. Based on Renesas’ new ultra-low power firmware, the enhanced ZMOD4510 can detect specific ozone levels – without reporting on other pollutants – while maintaining power consumption under 200 uW. This selective measurement capability allows devices such as smart watches, phones, and smoke detectors to monitor for harmful ozone gasses typically found outdoors but which can drift indoors through open windows and doors. Optimizing the ZMOD4510 for very low power is key to enabling the longer life cycles required for these types of battery-powered devices.

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Molex

Accelerometer-based Road Noise Cancelling (RNC) sensor

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Molex is leveraging its long history in the automotive industry to focus on developing durable sensor technology that captures and cancels road noises while ensuring safer, more enjoyable driving experiences. This is accomplished by capturing the original noise signatures that are used within Active Noise Cancellation systems utilizing microphone- and accelerometer-based sensor assemblies. These sensors play critical roles in combatting unwanted road, wind and HVAC car noise while reducing low-frequency sounds that increase driver fatigue. Molex is collaborating with critical stakeholders in the Active Sound Management market, who are creating the Active Noise Cancelation (ANC) algorithms. The company is working with Silentium to better understand the optimal sense characteristics and placement that are needed for effective noise cancellation performance. The competitive advantage over the current noise dampening techniques (Sound deadening materials, double glazed windows, specialized tires, smoothed HVAC ducts, more ductile vehicle exterior material, etc.) is that Molex’s sensor, in collaboration with algorithms, creates a broad band of cancellation that targets multiple frequencies of sound. The aforementioned techniques independently focus on one range of frequencies, which allows for overall weight and cost reduction from an integration standpoint. The competitive advantage over other RNC sensor offerings is that Molex’s sensor is based on A2B technology, which lets the company daisy-chain the sensors to reduce cable complexity and weight. A2B technology also reduces latency, which is a key critical feature in the effectivity of Noise Management algorithms. The A2B chain also permits a higher channel count on the data stream, which minimizes the number of transceiver chips in the main processing unit. Taking advantage of Molex’s knowledge of harsh environment packaging, its RNC sensor can withstand extreme environmental conditions, such as high vibration and high-pressure water spray.

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Semiment Technology Co.,Ltd

SC9641 Two- Wire High Accuracy Differential Speed Sensor IC

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Excellent accuracy and sensitivity are specified for harsh automotive requirements with a wide temperature range, high ESD and EMC robustness. The regulated current output is configured for two-wire applications and the 2.0mm spacing between the dual Hall elements is optimized for fine pitch ring-magnet-based configurations.

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onsemi

High resolution of automotive-qualified image sensor AR0820AT

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The 8.3-megapixelis CMOS digital image sensor AR0820AT is specifically designed for automotive. With features such as higher dynamic range (HDR), enhanced low light performance, real-time functional safety mechanisms and fault detection, this sensor is improving road safety and ultimately enables a new generation of fully autonomous vehicles with essential 360-degree vision. The AR0820AT provides high resolution and HDR in a variety of poor lighting conditions, with 100 times the perception capability of human eye vision under all conditions, enabling detection and identification of smaller objects and other dangerous situations at longer distances (up to 185 meters), making contributions to enhance ADAS systems and more advanced autonomous driving systems, thereby improving road safety. Wafer stacking technology enables compact camera designs. It is optimized for both low light and challenging HDR scenes, with a 2.1 µm DR-Pix BSI pixel and on-chip 140 dB HDR capture capability. The advanced fault detection features and embedded data on the AR0820AT are key to enabling ASIL B compliant cameras that are critical for higher levels of autonomous driving. By moving the responsibility for fault detection from the main processor to the sensor itself, significant processing power is saved and any faults or issues are able to be detected far more quickly, allowing the vision system to return to a safe state before a potentially hazardous event occurs. The inbuilt cybersecurity ensures reliable and secure operation. The AR0820AT is at the heart of the vision system on the AutoX RoboTaxi – the first licensed fully autonomous taxi in China with hundreds of vehicles deployed in Shanghai, Shenzhen, Wuhan. The RoboTaxis each incorporate a total of 28 AR0820AT sensors, providing a full surround view with zero blind spots ensuring that they can handle the densest and most dynamic traffic conditions.

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C&B ELECTRONICS (SHENZHEN) CO., LTD.

CB350 High precision automotive grade current sensing module

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CB350 is mainly used in EV, HEV and DC charging piles, etc. CB350 products are small in size , requiring little space for assembly, and are highly assembleable; CB350 has ultra-high current sensing tolerance and superior over-current range sensing capability , which can adapt to various peak high current harsh working conditions; CB350 has ultra-high tolerance current sensing mathematical model, which can be quickly iterated; CB350 specifications are as follows. 1) Power supply voltage range: 6VDC~18VDC. 2) Product power consumption: 42mA@12VDC maximum. 3) Product operating temperature range: -40℃~105℃. 4) Product storage temperature range: -40℃~125℃. 5) Rated current sensing range and tolerance: -350A~350A, ±0.5%. 6) Over-range current sensing range and tolerance : -8000A~-350A & 350A~8000A, ±2%. 7) Insulation withstand voltage: 3500VDC. 8)Communication interface: CAN 2.0B, default integrated 120Ω terminal resistor. 9) Communication rate: 500kbit/s. 10) Product protection level: IP40 The CB350 has the following advantages and characteristics compared to its competitors. (1) The product is small in size, highly flexible, not high on assembly space, and can completely replace the same type of product as well as Hall and flux gate products from the structure. (2) The current sensing tolerance of the product is very high, in the full temperature range of -40℃~105℃, -350A~350A current range, the current sensing tolerance can be guaranteed within ±0.5%. (3) Ultra-current sensing range, can sense currents from -8000A to 8000A, which is many times the current range of Hall and flux gate current sensors. Ultra-high tolerance current sensing mathematical model, hardware platform design, can be rapid product iteration, corresponding to the various needs of the market.

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RoboSense

RS-LiDAR-M1

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RS-LiDAR-M1 (referred to as "M1") is independently developed and designed by RoboSense, and is currently the only second-generation intelligent solid-state LiDAR that has achieved mass production and delivery of vehicle specifications. As the second-generation lidar, M1 adopts a revolutionary two-dimensional MEMS smart chip scanning architecture. The product has fewer components and an extremely streamlined structure. It has unique advantages such as small size, stability and reliability, high performance, and dynamic adjustment of the scanning method. M1's unique intelligent "staring" function can dynamically adjust the resolution and refresh rate based on different driving scenarios such as high-speed and urban areas, greatly improving the perception ability of the intelligent driving system. In addition, M1 integrates RS-LiDAR-Perception, which can simultaneously output 3D point cloud data and target-level environment perception results, which is conducive to the rapid development and upgrade of OEM and Tier1 customer perception systems. At present, M1 has received a large number of orders for designated models from domestic and foreign car companies, including L3 heavy-duty truck solution technology companies, North American new energy car companies, Chinese car manufacturers, traditional OEMs, top supercar brands, etc. Covering models from passenger cars to commercial vehicles. M1 main specifications: 120°x25° ultra-wide field of view, 905nm laser wavelength, 200m (180m@10% NIST) ultra-long distance measurement, 0.2°x 0.2° high resolution, 15W ultra-low power consumption, 108 x 110 x 45 (DxWxH) (mm) compact profile, ~730g lightweight, ±5cm (1sigma) high accuracy, ~750,000pts/s (single echo) outputs, ~1,500,000pts/ (dual echo) outputs.

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Microchip Technology Inc.

Microchip LX34070 inductive position sensor

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The LX34070 inductive position sensor enables lighter, smaller, more reliable motor control solutions that meet stringent safety requirements, reduce overall system costs, and can operate seamlessly and precisely in the noisy environment of an automobile’s DC motors, high currents and solenoids. Designers can use the LX34070 to further streamline EV motor control designs by pairing it with other functional-safety-ready Microchip devices including our 8-bit AVR® and PIC® microcontrollers, our 32-bit microcontrollers, and our dsPIC® digital signal controllers. The LX34070 inductive position sensor solution offers numerous advantages compared to magnetic resolvers and Linear Voltage Differential Transducers (LVDTs), at a fraction of the cost. By using PCB traces rather than transformer-based magnetic windings and coil structures, the LX34070 device has negligible size and mass compared to alternatives that weigh as much as a pound. Accuracy is improved since the LX34070 does not depend on magnet strength, and the device improves robustness by actively rejecting stray magnetic fields. These and other features give designers greater flexibility over where they can place the thin, lightweight PCB-based LX34070 solution in their EV motor control designs. PCB-based inductive position sensors use a primary coil to generate an AC magnetic field that couples with two secondary coils. A small metal target object disturbs the magnetic field so that each secondary coil receives a different voltage whose ratio is used to calculate absolute position. Using these techniques, Microchip introduced its first high-volume inductive sensor for automotive and industrial applications over a decade ago and has many programs in volume production. The LX34070 now brings the same proven PCB materials, approaches and simplified, low-cost packaging to EV motor control and other applications that need its high-speed and low-latency benefits.

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Hangzhou Ruimeng Technology Co.,LTD

MS5189, 16bit, 500KSPS, 8-CH SAR ADC

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Monolithic Power System Inc.

High Accuracy Battery Monitor and Protector – MP2797

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MP2797 is a battery pack monitor and protector, which can be used for energy story, smart 2-wheel vehicle, Backup battery unit. The main features include: 1. Integrate 16 channels cell voltage differential measurement, the measurement accuracy is within ±12mV over temperature 2. It support synchronized voltage and current sampling, which could be used to calculate cell internal series resistance and achieve high SOC accuracy 3. Integrate high side driver and avoid ground floating issue when FET is shutdown 4. Integrate coulomb counter and save MCU resources 5. Support both internal and external balancing, and internal balancing current support up to 58mA. 6. Comprehensive protection and self-diagnosis In general, MP2797 is highly integrated AFE with high performance analog-digital conversion and comprehensive protection. It can help battery pack designer to optimize battery SOC accuracy, save component number, and realize a high reliable design.

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SG Micro Corp

Automotive grade voltage reference analog IC--LM431BQ

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AEC-Q100 Qualified for Automotive Applications Device Temperature Grade 1 (TA = -40℃ to +125℃); Adjustable Output Voltage: VREF to 36V; Sink-Current Capability: 1mA to 100mA; Reference Voltage Tolerance at +25℃: 0.5%; Temperature Drift: 5mV (TYP); Output Impedance: 0.1Ω (TYP); High Stability under Capacitive Load; Low Output Noise; Available in a Green SOT-23 Package. For the traditional 431 devices, the stability of the reference output is affected by the output capacitor, and the size of the output capacitor is limited, which is extremely inconvenient for end customers' compatible alternative design. The LM431BQ relies on unique processing of the internal circuit, setting almost no requirement for output capacitance. SGMICRO automotive analog IC LM431BQ has been shipped to automotive-related customers in large quantities, and it is widely used in lidar, in-vehicle entertainment systems, and in-vehicle power management systems.

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Boréas Technologies

Piezo Haptic Computer Trackpad with BOS1901 Piezo Driver

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The Piezo Haptic Computer Trackpad Module is less complex than mechanical and LRA based counterparts. BOS1901 piezo driver allows force sensing without additional hardware, making the integration simpler, more reliable and cost effective. Streamlined mechanical design translates into trackpads that are as thin as 2.4 mm with better manufacturing yield, long-term reliability, and lower costs. BOS1901-based trackpad modules can easily scale to large trackpad sizes without adding additional piezo actuators. This an exclusive benefit of Boreas patented CapDrive™ architecture. The BOS1901 is up to 10 times more power-efficient than technologies using inferior architectures, it improves end-user battery autonomy and eliminates heat management problems. The BOS1901 piezo driver is the only driver on the market that can both drive and sense from the same piezo actuators without additional hardware. The haptic and sensing mechanisms in the trackpad use the same hardware, it simplifies design and integration, conserves board space, and reduces the cost of the whole piezo haptic trackpad module. The BOS1901 is a single-chip piezo actuator driver with energy recovery, it can drive actuators with up to 190 Vpk-pk waveforms while operating from a 3-5.5 V supply voltage. The input digital stream is written in the internal FIFO over the digital interface to generate the desired output waveform. Low power and small size make it suitable in a variety of applications where power consumption and heat dissipation must be minimized. It uses a high-speed SPI in its Digital Front End. It enables the device to share a common communication bus for multi-actuator systems and the user to query various data such as the actuator voltage for sensing applications. The differential driver achieves low distortion waveforms and quiet actuator operation. All settings are adjustable through the digital front end to reduce the BOM. Only 7 passive discrete components are required. The BOS1901 can be operated with a wide selection of commercial off-the-shelf inductors.

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Jiangsu Runic Technology Co., Ltd.

Operational Amplifier RS8701/2

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Linearin Technology Corporation

0-10V/PWM/Potentiometer Input with PWM Output GP9301B

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GUANGDONG DAPU TELECOM TECHNOLOGY CO., LTD

Vehicle & High-Precision Real-Time Clock chip-INS5A8900 & INS5A8804

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Analog Devices, Inc.

ADBT1000/1/2—4-Channel AFE, Digital Controller, and PWM for Battery Formation and Testing

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Battery formation and testing equipment is changing from analog to digital control. ADBT1000/1/2 series chip, based on digital loop control design, integrates the bi-directional DC-DC solutions applied on battery formation and testing industry on a single chip system level. The devices also integrate the analog front-end of voltage and current sampling and auxiliary ADC, and adopt digital kernel to realize multi-channel interleaved parallel operation and digital current sharing between channels. ADBT1000/1/2 series chip has up to 4 data acquisition channels, allowing customers to freely combine the channels by setting two channels in parallel for higher current output, or 4 channels in parallel. Single-chip design can achieve a high current charge and discharge of up to 240A or higher, in compliant with the current trend of increasing battery capacity. PID tuning through a built-in state machine brings faster loop corresponding capability, and avoids the risk of program execution error caused by software control at the same time. ADBT1000/1/2 flexible, feature rich digital controller series that target high volume battery testing and formation manufacturing and precision battery test instrumentation applications. The devices are optimized for minimal component count, maximum flexibility, and minimum design time. In addition to providing high precision, it also replaces analog control with digital loop control using a state machine, which increases the factories' test capacity in battery formation and testing, expands the testing scale, and increases the stability of the battery formation equipment, enabling manufacturers to produce safe and powerful battery packs more efficiently. Features include differential remote voltage sense, current sense, pulse-width modulation (PWM) generation, frequency synchronization, overvoltage protection (OVP), and current sharing. Programmable protection features include overcurrent protection (OCP), OVP limiting, and external overtemperature protection (OTP). Parameters can be programmed over the serial peripheral interface (SPI), providing extensive programming of the integrated loop filter, PWM signal timing, and soft start timing. The SPI provides access to the many monitoring and system test functions. Reliability is improved through a built-in checksum and programmable protection circuits. A comprehensive graphical user interface (GUI) is provided for simple system and channel configuration and programming of the safety features.

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Texas Instruments

BUF802

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The BUF802 from Texas Instruments is the industry’s widest-bandwidth high-input-impedance (Hi-Z) buffer amplifier, capable of supporting frequency bandwidths as high as 3 GHz. The wider bandwidth and high slew rates of the BUF802 enable higher signal throughput and minimal input settling time. Designers can leverage this faster throughput to measure higher-frequency signals more accurately in test and measurement applications including oscilloscopes, active probes and high-frequency data-acquisition systems. The bandwidth achieved by the BUF802 was previously only possible by using application-specific integrated circuits (ASICs) that can increase system design time, complexity and cost. By eliminating ASICs, designers who use TI’s buffer can get to market faster while achieving a wide dynamic range at a fraction of the cost. The BUF802 provides a single-chip alternative to ASICs or FET-input amplifier-based implementations by integrating the features of discrete components while providing 10 times wider bandwidth than FET-input amplifiers, matching the performance of custom ASICs. Integrated functional modes allow engineers to use the BUF802 as a standalone buffer or in a composite loop with a precision amplifier.

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Shenzhen Muxin technology Co., Ltd

Hearing aids SIP MA1180

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Canaan Inc.

Kendryte K510

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Canaan’s AI reasoning chip, the Kendryte K510, is equipped with a self-developed visual neural network accelerator (KPU2.0), a computing power of 2.5TFLOPS, power consumption capacity of 2W, and performance-to-power ratio of 1.25T/W. The chip supports INT8 and BP16, two common used industry data formats, and is one of the few terminal AI chips with low power consumption and high-precision reasoning capabilities. Canaan is an industry pioneer when it comes to CPU design, deploying RISC-V instruction set (ISA) to develop its terminal SoCs. Specifically, the Kendryte K510 has a dual-core 64-bit RISC-V CPU and a digital signal processor (DSP) with up to 800Mhz frequency equipped, to support the growth of AI-related application. The Kendryte K510 integrates the latest generation of image processing ISP in its visual subsystem design, supporting TOF depth camera access, 2D/3D noise reduction, wide dynamic range WDR, RGB & IR fusion, hardware 3A and other complete functions. TOF sensor solutions are also supported by our 3D ISP. Common chip applications include: AI IPC, drone aerial photography, professional photography, robots, AI STEAM, edge computing boxes and other scenarios.

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cambricon

MLU370-X8

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https://www.cambricon.com/index.php?m=content&c=index&a=show&catid=127&id=48

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Texas Instruments

Sitara™ AM62 processors

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The next generation of human-machine interface (HMI) will bring new ways of interacting with machines, such as enabling gesture recognition to give commands in a noisy factory environment or enabling the control of machines by phones or tablets with a wireless connection. Adding edge artificial intelligence (AI) features to HMI applications, including machine vision, analytics and predictive maintenance, can help bring a new meaning to HMI that goes beyond a mere interface to enable human-machine interaction. The Sitara™ AM62 processors from Texas Instruments bring analytics to edge devices at low power, including suspend states as low as 7 mW and no need to design for thermal considerations, which can give engineers flexibility to deploy these capabilities in size-constrained applications or industrial environments. Starting at less than US$5, the AM62 processor brings low-cost analytics to HMI devices by enabling basic camera-based image processing and edge AI functions, such as detecting and recognizing objects. AM62 processors also enable dual-screen, full high-definition displays and support for multiple operating systems, including Mainline Linux® and Android™ operating systems. AM62 processors also support both wired and wireless connectivity interfaces. AM62 processors can reduce power consumption in industrial applications by as much as 50% compared to competing devices, enabling an application powered by AA batteries to remain on for over 1,000 hours. This is possible through a simplified power architecture; the device features only two dedicated power rails and five power modes. Deep sleep mode at <5 mW enables longer battery life, while an active power of <1.5 W is made possible by a core voltage of 0.75 V. Reducing system power consumption extends battery life and helps engineers meet design requirements for handheld or size-constrained devices that can be deployed anywhere.

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JLQ Technology Co., Ltd.

JLQ Technology LTE Smartphone SoC JR510

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RiVAI

RiVAI-V DSP IP

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The RiVAI-V DSP core is based on the 32-bit RISC-V open-source architecture. The DSP expands the vector and matrix instructions and is designed specifically to meet the needs of smart audio/visual applications, such as wearable and smart audio devices, surveillance drones, in-vehicle information electronics, neural network (NN), artificial intelligence/machine learning (AI/ML), and other vertical applications. The computing power of the RISC-V V series DSP IP is several times higher than that of competing products in the industry without compromising power efficiency. Compared with the leading flagship counterparts in the field, RiVAI’s DSP product family has better performance in EQ algorithm (4.7 times faster), noise reduction algorithm (3.6 times higher), and battery life (2.1 times longer). At the same time, the power consumption per unit area is only 59% of that of the competing providers’ products. The RISC-V V series DSP IP has the following features: 1. World's leading DSP architecture with outstanding computing power: The world's first successful implementation of vector processor to professional audio DSP, with outstanding performance that meets the digital signal processing needs for high-quality audio and video products in AR/VR, games, and similar fields; 2. High energy efficiency ratio: Provides the industry's leading energy efficiency ratio with increased high computing power; 3. Flexible design with ultimate optimization: Optimize client products’ PPA performance through the flexible custom instruction set and architecture, and complete software and hardware tools; 4. Easy implementation: The complete ecosystem provides developers with rich development tools to improve development efficiency, allow for agile development and rapid migration in various applications. The ecosystem realizes the potentials of the advanced hardware architecture of RiVAI V series DSP processors.

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NXP

S32 realtime processor: S32E

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The S32E real-time processors feature Arm® Cortex®-R52 split-lock processors for multi-tenant software integration plus lockstep Arm Cortex-M33 processors for system management, combining multi-core, real-time processing with core-to-pin hardware virtualization, DSP/ML processing, communications acceleration and Gigabit Ethernet switch with hardware security and ISO 26262 ASIL D safety. The S32E processors are ideal for electric vehicle (xEV) control and smart actuation.

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NVIDIA

NVIDIA DRIVE Hyperion

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 Main Features: NVIDIA DRIVE Hyperion reduces time and cost, while providing powerful AI that can recognize complex scenarios and increase safety. With continuously updated software and fully customizable capabilities, based on state-of-the-art computing technologies, it has everything automakers need to bring intelligent vehicles to market safely, quickly, and affordably.  Application Scenarios: NVIDIA DRIVE Hyperion is designed for the next generation of intelligent vehicles, providing compute and sensor architectures for automakers, truck makers, tier one suppliers and robotaxi companies. Starting in 2024, all of Mercedes-Benz’s vehicles will be built on DRIVE Hyperion. Volvo Cars is using the DRIVE Hyperion compute architecture, beginning with its next-gen XC90 debuting later in 2022. And starting in 2025, all new Jaguar and Land Rover vehicles will be based on DRIVE Hyperion.  Competitive Advantages: NVIDIA is the only company today that offers a unified AV development architecture for the industry to build upon spanning from the cloud to the car. NVIDIA DRIVE Hyperion opens up new revenue streams for the industry, providing the ability to support new services and features throughout the life of the car. NVIDIA DRIVE Hyperion has already been widely adopted. In March, the company announced its entire automotive pipeline has grown to more than $11 billion over the next six years. Customers span the entire AV industry, from top EV startups such as Li Auto and NIO; to the renowned automakers like Mercedes-Benz and BYD; to leading AV trucking companies like TuSimple; to cutting-edge robotaxi manufacturers like Pony.ai, etc.

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zhaoxin

ZhaoXin high-performance server processor - KaiSheng KH-40000 series

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MediaTek

Dimensity 9000 Series

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The Dimensity 9000 Series- the world’s first smartphone built on the ultra-efficient TMSC N4 (4nm-class) production process - leads the industry in computing performance, gaming, imaging, multimedia and connectivity innovations.The chipset’s flagship 18-bit HDR-ISP. The world’s first to support 320MP on smartphones, and the world’s first to support simultaneous triple camera 18-bit HDR video recording.along with the industry’s first raytracing software development kit (SDK) using Vulkan for Android.The integrated 5G modem amplifies sub-6GHz performance up to 7Gbps downlink using 3CC Carrier Aggregation (300MHz). It also features the world’s 1st R16 UL enhancement, and continues MediaTek’s dual SIM leadership with new 5G/4G Dual SIM Dual Active support. The modem also integrates the new MediaTek 5G UltraSave 2.0 power-saving enhancement suite for improved efficiency.

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Allwinner Technology CO., Ltd.

V853 Intelligent Professional IP Camera SoC

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Axera Semiconductor (Shanghai) Co., Ltd

Axera AX620A

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KUNLUNXIN（Beijing）Technology Co.Ltd

KUNLUNXIN 2nd generation General-purpose Processing Unit for AI

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KUNLUNXIN’s 2nd generation AI chip (KUNLUNXIN’s 2nd Generation Cloud General Artificial Intelligence Computing Processor)

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Horizon Robotics

Horizon Journey 5

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In July 2021, Horizon Robotics announced its third-generation Journey 5, designed for all level of autonomy, delivering 128 TOPS at less than 30W. Journey 5 is ASIL-B, Cybersecurity ISO 21434 compliant and will be the heart of central computers, to realize the promise of AI in automated driving, integrated with intelligent cockpit interactions. The Horizon Journey 5 has powerful deep learning computing capabilities, high energy efficiency, low latency, and provides the strongest real AI performance. Diverse computing with efficient combinations, integrated optimized programmable computing resources, and flexible hardware acceleration. In addition, Horizon Journey 5 is equipped with rich sensor access and communication interfaces, complete I/O configuration and system support to adapt to driving scenarios, and has internationally certified safety and reliability, functional safety, expected functional safety, network security, software development, vehicle regulation reliability, etc., which can fully meet the requirements of high-level, automatic driving mass production. Horizon Journey 5 is the first to achieve front-loading mass production of the domestic top 100 TOPS level large computing power AI chip, with its official launch, Horizon has become the industry's only provider that can cover from L2 to L4 intelligent driving chip solutions.

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Black Sesame Technologies

Huanshan No.2 A1000 Pro

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The Huashan No. 2 A1000 Pro was released by Black Sesame in April 2021 and was successfully taped out in July of the same year. A1000Pro, the strongest domestically produced car-level autonomous driving chip, is also the second high-powered car-level autonomous driving computing chip of Black Sesame. A1000 Pro adopts heterogeneous multi-core architecture, 16-core Arm v8 CPU, 16nm process, typical power consumption 25w, supports 16 high-definition camera inputs, and has the characteristics of high performance, low power consumption, safety, and reliability. A1000Pro is built on the basis of two self-developed automotive-grade core IPs: image processor NeuralIQ ISP and low-power neural network acceleration engine DynamAI NN. Thanks to the large computing power architecture of DynamAI NN, A1000 Pro supports INT8 sparse acceleration. The computing power can reach 106 TOPS and the highest can reach 196 TOPS. A1000 Pro built-in high-performance GPU can support high-definition 360-degree 3D panoramic image rendering, which can cover L3/L4 high-level autonomous driving functions. A1000 Pro is based on the core of the previous generation product A1000 chip for design optimization and improvement, adopts the industry's innovative and advanced packaging technology, integrates multiple cores, solves the problem of supporting ultra-large-scale deep learning engines under the 16nm process. A1000Pro builds a high-speed communication channel based on internal multi-core, which greatly improves data transmission efficiency. As the latest generation of high-performance computing platform for Black Sesame, A1000 Pro is currently the only large computing power chip in China that can meet the ISO 26262 ASIL-D functional safety requirements. The A1000 Pro can be configured with different data paths and calculation mechanisms, and dual redundant systems and safety island verification are deployed inside the chip. In the A1000Pro system, tasks can be dynamically migrated between multiple subsystems, with features such as easy development, high availability, and zero-copy, which improves the efficiency and flexibility of the algorithm.

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Renesas Electronics China

R-Car V4H SoC

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R-Car V4H system on chip (SoC) for central processing in advanced driver-assistance (ADAS) and automated driving (AD) solutions. The R-Car V4H achieves deep learning performance of up to 34 TOPS (Tera Operations Per Second), enabling high-speed image recognition and processing of surrounding objects by automotive cameras, radar, and lidar. The R-Car V4H enables market-leading performance per watt through a careful combination of best-in-class IP and expert HW optimization. It targets the highest volume zones of automated driving: Level 2+ and Level 3. Thanks to a high level of integration, the R-Car V4H allows customers to develop cost-competitive, single-chip, ADAS electric control units (ECUs). These control units may support driving systems appropriate for automated driving Levels 2+ and Level 3, including full NCAP 2025 features. The R-Car V4H also supports surround view and automatic parking functions with impressive 3D visualization effects such as realistic rendering.

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Renesas Electronics China

Entry-Level RZ/V2L MPU

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Entry-level AI accelerator products provide customers with the flexibility to select the most suitable product from a wide range of MPU offerings. These AI-optimized solutions will expand the use of embedded AI to a wider range of applications such as home appliances and consumer electronics, as customers can now implement AI capability with lower system costs. One of the most important trends in the electronics industry today is the incorporation of AI into embedded devices – especially AI for interpreting sensor data, such as images. Innovative processors like the RZ/V2L are key for enabling perceptual AI to be incorporated into a wide range of cost- and power-constrained IoT devices. Compared with artificial intelligence processing chips (such as NPU) in the same industry in the market, the biggest competitive advantage of RZ/V2L is that it can achieve a very good balance in AI acceleration capability and power consumption. Compared with the DRP-AI technology already installed in Renesas RZ/V2L products, it can use limited hardware resources to provide superior design flexibility and achieve high-speed AI inference calculation under ultra-low power consumption conditions, providing users with artificial intelligence at the edge. Intelligent application provides an optimal choice.

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SHENZHEN PANGO MICROSYSTEMS CO.,LTD.

PGL100H-6IFBG900

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Innosilicon Technology

Fantasy Ⅱ

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Corerain Technologies

CAISA 3.0

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The streaming architecure adopts a radically different approach where the computation order is determined by the data streaming network, instead of the instruction execution order, so that the idle time is substantially minimized by cutting the waiting time for instructions. With a series of technical breakthroughs, the streaming AI chip CAISA utilised the advantages of the data streaming architecture and achieved over 10x efficiency when compared with other similar products in the market. The performance and efficiency gain are measured and validated by third party testers. CAISA can reach over 95% chip utilization rate for the maximum cost effectiveness. These tests show that the Corerain chip, with only 1/3 of the peak performance, can provide up to 4 times higher measured performance compared with Nvidia‘s GPU product which are based on 12nm or more advance processes. CAISA has been put into the markets of smart cities, smart safety monitoring and intelligent manufacturing. Empowered by the CAISA chip, a series of accelerator products including Nebula Accelerator X3 and Nebula Accelerator X9 were launched. These products cover the computation requirements from data center to edge devices. The Nebular X9 accelerator board hosts 4 CAISA 3.0 chips which achieves up to 11x chip utilization efficiency and better performance than the competitive T4 GPU product. It has 2.76-11.05 times higher chip utilization rate when running algorithm models such as ResNet50 and YOLO v3. For ResNet50, it can achieve 6037.73fps, a 1.12x performance improvement compared to T4. For other neural network models such as YOLO v3, UNet Industrial, etc. the Nebular X9 accelerator outperforms the T4 device up to 1.99-4.47 times and the latency can reach as low as 2.65ms (up to 35.73x lower than the T4 device).Currently the products have achieved large scale adaptation in the fields of aviation, aerospace, education, R&D, surveillance, smart grid and smart manufacturing. In conclusion, the streaming architecture allows the CAISA chip advancing in another technical path without pursuing the peak performance. There are only a few companies in the world which have developed streaming AI chips, including SambaNova, which was born from Stanford University, Groq, which was founded by the former Google TPU core team, and Wave computing. As the world's first mass-produced AI chip, CAISA is highly representative of the industry.

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Knowles Corp.

Knowles IA8201 DSP

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SemiDrive

X9 - Infotainment SoC

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X9 - Infotainment SoC： The X9 series is an automotive-grade SoC family, targeting the next generation of automotive e-cockpit system. With high-performance CPU, GPU, VPU and AI integrated, it can satisfy the increasing computing power demands of e-cockpits market. It also supports major auto software and platforms. In addition, the X9 series is a highly integrated SoC. Build-in PCIe3.0, USB3.0, Gigabit Ethernet, CAN-FD and etc. components make X9 a suitable and cost-efficient choice for car infotainment system. Besides, X9 series also embedded a safety island using a dual-core lockstep Cotex-R5, it grants products to support high reliable automotive functions. Compared with its competitors, the X9 series has a wider range of applications and is more cost-effective, and gradually some customers are switching to this platform. Advantages: High-performance Processor Equipped with the latest Cortex-A55 multi-cluster architecture and higher frequency Provide outputs of up to 10 screens and 4K screens Support virtualized hardware and major operating systems Built-in High-performance AI Unit Solution for infotainment system with APA/AVP integrated Able to manage resources efficiently across different domains/cores Seamlessly AI based application migrate between V9 and X9 series High Reliability Certified with ISO 26262 ASIL B functional safety integrity levelCertified with AEC-Q100 Grade 2 Built-in independent hardware-isolated safety island Integrate hardware error monitoring module CPU 54-100KDMIPS GPU 300GFLOPS AI 1 TOPS DRAM Speed LPDDR4/4x-4266 MCU 2x R5 PCIe 2x PICe3.0 Ethernet 2x Display 3x 4K+7x 1080p LVDS 4x Reliability AEC-Q100 Grade2（-40~+105℃）

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UNISOC (Shanghai) Technologies Co., Ltd

UNISOC 5G SoC platform T820

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T820 is UNISOC’s new-generation 5G SoC mobile platform. Using cutting-edge process technology, T820 enables an optimized 5G experience with substantially enhanced AI computing and multimedia imaging processing capabilities while lowering power consumption. Advanced 6nm EUV process technology: Compared to the previous 7nm process, the 6nm process has a 18% improvement in density of transistors。 New low of power consumption: Compared to mobile platforms which paired with a separate 5G modem, T820 is the all-around leader in power consumption for both light-load and heavy-load scenarios and delivers a power consumption reduction of up to 35% for some data business scenarios. Support coverage enhancement for all scenarios：This modem supports 5G NR TDD+FDD carrier aggregation and uplink and downlink decoupling and can enhance coverage by more than 100%. UNISOC’s innovative 5G super transmitter technology can increase the uplink speed by up to 60% and meet demanding scenarios such as VR and 4K/8K ultra-high-resolution live streaming. T820 supports the Sub-6GHz band, NSA/SA dual-mode networking, and 2G through 5G networks. Powerful AI capabilities and limitless development potential: T820 integrates a new-generation NPU with greatly improved performance and excellent energy efficiency. The energy efficiency (TOPS/W) increase by more than 50% compared to the previous generation product. Comprehensively enhanced multimedia processing capabilities：T820 upgraded four-core ISP architecture to provide an ultra-high resolution of 100MP and multi-camera processing capability. It adopts a new-generation multicore display architecture and supports up to 120Hz of refresh rate. With omni-channel and all-format HDR rendering capabilities, Multi-screen display can support up to 4K at HDR10+ quality. Integrated financial-level security：T820 adopts UNISOC’s second-generation Integrated Secure Element solution. This solution integrates the financial level Secure Element into the SOC and provides higher security than embedded SE. It provides a 100% improvement in computing performance and supports computing-intensive security scenarios such as encrypted video calls.

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AMD

Versal Premium ACAP with AI Engines

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The Versal Premium series with AI Engines is part of 7nm Versal adaptive compute acceleration platform (ACAP) portfolio including the existing Versal Premium series devices currently shipping to customers. The Versal Premium series with AI Engines delivers a 4X increase in signal processing capacity compared to the last-generation Virtex UltraScale+ VU13P FPGA. It also eliminates I/O bottlenecks with up to 9Tb/s serial bandwidth, and offers significantly reduced size, weight and power through heterogeneous, power-optimized integration of hardened, ASIC-like cores such as 100G/600G Ethernet cores, 400G High-Speed Crypto Engines, DDR memory controller, and integrated PCIe Gen5 blocks. Versal Premium with AI Engines combines highly advanced signal processing from the proven Versal AI Core series with the massive digital signal processing (DSP) compute capacity and serial bandwidth capacities of the existing Versal Premium series. By combining AI Engines with DSP Engines, users of Versal Premium with AI Engines devices can realize major performance gains compared to prior generation 16nm Xilinx devices and competing products on the market today. By offering the heterogenous integration of both AI engines and DSP engines, A&D and T&M customers are able to assign the right compute engine for the right task…from A&D radar applications such as adaptive beamforming to signal processing for RF machine learning applications like digital RF memory and direction finding. In the T&M market, Versal Premium with AI Engines addresses the growing demand for wireless testing as part of the global 5G rollout for applications like 5G protocol and production testing, as well as semiconductor automated test equipment. The Versal Premium series with AI Engines deliver major performance gains and additional functionality at reduced power and with a smaller footprint. In radar beamforming applications, the heterogenous compute engines enable 67% smaller footprint and up to 43% lower power with 2X beamforming performance.

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Bouffalo Lab (Nanjing) Co., Ltd.

BL618: Wifi6 based multi mode wireless connection SoC

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Qualcomm

Snapdragon X70 5G Modem-RF System

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Qualcomm announced the world’s first modem-RF system with integrated 5G AI processor, Snapdragon X70, in February 2022. Snapdragon X70 harnesses the power of AI to enable breakthrough 5G performance with the world’s fastest 5G speed of up to 10 Gbps, ultra-low latency, and superior coverage and power efficiency. Snapdragon X70 introduces the Qualcomm 5G AI Suite, designed for Sub-6 GHz and mmWave 5G links optimizations with its leading features including AI-based channel-state feedback and dynamic optimization, the world’s first AI-based mmWave beam management, AI-based network selection and AI-based adaptive antenna tuning. Snapdragon X70 is the world’s only modem-RF system for all commercial 5G bands from 600 MHz to 41 GHz, offering ultimate flexibility to OEMs for designing devices capable of supporting global operator requirements. Snapdragon X70 supports the industry’s most comprehensive spectrum aggregation capabilities including the world’s first 4X downlink carrier aggregation across TDD and FDD, mmWave-Sub-6 aggregation. Moreover, Snapdragon X70 supports standalone mmWave and true global 5G multi-SIM including Dual-SIM Dual-Active (DSDA). Facilitated by its upgradable architecture, Snapdragon X70 introduced the new features of Qualcomm Smart Transmit 3.0 just three months after its launch. Qualcomm Smart Transmit 3.0 integrates Wi-Fi and Bluetooth into smart transmit architecture, which further improves radio performance. Snapdragon X70 delivers many firsts, extreme 5G capacity, multi-Gigabit data speeds and best-in-class 5G experiences across devices from smartphones to laptops, fixed wireless access equipment and industrial machines, helping transform industries across consumer, enterprise and industrial settings, and fueling a new era of intelligent 5G connectivity.

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Nations Technologies Inc.

N32WB031 Series Bluetooth® Low Energy SoC

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TE Connectivity

Antennas for Wi-Fi E6, 5G NB-IoT and LTE-M

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TE antennas for Wi-Fi 6E can support triple bands (2.4 GHz, 5 GHz, 6 GHz) which enable extensive bandwidth increase in WLAN communication. The new portfolio has antenna product available on PCB, cabled PCB and cabled FPC. TE’s antenna solutions and integration expertise unleash the power of the extensive additional spectrum from Wi-Fi 6E, enabling new applications and services, greater network flexibility, and faster speeds with reduced latency in end devices and applications. Product Features  Add 1200 MHz of frequency bandwidth, accommodating 14 additional 80 MHz channels or 7 additional 160 MHz channels  State of the art bandwidth and robust RF performance  Multiple wireless standards integration  On-board and cabled versions available in PCB and FPC materials  Customizable in cable length and connector types  Customizable MIMO (Multi-input Multi-output) arrays Benefits  Greater network flexibility with reduced congestion  Faster and more reliable speed experience with reduced latency  Offer system design flexibility  Quick time-to-market with TE RF integration competence  Wi-Fi hotspots anywhere

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TE Connectivity

TE ”Trigger” Antenna

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The Trigger antenna family includes four or five port options each providing coverage of cellular, Wi-Fi, and GNSS (698-960/1710-2620/2620-2700, 2400-2500/4900-5900, and 1559-1606 MHz). They have proven performance advantages from the inclusion of both vertical and horizontal elements versus competing technologies such as flat dash-top mount antennas. Customers have reported as much as a 6 dB increase in gain which is significant. The increase in performance means that the antenna can be mounted underneath a vehicle’s dashboard with reduced degradation in performance. This is extremely unique in that it can be mounted completely covertly and connected to a vehicle’s cellular router or gateway inside the vehicle. As a result, no antennas, cables or connections are visible from the exterior of a vehicle. This antenna family was originally designed for large freight vehicles and one key advantage was the covert mounting capability. This made it tamper-proof because it could not be easily accessed by drivers or other individuals. The same advantage opened further opportunities for public safety and emergency services vehicle applications looking to take advantage of more commercial Wi-Fi and cellular frequencies. However, for slightly different reasons. The antenna is entirely covert which is an important advantage for undercover or covert public safety vehicles. It is invisible from the exterior of a vehicle which is unique. Other competing products are generally on display either on the exterior or in the windows of the vehicle. The images attached to this application show the antenna and also how the antenna can mount quickly and easily over bulky objects, such as air ducts, underneath a vehicles dash. Advantages: • Covert installation • Multi-frequency coverage • Excellent performance • Quick and easy installation inside a vehicle • No requirement for drilling the exterior Vehicular Applications: • Freight, transportation and trucking • Public safety • Emergency services

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ZHUHAI JIELI TECHNOLOGY CO.,LTD.

AC791N chipset is Wi-Fi/Bluetooth Classic/BLE all-in-one chipset

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AC791N chipsets is Wi-Fi/BT/BLE all-in-one AIoT chipset, equipped with advanced power management architecture. It supports 8-bit RGB TFT screen driving, USB 2.0 Highspeed. The chipset design for high-end AIoT, which focuses on AI abilities, can be implanted with more complex AI algorithms to provide a better user experience. It is especially suitable for IoT and smart home relatedapplications that require audio-visual and AI features. Some performance of product technical level have reached the advanced level of international standards. The main features are as follows: AC791N self-developed dual-core (CPU+DSP) main frequency 360MHz, supports floating-point operations, can support up to 300M times of 8-bit multiplication operations per second, AI hardware acceleration unit, all new voice AI algorithm, dual MIC interrupt wake-up voice algorithm recognition The rate is higher than 95%, the video encoding capability is up to 720p@30fps, and the MJPEP encoding format. Supports 4 high-performance ADCs and 4 high-performance DACs. Main advantages: highly integrated when the main indicators reach the industry-leading level, greatly reducing the development difficulty and development cost, highlighting the power consumption control level and continuously improving the customer experience.

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Texas Instruments

SimpleLink™ Bluetooth® Low Energy CC2340 family

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Texas Instruments (TI) has expanded its connectivity portfolio with a family of wireless microcontrollers (MCU) that enable high-quality Bluetooth® Low Energy (LE) at half the price of competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink™ Bluetooth LE CC2340 family is built on the foundation of TI’s decades of wireless connectivity expertise. Pricing for the CC2340 family will start as low as $0.79, making it affordable for engineers to add Bluetooth LE connectivity to more products. The CC2340R2 and CC2340R5 wireless MCUs, offering flash memory of 256KB and 512KB respectively, provide exceptional flexibility for engineers and ample space for application code. Additionally, with the proliferation of Bluetooth LE applications, designers need additional memory capacity to easily update software remotely. The new wireless MCU family features 36KB of RAM with over-the-air download support. The new MCUs include industry-leading standby current of less than 830 nA, which is 40 percent lower than competing devices. The reduction in standby current helps extend battery life for up to 10 years on a coin cell battery in wireless applications such as electronic shelf labels and tire pressure monitoring systems. The CC2340 family also features an operating temperature range of –40ºC to 125ºC to help ensure a stable connection across applications, from industrial sensors and medical laboratories to outdoor environments such as EV chargers or smart meters. Engineers are also able to expand RF performance and connection range with an output power up to +8 dBm, the industry’s highest among competing Bluetooth LE wireless MCUs. In addition, the CC2340 devices feature an integrated RF balun to enable a simpler design with fewer external components, leading to cost savings.

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Shenzhen Kinghelm Electronics Co., Ltd.

GPS-GLONASS-Beidou Antennas、RF connector、KH-SMA-K513-G

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Silicon Labs

Matter-Ready Platform BG24 & MG24 Wireless SoC

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Silicon Labs announced the BG24 and MG24 families of 2.4 GHz wireless SoCs for Bluetooth and Multiple-protocol operations, respectively, and a new software toolkit. This new co-optimized hardware and software platform will help bring AI/ML applications and wireless high performance to battery-powered edge devices. Matter-ready, the ultra-low-power BG24 and MG24 families support multiple wireless protocols and incorporate PSA Level 3 Secure Vault™ protection, ideal for diverse smart home, medical and industrial applications. First Integrated AI/ML Acceleration Improves Performance and Energy Efficiency IoT product designers see the tremendous potential of AI and machine learning to bring even greater intelligence to edge applications like home security systems, wearable medical monitors, sensors monitoring commercial facilities and industrial equipment, and more. But today, those considering deploying AI or machine learning at the edge are faced with steep penalties in performance and energy use that may outweigh the benefits. The BG24 and MG24 alleviate those penalties as the first ultra-low powered devices with dedicated AI/ML accelerators built-in. This specialized hardware is designed to handle complex calculations quickly and efficiently, with internal testing showing up to a 4x improvement in performance along with up to a 6x improvement in energy efficiency. Because the ML calculations are happening on the local device rather than in the cloud, network latency is eliminated for faster decision-making and actions. The BG24 and MG24 families also have the largest Flash and random access memory (RAM) capacities in the Silicon Labs portfolio. This means that the device can evolve for multi-protocol support, Matter, and trained ML algorithms for large datasets. PSA Level 3-Certified Secure VaultTM, the highest level of security certification for IoT devices, provides the security needed in products like door locks, medical equipment, and other sensitive deployments where hardening the device from external threats is paramount. Alpha Program Highlights Variety of Deployment Options More than 40 companies representing various industries and applications have already begun developing and testing this new platform solution in a closed Alpha program. These companies have been drawn to the BG24 and MG24 platforms by their ultra-low power, advanced features, including AI/ML capabilities and support for Matter. Global retailers are looking to improve the in-store shopping experience with more accurate asset tracking, real-time price updating, and other uses. Participants from the commercial building management sector are exploring how to make their building systems, including lighting and HVAC, more intelligent to lower owners' costs and reduce their environmental footprint. Finally, consumer and smart home solution providers are working to make it easier to connect various devices and expand the way they interact to bring innovative new features and services to consumers. The single-die BG24 and MG24 SoCs combine a 78 MHz ARM Cortex-M33 processor, high-performance 2.4 GHz radio, industry-leading 20-bit ADC, an optimized combination of Flash (up to 1536 kB) and RAM (up to 256 kB), and an AI/ML hardware accelerator for processing machine learning algorithms while offloading the ARM Cortex-M33, so applications have more cycles to do other work. Supporting a broad range of 2.4 GHz wireless IoT protocols, these SoCs incorporate the highest security with the best RF performance/energy-efficiency ratio in the market.

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onsemi

RSL15 Secure Bluetooth® 5.2 MCU

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The RSL15 is the industry's first Bluetooth low-power SoC with innovative smart sensing, featuring Arm Cortex®-M33 processor supporting TrustZone® lifecycle management, and CryptoCell™-312 multiple encryption algorithms offering enhanced security and processing capabilities, addressing the growing demand of connected industrial applications for security with the industry’s lowest power consumption. The RSL15 supports a number of new capabilities provided by the Bluetooth 5.2 specification, including longer range, higher data transmissions and localization through angle of arrival (AoA) and angle of departure (AoD). onsemi has also developed an innovative smart sensing feature that allows the Arm Cortex®-M33 processor to remain in a deep sleep mode while still monitoring sensor interfaces. With these advanced new features, the RSL15 will continue the success of the RSL10 radio family, which has been integrated into a variety of industrial automation applications including connected asset tracking, smart retail and IoT edge nodes. From beacons for contact tracing to trackable asset tags, there are millions of connected devices globally operating off of small batteries. By setting a new record in Bluetooth 5.2 energy efficiency in the EEMBC ULPMark™ CoreMark program, the RSL15 will help these applications, amongst many others, achieve a battery life greater than they ever thought to be possible. While preserving its state-of-the-art power consumption, the RSL15 is designed with Arm®TrustZone® technology to establish device root of trust as well as Arm CryptoCell™-312 technology to protect the authenticity, integrity and confidentiality of code and data. This PSA Level 1 certified design enhances the security measures already offered as part of the Bluetooth protocol, providing assurance at both the application and software levels.

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Nordic semiconductor

Thingy:53 multisensor prototyping platform

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Thingy:53 is based on Nordic’s nRF5340 dual-core Arm® Cortex® M-33 advanced multiprotocol System-on-Chip (SoC) and incorporates the company’s nPM1100 Power Management IC (PMIC) and nRF21540 Front End Module (FEM), a power amplifier/low noise amplifier (PA/LNA) range extender. The prototyping platform is equipped with a rechargeable 1350 mAh Li-poly battery and multiple motion and environmental sensors. It supports Bluetooth® Low Energy (Bluetooth LE), Thread, Matter, Zigbee, IEEE 802.15.4, NFC, and Bluetooth mesh RF protocols, and comes with preinstalled firmware for embedded ML directly on the Thingy:53. The nRF5340 SoC at the heart of the Thingy:53 features a dedicated application processor and a network processor. The Arm Cortex-M33 application processor is clocked at 128 MHz and ensures the prototyping platform can handle advanced algorithms and the complex computational tasks associated with embedded ML. 1 MB Flash and 512 KB RAM ensure plenty of memory for even the most complex applications. The network processor is designed for power-efficient operation and features its own computational resources, thus ensuring robust wireless connectivity without compromising application software execution. Key features： • Battery powered prototyping platform for Matter and machine learning on the nRF5340 SoC ¬ • Support for multiple wireless standards, Bluetooth LE, Bluetooth mesh, Thread, Zigbee ¬ • Environmental sensor for temperature, humidity, air quality and air pressure ¬ • Color and light sensor ¬ • Low-power accelerometer and 6-axis inertial measurement unit (IMU) ¬ • Buzzer and PDM microphone ¬ • Connector for additional external boards and accessories ¬ • USB-C rechargeable 1350 mAh Li-Po battery ¬ • nRF Edge Impulse mobile app for embedded machine learning ¬ • nRF Programmer mobile app for easily flashing firmware on the go Nordic’s ‘Thingy’ family has already proven itself with the developer community as the fastest route to prototype and develop innovative short range wireless and cellular IoT applications. For the first time, developers who are not experienced in machine learning can easily leverage the technology through Thingy:53’s pre-programmed Edge Impulse firmware and the nRF Edge Impulse mobile app. Machine learning is the key to tomorrow’s advanced IoT edge processing. The product is the ideal platform for building advanced wireless proofs-of-concept and prototypes with ML capabilities on the shortest development schedules.

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Shanghai Eigencomm Technologies Co., Ltd.

Eigencomm Cat.1bis Chip EC618

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Qorvo

QPA3908 GaN Power Amplifier Module

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QPA3908 Gallium Nitride (GaN) 8 Watt Power Amplifier Modules (PAMs) that offer a combination of high performance and a significantly smaller footprint than traditional discrete component solutions, reducing the board level footprint required by network infrastructure equipment manufacturers. QPA3908 is integrated two-stage PAMs designed for massive MIMO applications with 8 Watt RMS at the device output. The modules are input/output matched at 50 Ω and require minimal external components. he QPA3908 incorporates a driver PA and Doherty final stage delivering high power-added efficiency for the entire module at 8W average power. The module is input and output matched components providing superior performance and are completely assembled with no additional tuning necessary. These single-tuned modules simplify 5G network architecture and reduce design time, offering a more elegant solution than multiple discrete PAs.

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Wolfspeed

PXAE213708NF

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Wolfspeed offers an extensive portfolio of GaN on SiC and LDMOS power transistors for use in the design of telecommunication systems supporting all global standards and frequency bands, from 450 MHz to 5 GHz and power levels to 1,000 W. Key features include high-power Doherty designs, ease of use with DPD systems, open-cavity and plastic package options, and reference designs. As 5G continues to expand and mature, we will continue to expand and explore the advantages inherent in wide bandgap GaN on SiC for designers and developers seeking better performance everywhere. With over 30 years of wide bandgap materials and product innovation enabling industry-leading devices that power more and consume less, Wolfspeed is the complete design partner for your RF needs. The PXAE213708NB is a 400-watt (P3dB) LDMOS Doherty transistor intended for use in multi-standard cellular power amplifier applications in the 2110 to 2200 MHz frequency band. Features include input and output matching, high gain and thermally-enhanced package with earless flange. Manufactured with Wolfspeed's advanced LDMOS process, this device provides excellent thermal performance and superior reliability.

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China Micro Semicon Co.,Limited

BAT32A series

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GigaDevice Semiconductor Inc.

GigaDevice GD32F470 Series MCU

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GD32F470 series MCU is the flagship series of GD32 product family, based on 40nm advanced technology, which can meet the requirements of the continuous improvement of the precision of the control system carried by the MCU. The power consumption of dynamic working mode and energy-saving mode is saved, which effectively prolongs the service life of terminal equipment and enhances the reliability and security of the system. GD32F470 series MCU adopts Arm Cortex-M4 core, and the operating frequency of the processor is up to 240MHz, leading the market. The chip has faster response capabilities, stronger real-time processing capabilities, and can support applications with higher algorithm complexity. GD32F470 series products support 512KB to 3072KB on-chip Flash, and the zero waiting area is increased to 1024KB. It supports SRAM from 256KB to 768KB. With industry-leading storage capacity, it supports diversified application scenarios such as advanced computing. GD32F470 series has abundant peripheral resources. GD32F470 series provides up to 4 USARTs and 4 UARTs, 3 I2C, 6 SPI, 2 I2S, 2 CAN2.0B, 1 SDIO interface, one 10/100M Ethernet controller (MAC), and it has two USB2.0 OTG interfaces which can support Device, HOST, OTG modes. It integrates the advanced modules, 2D image overlay and TFT LCD controller, it also has three 12-bit high-speed ADCs with a sampling rate of up to 2.6M SPS, providing up to 24 reusable channels, and 2 12-bit DACs, providing a better cost-effectiveness for supporting mixed-signal control. The product series has five package types, LQFP64, LQFP100, BGA100, LQFP144 and BGA176, to meet the development needs of differentiated application scenarios. With its high frequency, high storage capacity, high real-time, high integration and other advantages, it is widely used in a series of innovation fields such as complex algorithms, cloud servers, AI, industrial control, motor variable frequency, graphic display, security monitoring, sensor networks, drones, robots, and IoT and so on.

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Nations Technologies Inc.

N32L40x Series Low Energy MCU

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XIAMEN PENGPAI MICROELECTRONICS CO.,LTD.

PT32S038R8T7

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HPMicro Semiconductor Co.,Ltd.

General Purpose MCU with High Performance & Integration - HPM6750

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Analog Devices, Inc.

MAX78000——Artificial Intelligence Microcontroller with Ultra-Low-Power Convolutional Neural Network Accelerator

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The MAX78000 low-power neural network accelerated microcontroller moves artificial intelligence (AI) to the edge without performance compromises in battery-powered internet of things (IoT) devices. Executing AI inferences at less than 1/100th the energy of software solutions dramatically improves run-time for battery-powered AI applications, while enabling complex new AI use cases previously considered impossible. These power improvements come with no compromise in latency or cost: the MAX78000 executes inferences 100x faster than software solutions running on low power microcontrollers, at a fraction of the cost of FPGA or GPU solutions. AI technology allows machines to see and hear, making sense of the world in ways that were previously impractical. In the past, bringing AI inferences to the edge meant gathering data from sensors, cameras and microphones, sending that data to the cloud to execute an inference, then sending an answer back to the edge. This architecture works but is very challenging for edge applications due to poor latency and energy performance. As an alternative, low-power microcontrollers can be used to implement simple neural networks; however, latency suffers and only simple tasks can be run at the edge. By integrating a dedicated neural network accelerator with a pair of microcontroller cores, the MAX78000 overcomes these limitations, enabling machines to see and hear complex patterns with local, low-power AI processing that executes in real-time. Applications such as machine vision, audio and facial recognition can be made more efficient since the MAX78000 can execute inferences at less than 1/100th energy required by a microcontroller. At the heart of the MAX78000 is specialized hardware designed to minimize the energy consumption and latency of convolutional neural networks (CNN). This hardware runs with minimal intervention from any microcontroller core, making operation extremely streamlined. Energy and time are only used for the mathematical operations that implement a CNN. To get data from the external world into the CNN engine efficiently, customers can use one of the two integrated microcontroller cores: the ultra-low power Arm® Cortex®-M4 core, or the even lower power RISC-V core. AI development can be challenging, and ADI provides comprehensive tools for a more seamless evaluation and development experience. The MAX78000EVKIT# includes audio and camera inputs, and out-of-the-box running demos for large vocabulary keyword spotting and facial recognition. Complete documentation helps engineers train networks for the MAX78000 in the tools they are used to using: TensorFlow or PyTorch. Key Advantages • Low Energy: Hardware accelerator coupled with ultra-low-power Arm M4F and RISC-V microcontrollers moves intelligence to the edge at less than 1/100th the energy compared to closest competitive embedded solutions. • Low Latency: Performs AI functions at the edge to achieve complex insights, enabling IoT applications to reduce or eliminate cloud transactions and cuts latency over 100x compared to software. • High Integration: Low-power microcontroller with neural network accelerator enables complex, real-time insights in battery-powered IoT devices.

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Fortior Technology(shenzhen)Co.,Ltd

FT8132

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Shenzhen Hangshun Chip Technology Developmemt CO.Ltd

MCU HK32F030M

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OmniVision

WS49T31xQ

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Products Feature: Arm® Cortex®-M3 32-bit, 120MHz Up to 1Mbytes of embedded flash memory (256KB, 512KB, 1MB) Up to 96Kbytes of SRAM Power consumption – Run: 80µA/MHz – Stop: 40µA @ 25 °C – standby: 1.5µA @25 °C Advantages: WS49T31xQ is based on the Arm® Cortex® -M3,120MHz, provides up to 1MB of Flash storage, and 96KB of SRAM WS49T31xQ is designed to optimize the power consumption, and the Standby mode power consumption is controlled below 1.5μA. The low-power feature significantly extends the battery life of the whole device, which is very suitable for battery powered applications. Compared with the traditional LQFP7X7-48L package, the size is reduced by nearly 70%, with QFN5X5-48L package. It has a high price competitiveness compared with similar products

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TE Connectivity

TE PCIe Gen 4 Card Edge Connectors

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TE PCIe Gen 4 Card Edge Connectors support speeds up to 16 GT/s. Designed for next-generation CPUs for better system application scaling and higher bandwidth in servers, storage, workstations and desktop PCs. These card edge connectors feature a 1.00 mm pitch to enable all generations of PCI Express signalling designs. Product Features: • Support next-generation processors for better system application scaling and higher bandwidth • Available in a wide variety of configurations, including x1, x4, x8, x16 (36/64/98/164 positions) standard links as per PCI-SIG CEM specification • mm pitch enables all generations of PCI Express signaling designs and support 16 GT/s (Gen 4), 8.0 GT/s (Gen 3), 5.0 GT/s (Gen 2), and 2.5 GT/s (Gen 1) • Footprint and mating interface backward-compatible with each generation

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Silicon Labs

Ultra-Low Power and High Performance EFM32PG23 32-bit MCU

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Though small in size, the EFM32PG23 (PG23) has features that make it useful in many applications, including an Arm Cortex-M33 that can run up to 80 MHz with only 21µA / MHz operating current. In sleep mode, the PG23 can get as low as 1.03 µA. With efficiencies like that, and its LESENSE low-energy sensor interface, the PG23 works extremely well in battery-powered applications. There is also plenty of memory for most algorithms, with up to 512 kB of flash and up to 64 kB of RAM. In addition to a good collection of serial communication peripherals, the PG23 has an LCD controller, a keypad scanner, and a die temperature sensor. To sense signals at the edge, the PG23 has two analog comparators and an analog-to-digital converter with flexible resolution allowing 12, 16, or 20-bit output. Developers can also change modes on the ADC to get 2 Msps in high-speed mode or focus on accuracy and get up to 16 bits ENOB in the high accuracy mode. The improved accuracy makes the PG23 a good choice for some consumer medical or test and measurement applications. The software compatibility with the FG23 and ZG23 families of wireless SoCs is a compelling feature with some of our customers, including some of the leading providers of automation systems for homes and businesses. Security is becoming a critical aspect of many applications, especially those in industrial operations or systems where there are wireless connections. With the most secure MCU available, the PG23 offers confidence to the designer for any application. The combination of best-in-class security, precision analog capabilities, and the excellent low power performance makes the PG23 the ideal MCU for a variety of IoT applications.

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ASIX Electronics Corporation

AX58400 EtherCAT Slave Controller with Dual-Core MCU

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ASIX AX58400 EtherCAT Slave Controller w/ Dual-Core MCU is equipped with Dual-Core 32-bit ARM® Cortex®-M7 core with DSP extension runs up to 480 MHz, 32-bit ARM® Cortex®-M4 core with Adaptive Real-Time Accelerator (ST ART Accelerator™) runs up to 240 MHz and EtherCAT Slave Controller (ESC) with two integrated Fast Ethernet PHYs. AX58400 supports AES/TDES/HASH/HMAC hardware cryptographic accelerators, ROP/PCROP/Anti-tamper security techniques, true random number generator, and additional communication interfaces such as 10/100Mbps Ethernet MAC, USB 2.0 OTG, Camera I/F, TFT-LCD Controller, JPEG Codec, SPI/UART/I2C/I2S/SAI/CAN/SDMMC/ADC/DAC/HDMI-CEC/PWM/DFSDM, etc. The AX58400 is interoperable with all EtherCAT systems with standard EtherCAT protocols such as CoE, FoE, VoE, etc. and is suitable for motor/motion control, digital I/O control, sensors data acquisition, robotics, EtherCAT IO-Link master, EtherCAT Junction slave module, EtherCAT communication module, etc. industrial automation fieldbus applications.

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onsemi

NCN26010 Multi-Drop Industrial Ethernet Controller

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NCN26010 Ethernet controller is designed to provide reliable multi-point communication in industrial settings. It enables more than 40 nodes on a single twisted pair, exceeding five times the amount of nodes requested by the IEEE 802.3cg standard, with an 80% reduction in installation costs and reduce set-up complexity. For in-cabinet wiring, the NCN26010 reduces wiring up to 70% while significantly increasing bandwidth. In backplanes, it simplifies the layout and power distribution without impacting data rates or latencies. Many applications, such as elevators, will be able to increase data throughput over existing wiring with the new device and, due to the ability to carry power over data cables, complex sensor networks can be built upon simple and low-cost cable runs. NCN26010 implements multi-drop 10BASE-T1S (802.3cg) Ethernet that is an effective replacement for legacy point-to-point and multi-point industrial communication standards. The T1S MAC/PHY can replace RS-485, CAN, RS-232, HART and others. As a result, greater data throughput is achieved over existing wiring, eliminating the need to re-pull wires which is often the greatest expense in a networking installation. The NCN26010 also features a proprietary enhanced noise immunity feature which is essential for installations in electrically noisy industrial environments. Additionally, the NCN26010 has lower capacitance on the line pins than existing T1S solutions which allows for more nodes to be implemented on a single network. As the communication with the NCN26010 can be over SPI, the pin count is lower and the package size is smaller. The NCN26010 is the industry’s first PHY + MAC controller for 10BASE-T1S and can connect to controllers, sensors and other devices without the need for an external MAC.

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Nuvoton Technology Corporation

M031G Series

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The NuMicro M031G Series is based on Arm Cortex-M0 core. This series is designed for the pilot tone optical transceiver, traditional optical transceiver, and even for and the PON or GPON products. M031G Series is also suitable for small size application requiring analog circuit, such as small screen, small appliance, power module, pico projector, wearable device, sensor, etc. There are 5 key features of M031G Series: Hardware Manchester Codec, DAC with auto data generation function, Calibrated Accurate Temperature Sensor, Small Package and High Speed I2C.

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Geehy Semiconductor Co., Ltd.

High Performance & High Security APM32F415 Series MCU

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Main features: Geehy High Performance & High Security APM32F415 Series MCU, equipped with 55nm advanced process platform, based on Arm® Cortex®- M4 core integrates the diversified performance of processing + control + networking, and gives full consideration to high computing, high real-time and ease of use. It has the performance characteristics of large capacity, wide temperature range, high integration and high security, which helps customers to expand product application innovation and strengthen product safety protection upgrading. Main specifications: ①Based on Arm® Cortex ®- M4 core ②Working frequency: 168MHz, Flash: 1024KB, SRAM: 192 + 4KB ③Power supply voltage: 1.8V ~ 3.6V ④Support FPU、DSP、PSRAM、NORFlash、NANDFlas, etc ⑤12 bit ADC, sampling rate 2.4msps, supporting 24 external channels ⑥2 channels of 12 bit DAC, each channel has multiple trigger sources to trigger conversion ⑦Add a high-speed OTG HS2 with on-chip PHY integration under full speed and high-speed USB ⑧Up to 114 I / O can be mapped to external interrupt vectors ⑨Rich peripheral resources: U(S)ART,USB OTG, I2C,CAN,SPI,SDIO,I2S,EMMC ⑩Working temperature cover - 40 ℃ ~ + 105 ℃ Application fields: industrial control,instrumentation, medical equipment, smart energy, electronic power Main advantages and comparison with competitors: ①The Working frequency is 168MHZ, and the coremark 437.6 score is higher than that of domestic peers ②New single precision FPU, enhanced DSP and external memory controller EMMC, different from international competitors ③The performance of HSI clock accuracy, FLASH erase time, clock start-up time, temperature drift, etc. is significantly better than that of competitors ④The power consumption of LSE / HSE / Run / Sleep is lower than that of international competitors, and the wake-up time of Stop / Standby is faster ⑤Under full temperature and pressure, LSI startup time is 25% faster than that of international peers ⑥1.8 ~ 3.6V wide voltage, higher than the level of competitive products ⑦Add high-speed OTG HS for on-chip PHY, which is different from international competitors and helps customers reduce PHY costs ⑧The new national secret algorithm BN / SM3 / SM4 and encryption algorithm AES / DES / TDES are more suitable for the different needs of domestic and foreign customers in terms of security

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Infineon Technologies China Co., Ltd

PSoC4 HVMS

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PSoC™ 4 HVMS is a family of products providing one-chip solutions for smart body HMI designs for automotive. PSoC™ 4 HVMS integrates high performance capacitive-sensing blocks, programmable digital blocks along with high-voltage (12V) operation integrating 12V to 3.3V LDO and communication transceivers such as LIN / CXPI PHY, and an ARM Cortex M0+ CPU with embedded memory. PSoC™ 4 HVMS family offer robust capacitive-sensing performance with very high SNR enabling elegant automotive HMI. PSoC™ 4 HVMS family devices are designed to be compliant with the automotive functional safety level of ASIL-B according to ISO 26262, which can ensure safe HMI designs. PSoC™ 4 HVMS family devices can connect directly to a 12V battery supply and to the LIN / CXPI network. Infineon offer total system solution (hardware, software, and collaterals), especially offer automotive qualified (ASPICE and ISO26262) middleware and low level drivers.

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MindMotion Microelectronics Co., Ltd.

MM32F5270

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Equipped with Arm STAR-MC1 CPU, MM32F5270 contains 8KB I-Cache and D-Cache, L1 I/D TCM, Tight Coupled Memory, DSP, FPU, CORDIC acceleration unit. It has 256KB Flash, 192KB SRAM, supporting the QSPI Flash extension and XIP execution. MM32F5270 has a rich set of peripherals, such as Ethernet controller, dual FlexCAN interface, USB Full Speed OTG, comprehensive serial ports, e.g. up to 8x UARTs, dual 3Msps ADC. It fits for the applications requiring high computing power, including industrial automation, elevator real-time control, surveillance and fire system monitor, power management and robotics, etc.

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XIAOHUA SEMICONDUCTOR CO.,LTD.

HC32F460

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Chipsea Technologies (Shenzhen) Corp.

CSC2E101

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Microchip Technology Inc.

Microchip AUTOSAR-ready dsPIC33C Digital Signal Controllers (DSCs)

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The SMC 2000 16x32G and SMC 2000 8x32G are low latency memory controllers designed to CXL 1.1 and CXL 2.0 specifications, DDR4 and DDR5 JEDEC standards and support PCIe® 5.0 specification speeds. The SMC 2000 16x32G is the industry’s highest-capacity controller with 16 lanes operating at 32 GT/s and supports two channels of DDR4-3200 or DDR5-4800, resulting in a significant reduction in the required number of host CPU or SoC pins per memory channel. Typical CXL attached memory modules include 512 GB of memory or more, providing an effective mechanism to increase the memory bandwidth available to processing cores. This new paradigm shift provides data center operators the ability to deploy a broader range of ratios for memory to CPU cores depending on their actual application needs, resulting in improved memory utilization and lower Total Cost of Ownership (TCO). Microchip broad portfolio of dsPIC33C DSCs to cover the large memory segment with the new ISO 26262-compliant dsPIC33CK1024MP7xx family. This new family of dsPIC33C DSCs with 1 MB Flash enables applications running automotive software like AUTOSAR, OS, MCAL drivers, ISO 26262 functional safety diagnostics and security libraries. The family of dsPIC33 DSCs also includes a high-performance Central Processing Unit (CPU) with deterministic response and specialized peripherals for general automotive, advanced sensing and control, digital power and motor control applications. The AUTOSAR-ready dsPIC33C DSCs enable designers to achieve a high level of system optimization by implementing AUTOSAR-based applications, functional safety goals and security use cases in a single microcontroller (MCU) while meeting robust automotive application requirements. This opens up a world of opportunities for designers looking to work with Microchip while expanding into e-mobility and advanced sensing and control applications. The benefit of adopting AUTOSAR-ready devices like this one is that customers can improve their risk and complexity management while decreasing development time through reusability. Customers who have previously designed bare metal or non-AUTOSAR automotive applications and are now adopting AUTOSAR can scale up by staying within the dsPIC33C DSC ecosystem and continuing to take advantage of Microchip’s value-added solutions, customer support and product advantages with the new AUTOSAR-ready dsPIC33C DSCs. The AUTOSAR ecosystem for the dsPIC33C DSCs includes MICROSAR Classic from Vector, KSAR OS from KPIT Technologies Ltd. and ASPICE- and ASIL B-compliant MCAL drivers from Microchip.

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Microchip Technology Inc.

SMC 2000 Smart Memory Controller

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The SMC 2000 16x32G and SMC 2000 8x32G are low latency memory controllers designed to CXL 1.1 and CXL 2.0 specifications, DDR4 and DDR5 JEDEC standards and support PCIe® 5.0 specification speeds. The SMC 2000 16x32G is the industry’s highest-capacity controller with 16 lanes operating at 32 GT/s and supports two channels of DDR4-3200 or DDR5-4800, resulting in a significant reduction in the required number of host CPU or SoC pins per memory channel. Typical CXL attached memory modules include 512 GB of memory or more, providing an effective mechanism to increase the memory bandwidth available to processing cores. This new paradigm shift provides data center operators the ability to deploy a broader range of ratios for memory to CPU cores depending on their actual application needs, resulting in improved memory utilization and lower Total Cost of Ownership (TCO). Microchip’s SMC 2000 CXL memory controllers employ an innovative design that delivers Reliability, Availability and Serviceability (RAS) features to transform solutions to the next level of efficiency and performance. Through CXL connectivity, the SMC 2000 external memory controller enables a CPU or SoC to utilize a broad set of media types with different cost, power and performance metrics without having to integrate a unique memory controller for each different type. For example, using an SMC 2000 controller with DDR-4 memory, advanced CPUs that only directly support DDR5 can now also re-use DDR-4 memory expansion. The dual signature authentication and Trusted Platform support, secure debug, and secure firmware update ensure the SMC 2000 CXL-based controller family also meets all critical storage and enterprise application security needs.

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GigaDevice Semiconductor Inc.

GigaDevice LDO Product GD30LD33 Series

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The GD30LD33 is a high-current, low-noise, high accuracy, low-dropout linear regulator (LDO) capable of sourcing 3A with extreme low dropout (max, 180 mV). It can be used in communication equipment, video conversion equipment, industrial equipment, power equipment, etc. Key Features：  Input Voltage Range – With BIAS: 1.1V to 6.5V – Without BIAS: 1.4V to 6.5V  Output Voltage Range – 0.5V to 5.2V, Set by a Resistor Divider – 0.5V to 2.075V, Pin-Setting, No External Resistor  Accurate Output Voltage Accuracy: 1%, Over Line, Load and Temperature  Ultra Low Dropout Voltage: Maximum 180mV at 3A with BIAS  Ultra High PSRR: 39dB at 500KHz  Excellent Noise Immunity – 5.9uVRMS at 0.5V Output – 9.8uVRMS at 5V Output  Programmable Soft-Start  Competitive advantages:  Lower dropout voltage; smaller output voltage step; better noise immunity ability (Notice: here it means better than most competitive products)

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MORNSUN Guangzhou Science & Technology Co., Ltd.

1000W high power density AC/DC enclosed power supply LMF1000-20B Series

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Input voltage range: 90-264 VAC/ 120-390 VDC Operating temperature range: -40℃ to +70℃ Intelligent wind speed control Remote switch machine, digital communication Support 3+1 parallel redundancy, current sharing accuracy: < 5% It can meet the altitude of 5000m Power density up to 17.22W/ INCH3 EMI bare parts meet CISPR32/EN55032 CLASS B requirements Meet IEC/UL/EN62368, GB4943, IEC/ES/EN60601 standards LMF1000-20Bxx：190.0 x 127.0 x 40.5 mm It can be widely used in industrial control systems, automatic machinery, laser instruments, aging equipment, measurement and control equipment, medical and other fields. The LMF1000 series power supply is smaller in volume and higher in power density than conventional kw power supply in the market. The operating temperature range is wider, the common switching power supply operating temperature range on the market is -20℃ to +70℃, and the minimum operating temperature of Jinshengyang 1000W switching power supply can reach -40℃, which can better adapt to low temperature conditions. High reliability and long life. Product isolation voltage 4000 vac, design meet the IEC/UL/EN62368, GB4943, IEC/ES/EN60601 safety standards Vibration resistance, 10 to 500Hz, 5g 10 minutes/cycle, X, Y, Z axis 60 minutes each;； Long life with a 5-year warranty

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MORNSUN Guangzhou Science & Technology Co., Ltd.

120-550W high power density AC/DC power supply LOFseries

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Input voltage range: 85-264 VAC/ 120-370VDC Work efficiency is 94% Ultra-high power density, small size High safety, safety specifications meet IEC/EN/ES60601 standards, suitable for BF applications Extremely low leakage current < 0.1mA Safety distance input to output is 2×MOPP LOF120：76.2 × 50.8 × 31mm LOF225：101.6 × 50.8 × 25.4 mm LOF350：127 × 76.2 × 25.4 mm LOF450：127 × 76.2 × 38.5mm LOF550：127 × 76.2 × 38.5mm Mainly used in the medical field, suitable for all kinds of BF patients can contact the medical system equipment. Super small size, high power density. In order to reduce the volume and improve the power density, many manufacturers stack the components layer upon layer, which will make the components interfere with each other and other adverse reactions. In the development and design of LOF series power supply, Jin Shengyang increased the degree of integration, simplified the circuit design, and adopted the special design and layout optimization of components to avoid the bad scene of stacked beds, so that each component can give full play to its own ability without affecting each other. Strictly control and ensure delivery. High-performance devices, patented transformer designs, PCB precision layouts, etc. are not difficult at the engineering sample stage, but become problematic at the delivery stage. Jinshengyang relies on strict material selection, multi-party review system and material preparation mechanism to ensure that each design not only achieves the ultimate performance, but also guarantees a large number of fast delivery.

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MORNSUN Guangzhou Science & Technology Co., Ltd.

30-400W DC/DC brick power supply

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Wide voltage input: 36-75VDC input Standard packaging 1/16 brick, 1/8 brick, 1/4 brick Efficiency up to 93% 1/16砖33.02*22.86*9.18mm、1/8砖58.42*22.86*9.69mm、1/4砖57.9*36.80*10.05mm 1/16 brick 33.02*22.86*9.18mm, 1/8 brick 58.42*22.86*9.69mm, 1/4 brick 57.9*36.80*10.05mm It is mainly used in communication, power, instrumentation, industrial control and other fields. In the communication field, it can be used in POE switches, base station network equipment, and private network communication system. Using The independent IC of Jinshengyang, adopting the technology of shaking frequency, dropping frequency and hopping frequency to improve the light load efficiency, reduce the no-load power consumption, and improve the EMI performance at full load; Active clamping technology is adopted to recycle the leakage sensation and improve the transfer efficiency under full load. As a result, the average conversion efficiency of this series of products under various loads is > 90%. Currently, due to the impact of the epidemic and the overall environment, there is a shortage of chips. However, Jinshengyang adopts independent IC and home-made materials to help solve the shortage problem and make delivery more reliable. Mornsun with a whole set of perfect quality control system through from product design to production of each link, and mornsun with third party certification authority witness laboratory, reliability is more assured.

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MORNSUN Guangzhou Science & Technology Co., Ltd.

15-480W ultra slim DIN-Rail power supply LI/LIF series

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Universal input voltage range: 85-264VAC / 120-373VDC, can be used in both AC and DC; Ultra-thin and compact structure design:The volume is only 41*124*110mm, the thickness is only 41mm, the ultra-thin scheme is far beyond the mainstream market (the volume is 20% less than similar products in the market) High efficiency and high reliability:The efficiency of this series of products is as high as 94.0%, with output short-circuit, over-current, over-voltage, over-temperature protection, with PFC function, DC OK function; Quality assurance Products meet the multi-environment application performance, high reliability, can guarantee the product 3 years of warranty, with a long life, MTBF up to 300,000 hours. LI15-20BxxPR2：90.00*58.00*17.50mm LI75-20BxxR2S：32.00*125.00*87.50mm LI120-20BxxR2：35.00*125.00*112.7mm LIF240-10BxxR2：124.00 x 41.00 x 110.00 mm LIF480-10BxxR2：131.50 x 48.00 x 125.00 mm It can be widely used in industrial control, intelligent building, electric power industry, medical equipment, petrochemical and other fields. LI/LIF series improves the power efficiency of the whole machine and reduces power loss up to 94% by optimizing the circuit topology. With lower heat loss, the service life of the products and the tolerance to high temperature working environment can be improved from the root. Compared with the same type of power supply on the market, it has obvious advantages in efficiency and temperature rise index. Compared with conventional products on the market, jin Shengyang LI/LIF series is smaller in size and easy to install and use. Based on some special application environments in the market, the product is better suited for relatively special environments, such as rain forest belt, vegetable greenhouses and other areas with high humidity sensitivity, by optimizing the shell: the outer frame is protected by electroplating nickel and thickening the coating to improve the corrosion resistance and oxidation ability; The screw uses double-layer non-slip spacers to reduce grounding impedance and improve anti-vibration performance. It is suitable for mechanical manufacturing equipment, logistics sorting and other areas with strong vibration.

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Shenzhen Thinkplus Semiconductor Co., Ltd.

SMART PMIC chip for smart wearable devices, SY5500

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SY5500 is the industry's first SMART PMIC chip with high integration, low power consumption and high reliability designed specifically for SMART wearable devices, such as TWS Bluetooth headset and AR glasses, etc., with internationally leading functions. At present, SY5500 has no competitive products of the same type in the global market. SY5500 can realize the functions of charging and isolation communication at the same time. It innovatively integrates the functions of lithium battery charging management, battery protection, hardware watchdog, power line communication, intelligent in-warehouse and off-warehouse identification into a 1.6×1.6mm ultra-small package chip. Instead of the traditional system solution that requires multiple chips such as charge management, battery protection and signal chain, SY5500 is especially suitable for wearable electronic products with high space requirements. SY5500 integrates private control commands. The headset charging compartment can send commands to control SY5500 through VIN to realize the switch on and switch off of the headset main control and reset operation. Support intelligent identification of in/out state, and actively inform the headphone master; The maximum charging current external resistance is adjustable, and allows constant current charging ICC, float charging voltage VFLOAT gear I2C adjustment; SY5500 integrates NTC detection, battery discharge protection, and SHIPmode functions to charge and discharge batteries more safely. SY5500 has passed the IEC62368 international safety certification. Due to the advantages of high integration, multi-function and low power consumption, and ultra-small size package, SY5500 can be perfectly suitable for smart wearable applications and devices. Currently, it has been applied to smart TWS Bluetooth headset, wireless microphone, smart glasses and other portable electronic products.

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Texas Instruments

UCC14240-Q1, 3-kVRMS isolated DC/DC module with integrated transformer

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The UCC14240-Q1 is the industry’s smallest and most accurate 1.5-W isolated DC/DC bias-supply module. The UCC14240-Q1 uses a proprietary integrated transformer technology to enable designers to cut their power solution size in half for use in high-voltage environments such as electric vehicles (EVs), hybrid EVs, motor-drive systems and grid-tied inverters. The UCC14240-Q1 offers size and efficiency advantages that enable greater power density and system efficiency, which can allow vehicles to drive farther between charges. The 3.55-mm height and small footprint of the UCC14240-Q1 enable designers to reduce the power solution volume by as much as 50%, packing more power in half the size. The height reduction also gives engineers the full flexibility to place the module on either side of the printed circuit board. This dual-output power module offers 60% efficiency – twice that of traditional bias supplies – doubling the power density and helping increase vehicle driving range. By delivering more than 1.5 W at ambient temperatures of 105°C, the UCC14240-Q1 enables engineers to drive isolated gate bipolar transistors (IGBTs), silicon carbide (SiC) and gallium nitride (GaN) switches at high frequencies. By leveraging TI’s integrated transformer technology with a 3.5-pF primary-to-secondary capacitance, the UCC14240-Q1 can mitigate EMI caused by high-speed switching and comfortably achieve common-mode transient immunity (CMTI) performance of more than 150 V/ns. Drivers will continue to demand vehicles with lower emissions, longer ranges, better safety and reliability, and generally more features for less money. Only advances in power electronics can make these demands possible in EVs, including innovations in power architectures and their associated isolated gate drivers and bias supplies. Fully integrated power solutions such as the UCC14240-Q1 bias supply module, which switches at high frequencies, can provide both system-level space and weight savings.

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STMicroelectronics

ST-ONE

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ST-ONE is the world’s most integrated digital controller for USB-PD chargers with ZVS Active Clamp Flyback + Cotex-M0 MCU + Synchronous rectifier + USB-PD controller + Galvanic Isolation. Key features & benefits Performance • >30W/inch3 power density • >94% peak efficiency • >1MHz operations Easy Design • 32bit Cortex M0+ core • 64kB embedded flash memory • USB-PD 3.1 PPS certified Benefits • Small weight and size • Works with GaN and planar transformers • High efficiency soft switching topology • Short BOM • Reinforced galvanic isolation ST-ONE is well performed in 4 areas: High power Density • Light weight • High frequency • GaN transistors • Planar transformers High Efficiency • Soft switching • Low standby • Multimode operation Flexibility • Single or multi-port • Flash memory • Protocol management BOM Saving • All-in-one • Embedded Galvanic isolation Also using the MasterGaN integrated power stage with advanced wide-bandgap transistors and optimized drivers, adapters operate at elevated switching frequencies and thus permit smaller-size magnetic components to maximize power density. ST also provides the reference design, EVLONE65W, enables a 65-Watt USB-C adapter of the same size and weight (less than 70g in a 37cm3) of a standard 20-Watt smartphone charger to handle the demands of charging a laptop. This unit achieves the world’s highest power density, packing more than 1.8 Watts of power per cubic centimetre.

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ROHM

Ultra-High Efficiency Battery Management Solution

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The REFLVBMS001-EVK-001 is equipped with a power supply IC (buck DC/DC converter IC) and reset IC (voltage detector IC) utilizing original Nano Energy™ ultra-low current consumption technology. In addition, it consists of a battery charger IC that supports low voltage rechargeable batteries, along with the NGK INSULATORS’s thin, large capacity EnerCera® li-ion rechargeable battery. The ultra-low current consumption of the power supply IC (quiescent current 180nA) minimizes loss. The battery charger IC is suitable for a wide range of charge voltages; it is capable of charging, monitoring, and discharging batteries making it ideally suitable for compact IoT devices. The result is a low profile, ultra-efficient battery management solution that achieves a thickness of just 0.60mm for mounted components (including the thin rechargeable battery). Application Examples  Wearables such as smart watches, keyless entry  Compact industrial IoT devices, including electronic shelf labels, smart cards, smart meters, and alarms And other IoT equipment requiring smaller, thinner form factors and longer battery life

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Wuxi Botong Microelectronics Technology Co., Ltd.

G1661D+G3617CF，G1662D+G3617CF

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G166xD is a quick charging power chip with a single chip integrated super-junction MOSFET, which can provide a quick charging solution with high power density and high cost performance of 30~45W. Its main features are: 1. Using 100V high-voltage BCD process, the VCC voltage can reach 85V, and there is no need for external step-down circuit; 2. The optimized multi-mode operation mode is adopted to achieve higher conversion efficiency of each load point and extremely low standby power consumption; 3. With 90kHz high working frequency, CCM&QR working mode and DFN6*5 custom package, small volume design with low temperature rise and excellent EMI performance can be achieved. 4. Optional high voltage start and X-cap discharge function。 Specification: customized DFN6*5-10pin package Application fields: Portable devices, Intelligent terminals, etc Main advantages and characteristics compared with competitors: 1. Highly integrated, no need for peripheral step-down circuits; 2. Integrated super-junction MOSFET, with mature and reliable product technology, is more stable and reliable than GaN scheme, and the delivery cycle is more guaranteed; 3. High main frequency + valley conduction technology, high conversion efficiency, smaller size and extremely low temperature rise; 4. It provides perfect protection function and has higher reliability for multi output voltage of quick charging power supply.

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Weltrend Semiconductor, Inc.

USB PD 3.1 Controller

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The WT6676F and WT6677F are industry's first USB Power Delivery (USB PD) controllers that support the USB PD Revision 3.1 specification. The WT6676F supports output voltages of up to 28V/36V while the WT6677F supports that of 28V/36V/48V. The USB PD 3.1 specification is a major update on USB PD specification that allows delivering up to 240W of power over USB Type-C® cable and connector that supports more applications with higher power requirements such as larger notebook PCs, wireless hand tools, wireless household appliances, electrical bicycles and etc. Prior to this update, USB PD 3.0 is limited to 100W. The WT6676F and WT6677F are highly integrated USB PD controllers that support USB PD 3.1 Standard Power Range (SPR) and Extended Power Range (EPR) specification as well as Qualcomm® Quick ChargeTM 4, Quick Charge 4+, and Quick Charge 5 technologies. It is designed for USB Type-C power source applications such as power adapters, wall chargers, car chargers, power strip, and etc. The WT6676F and WT6677F both minimize external components by integrating USB PD baseband PHY, USB Type-C detection, shunt regulator, voltage and current monitors, NMOS load switch driver, an 8-bit MCU and VCONN power to allow small form factor and low BOM cost. Wide operation range (3.3V to 45V/55V) supports 5V to 36V/48V USB PD 3.1 SPR and EPR specification. A Multi-Time-Programmable ROM is provided for program code and user configuration data.

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Leadtrend Technology Corporation

LD9174X2+LD8925X2

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In order to enhance the efficiency performance, the LD9174X2 integrates the multi-mode PWM controller, which consists of Quasi-Resonant (QR) PWM control for light load condition and Continue Conduction Mode (CCM) for heavy load condition. Moreover, the QR controller gains the system performance, but also brings the worse EMI capability, especially at boundary mode in heavy load. While the frequency swapping function of LD9174X2 can reduce the EMI emission of SMPS and helps the power circuit designers to simply deal with EMI filter and saves several component and developing time. The LD9174X2 is implemented in SOP-8/DIP-8 package, and includes the comprehensive protection function, such as Over Load Protection (OLP), Over Voltage Protection (OVP), Secondary Diode Short Protection (SDSP) and internal Over Temperature Protection (OTP). Furthermore, the programmable Brown-in/out Protection is built-in, it match with LD8925X2 secondary side synchronous rectification (SR) driver IC, control core are packaged in SOP-8, It is suited for CCM, DCM and QR mode. When PSR works in sleep mode, LD8925X2 can wake up it in time. Furthermore, it responds quickly to the dynamic load. To reduce assembly process, layout area, and production cost, SR MOSFET.

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Monolithic Power Systems

MP8017, PoE-PD Solution with Active-Clamp Primary- or Secondary-Side Regulation Flyback Converter

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The MP8017 is an integrated IEEE 802.3af compatible PoE Powered Device with integrated PD interface and fly-back power converter. It is targeted for small size 13W isolated PoE applications. The PD interface has all the functions of IEEE 802.3af PD including detection, classification, inrush current, operation current limit, and 100V input MOSFET. The integrated fly-back converter is specifically designed based on active clamp primary-side regulate (PSR) fly-back topology with all the power MOSFETs, it works with up to 650kHz frequency and housed in one small size QFN-3mmx4mm package. MP8017 integrates all the function and required devices, it supports PoE power design with less BOM cost, smaller PCB size and shorter design cycle since a simplified solution requires fewer external components. The PSR feedback from SW node simplifies transformer design, 650kHz switching frequency also reduces the size of transformer and input/output capacitors. Optimized EMI design in MP8017 supports the PoE power with good EMI performance without common mode choke filter and PCB layout concern. With the high integration and proprietary control solution, MP8017 is one of the best solution for PoE-PD power in application like security cameras, VoIP phones, WLAN access points and all other IEEE 802.3af-compliant devices.

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onsemi

Automotive Traction SiC Power Module VE-Trac Direct SiC

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NCP1681 is dedicated to bridgeless totem pole PFC (TP PFC) topology. It operates on universal mains input (90 – 265 Vac), extending the benefits of code-free TP PFC design into kilowatt power. NCP1681 targets ultra-high density high power offline power supplies, including server, high performance computing, telecom, industrial and OLED TV. The bridgeless totem pole PFC topology eliminates the diode bridge present at the input of a conventional PFC circuit, significantly improving power-stage efficiency. The NCP1681 provides control signals for a fast-switching leg driven at the pulse-width-modulation (PWM) switching frequency and a second leg that operates at the ac-line frequency. The controller can be used with nearly any switching device, from conventional super junction silicon MOSFETs to Wide Bandgap devices based on silicon carbide (SiC) or gallium nitride (GaN) transistors. The NCP1681 simplifies the design of bridgeless TP PFC by employing a novel current-limiting architecture and line phase-detection mechanism. The cycle-by-cycle current limit is realized without the need for a Hall Effect sensor. The NCP1681 can be configured to work in either fixed frequency continuous conduction mode (CCM) or multi-mode operation, where the controller naturally transitions between CCM and critical conduction mode (CrM) for optimal performance across power levels. Challenging efficiency standards such as ‘80Plus’ or ‘CoC Tier 2’, that require high efficiency over a wide load range, can also be met, while reducing design time and cost, thereby delivering solutions to market quickly. At high line, NCP1681 TP PFC solutions will achieve close to 99% efficiency.

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SHENZHEN ICM MICROELECTRONICS CO.,LTD.

CM1004

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Wuxi Chipown Microelectronics Co.,Ltd.

Bridgeless Totem Pole Power Factor Correction Controller

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Key Features： 1. Configurable Operation Frequency of 135/270/500KHz. Supporting Si/GaN MOSFET 2. Built-in 600V Half-bridge driver with current monitor function, cycle by cycle current limit protection. 3. Support COT mode 4. Support TCM mode, no traditional ZCD winding needed 5. Built-in digital PID loop compensation 6. Self-adapted dead-time detection 7. Built-in Soft-start function 8. Built-in Burst Mode 9. Support flexible applications with external configurations 10. All-round protections  VCC output Under-Voltage-Protection  Output Over-Voltage-Protection  Communicate under-voltage protection  Cycle-by-cycle Over Current Protection  Internal/External Over-Temperature-Protection  Open/Short Protection  Surge Protection Compared with xxx1680, PN6811 has advantages in: 1. Higher integration and simplified peripherals. The PN6811 integrates two 600V half-bridge drivers, which can directly drive power MOSFETs. While the xxx1680 requires two extra half-bridge drivers, resulting in a complex application.； 2. Higher efficiency. The PN6811 adopts triangular current control (TCM) mode and self-adaptive dead-time detection, which can minimize the switching power loss. The xxx1680 needs to add a detection winding to the inductor to realize valley turn-on (QR), and the turn-on loss increases with the increase of the input voltage. 3. More accurate and timely OCP protection. The PN6811 integrates cycle-by-cycle fast current limiting protection on the 600V half-bridge driver, and realizes OCP timely and accurate protection by detecting excitation current. While the xxx1680 realizes OCP by detecting degaussing current, so the latter is impossible to control the power device from the excitation source untimely. 4. Self-adaptive dead-time. The PN6811 realizes the self-adaptive dead-time function through the DT pin. This function can not only prevent the straight-through bombing of the bridge arm caused by the dead zone being too short, but also avoid the lower conversion efficiency caused by the dead zone being too long. The xxx1680 does not have this function. 5. Multiple operation mode supported. The PN6811 supports flexible configuration setting for peak-operation-frequency setting, output mode setting, negative-current for TCM mode configuration, X-capacitor current compensation depth configuration and half-cycle operation mode configuration, while the xxx1680 has fewer configurable parameters. 6. Wider VCC operation voltage range, stronger lighting resistance capability and ESD protective effect. The PN6811’s BV of pin VCC is 40V while xxx1680’s is only 30V.

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Fu Da Tong Technology Co., Ltd

300W Wireless Power Transfer Reference Design

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Power Integrations Inc

HiperLCS™-2 chipset for LLC resonant power converters

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The energy-saving HiperLCS™-2 chipset is a new IC family that dramatically simplifies the design and manufacture of LLC resonant power converters. The new dual-chip solution features an isolation device with a high-bandwidth LLC controller, synchronous rectification driver and FluxLink™ isolated control link, alongside a separate half-bridge power device utilizing Power Integrations’ unique 600 V FREDFETs with lossless current sensing and high- and low-side drivers. This highly integrated, energy-efficient architecture eliminates heatsinks and reduces component count by up to 40 percent compared to discrete designs. Resonant converters using separate controllers and discrete MOSFETs can be incredibly bulky and are notoriously difficult to manufacture due to their complexity and high component count. PI applies advanced FREDFETs and magneto-inductive FluxLink technology to the LLC topology, yielding 98 percent efficiency and reducing component count by 40 percent, while eliminating bulky heatsinks and unreliable optocouplers. Power supply designs based on the new HiperLCS-2 can achieve no-load input power of less than 50 mW at 400 VDC input and provide a continuously regulated output, easily complying with the world's most stringent no-load and standby efficiency regulations. HiperLCS-2 devices operate at high efficiency across the load range with dissipation so low that direct heat transfer through the FR4 PCB is all that is required, eliminating heatsinks in adapter designs up to 220 W continuous output with up to 170 percent peak power capability. All HiperLCS-2 family members feature self-powered start-up and provide the start-up bias for a PFC stage using the company’s HiperPFS™ ICs. Secondary-side sensing provides less than one percent regulation accuracy across line and load range and across production variations. The use of Power Integrations’ FluxLink technology for safety-isolated high-speed digital feedback control provides much faster transient response and far superior long-term reliability compared to optocouplers.

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Power Integrations Inc

HiperPFS™-5

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HiperPFS™-5 power-factor-correction ICs with integrated 750 V PowiGaN™ gallium-nitride switch have an efficiency of up to 98.3 percent, deliver up to 240W without a heat sink and can achieve a power factor of better than 0.98. HiperPFS-5 ICs combine PI’s proprietary GaN switch with a quasi-resonant, variable-frequency discontinuous mode boost PFC topology. By pairing HiperPFS-5 ICs with the company’s HiperLCS™2 chipset or its InnoSwitch™4-CZ active-clamp flyback ICs, designers can easily beat even the most aggressive efficiency regulations while cutting the bill of materials by half and achieving extremely attractive form factors for ultra-fast chargers. HiperPFS-5’s QR DCM control technique adjusts the switching frequency across output load, input line voltage and input line cycle, ensuring low switching losses and permiting the use of a low-cost boost diode. The variable frequency engine allows the reduction of boost inductor size by more than 50 percent compared to conventional critical-conduction-mode (CRM) boost PFC circuits. At light loads an innovative power-factor-enhancement (PFE) feature compensates for input filter capacitance, maintaining a high PF of 0.96 even at 20 percent load. No-load power consumption is just 38 mW. Other benefits accrue due to the robust 750 V PowiGaN switch. In many locations worldwide the mains' power can be unstable, often leading to over-voltage failure of power supply components. HiperPFS-5 ICs maintain a high power factor up to 305 VAC and can operate continuously at up to 460 VAC during line swells. Additionally, HiperPFS-5 ICs incorporate Power Integrations' automatic X-capacitor discharge (CAPZero™) function, including the required redundant pins to meet safety regulations, and high-voltage self-start-up—all in a low-profile SMD power package. Exposed cooling pads featured in the package are at source potential, providing effective cooling and simplifying the EMI solution. Digital line-peak-voltage detection ensures robust performance, even in the presence of distorted input from UPS or generators.

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Wayon Electronics Co.,Ltd.

Capacitorless Low Dropout Regulator WR0340 series

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WR0340 series low dropout regulator (LDO) ，which can source 300 mA of outputCurrent，features low quiescent power consumption of 30uA, high accuracy (1%) ， good linearity and load transient response.The capacitorless design technique enables loop stability and fast transient response to load jumps without off-chip capacitors. In the absence of capacitors, the output voltage amplitude changes within 70mV with the output current changing from no-load to 300mA or vice versa. Compared to most LDO on the market, which require at least 0.1µF off-chip capacitance to maintain loop stability and fast transient response, this design eliminates the need for capacitance at the output, providing customers with significant savings in PCB area and product cost. Currently, the product is mainly used in the netcom and consumer electronics industries.

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Chipone Technology(Beijing) Co.,Ltd.

Ultra-high resolution AMOLED power management chip

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The ultra-high-resolution AMOLED power management chip iML7532 is a power management chip for AMOLED notebook (NB) screens. The iML7532 is the first Li-ion battery in China to support up to four Li-ion cells in series with a current of 2A, a high voltage and high current suitable for notebook screen applications. It also supports I2C protocols and NVM functions for greater flexibility of use. The iML7532 uses built-in compensation to minimise PCB space and cost for customers. Currently, iML7532 has been verified by the client, and this IP can be extended to the application of AMOLED notebook screens for different customers in the future, accelerating the development of AMOLED notebook screens and strengthening the independent and controllable capability of China's display chip technology. The mass production of iML7532 will promote the application of AMOLED notebook screen a big step forward, driving domestic AMOLED screen manufacturers can break the exclusive position of Korean AMOLED screen manufacturers.

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Toshiba Devices & Storage (Shanghai) Co., Ltd

MOSFET of XPQR3004PB

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Toshiba XPQR3004PB is enhancement mode silicon N-channel MOS. 40V/400A spec, AEC-Q101 qualified, suitable for automotive application, large current &high reliability. The device have leading level ultra-low Rdson=0.23mΩ(typ)(Vgs=10V), suitable for large current application. The device use Cu connector technology, have leading level ultra-low Zth(ch-c)=0.2℃/W(max) and better power cycle life time, provide more Tj margin & better reliability. The device use L-TOGL™ package, provide much longer thermal cycling on board reliability than TOLL package, solder material has much longer lifetime before crack. Suitable for high reliability applications like automotive. The device support Vth sorting tape package. ΔVth<0.4V in every reel. Suitable for current balance in parallel application. The device already MP in top level automotive customer. Looking forward for your inquiry.

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China Micro Semicon Co.,Limited

CMS2D1B012CSPA

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Innoscience (Zhuhai) Technology Co., Ltd.

InnoGaN INN100W032A

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BYD SEMICONDUCTOR COMPANY LIMITED

Super Hybrid DM4.0 IGBT Module

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Shenzhen BASiC Semiconductor LTD.

Pcell™ - Automotive Half-bridge SiC MOSFET modules

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Texas Instruments

TPSI3050-Q1 and TPSI2140-Q1 solid-state relays

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Designing for higher reliability in isolated high-voltage environments, such as electric vehicle (EV) battery management systems, typically requires adding components that can increase the size, weight and cost of a vehicle. This solid-state relay portfolio from Texas Instruments (TI) integrates power and signal transfer in a single chip, helping engineers eliminate components from their designs and reduce solution size and cost. The TPSI3050-Q1 isolated switch driver with an integrated 10-V gate supply and the TPSI2140-Q1 1,400-V, 50-mA isolated switch both integrate power and signal isolation across a single barrier using a unique approach that improves reliability, while significantly reducing solution size and cost compared to existing electromechanical relays and solid-state photorelays. The solid-state relays can disconnect and connect loads through a single isolation barrier in microseconds – compared to milliseconds for electromechanical relays – to enable safer operation of high-voltage automotive systems. The TPSI3050-Q1, which offers reinforced isolation up to 5 kVRMS, also provides an operating lifetime that’s 10 times higher than electromechanical relays, which can degrade over time. Additionally, the TPSI2140-Q1 offers basic isolation up to 3.75 kVRMS, enabling it to achieve more than four times higher time-dependent dielectric breakdown reliability than solid-state photorelays.

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Alpha and Omega Semiconductor

Smart Motor Module

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The AOZ9530QV is an integrated half-bridge gate driver with smart functions. The device includes one half-bridge gate driver, capable of driving high-side and low-side N-channel MOSFETs. Using two AOZ9530QV for single phase motor driver and three AOZ9530QV for three phase motor drivers. The device features multiple protection functions such as over current protection, short circuit protection, and over temperature protection. Moreover, AOZ9530QV provides adjustable gate drive sink and source current control. By doing this control, user can optimize performances of EMI and efficiency. The AOZ9530QV is available in a 3mm×3mm QFN-18L package and is rated over a -40°C to +125°C ambient temperature range.

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Alpha and Omega Semiconductor

AONS30300

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AONS30300 with the AOS latest Alpha LV MOSFET technology, achieved both extremely low Rdson(DFN5*6, 30V, 0.57mohm max@Vgs 10V) and excellent SOA performance, perfect fit to 12V hotswap application in Server and high performance computing market. As the lowest Rdson product in this field, it could help customer achieve really high power density design and surely with highest efficiency, and the excellent SOA performance could help customer to build a safe and reliable power supply system.

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STMicroelectronics

VIPerGaN -High voltage GaN converters

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Key features • Advanced quasi-resonant flyback controller • 650V GaN HEMT • Embedded HV startup generator • Embedded protections • Up to 240kHz switching frequency + jittering • Less than 30mW standby power consumption • Dynamic blanking time and adjustable valley sync • Adaptive burst mode Key benefits • Easy entry to wide bandgap • Lighter and smaller PCB • Higher power density • Minimized magnetic components ed EMI filter • Higher efficiency • Energy saving regulations: Low standby, high efficiency • Robustness: reliability, ESD immunity, self-protected • Versatility: Easy design for key low-power SMPS topologies • Compactness: Advanced controller for effective BOM

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Shenzhen Bronze Technologies Ltd.

QD1021 and QD2021 chipset

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ams OSRAM

Vegalas™ RGB Laser module

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Today’s market for AR or MR smart glasses is largely restricted to specialist industrial or profes-sional applications. This is because components such as the projection light engine or battery are still rather large and heavy, and require bulky frames to support them. The opportunity for manufac-turers to produce consumer-friendly smart glasses – which some observers see as the next genera-tion of mobile computing, to replace the smartphone – depends on achieving a massive reduction in the size and weight of these components, without compromising the displayed image quality or brightness. The introduction by ams OSRAM of a prototype design for the Vegalas™ module demonstrates that a light engine for smart glasses can be as small as 0.7cm3 – compact enough to fit in standard consumer fashion frames. The optical and mechanical innovations in the Vegalas™ module are set to dramatically accelerate the growth in the market for smart glasses. Optical technology from ams OSRAM has previously been crucial to the development of market-changing features of new smartphone designs, such as face recognition, camera enhancement, and no-bezel displays. Now ams OSRAM is at the heart of the next revolution in mobile computing, enabling smart glasses to enter the mainstream consumer market.

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Efficient Power Conversion Corporation

ePower™ Chipset （EPC23101 + EPC2302）

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EPC23101 ePower™ GaN IC chipset redefines power conversion. It integrates 100 V GaN driver and FETs up to 65 A offering higher performance, smaller solution size for high power density applications including DC-DC conversion and motor drives. The combined chipset footprint is 7mm x 5mm. Designers can use ePower Chipset to make lighter weight and more precise battery-operated BLDC motor drives for eMotion, robotic arms and drones, higher efficiency 48 V input DC/DC converters for data center, datacom, AI, solar MPPT and other industrial, consumer applications. EPC23101 IC uses EPC’s proprietary GaN IC technology and includes integrated 3.3 mOhm RDS(on) high side FET with gate driver, input logic interface, level shifting, bootstrap charging, gate drive buffer circuits and gate driver output to drive external low side eGaN FET. EPC2302 eGaN FET offers a super small RDS(on) (just 1.8 mOhm) with very small QG, QGD, and QOSS parameters for low conduction and switching losses. EPC23101 and EPC2302 feature a thermally enhanced QFN package with exposed top with optimized pinout between the two devices.

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Nexperia

Automotive ASFETs for Airbag

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When choosing a MOSFET to regulate the supply voltage to the squibs in an airbag system, the choice has traditionally been limited to older generations of silicon technology, such as the legacy wire-bonded DPAK package. This is due to the safe operating area (SOA) being greater for trench technologies with wider cell pitch when operating in linear mode. The MOSFET must be able to handle a current proportional to the number of squibs in the system, whilst regulating their supply voltage for long enough to activate the airbags. Nexperia have designed a range of Application Specific MOSFETS (ASFETs) to address the specialized needs of airbag applications, focused on enhanced SOA performance for improved linear mode.

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SGKS

1200V SiC JBS，KS10120-A

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SGKS 1200V 10A silicon carbide JBS-KS10120A has the characteristics of low conduction loss, high switching speed and high reliability. It has obvious advantages in the application of new energy vehicles, photovoltaic and other fields. KS10120A has ultra-low leakage current, and the leakage current of the product is less than 1uA at 1200V; At normal temperature, IF = 10A, VFtypical = 1.3V, i.e. it has very low conduction loss in the case of positive conduction. KS10120A is a merged pin silicon carbide Schottky barrier diode. It is a unipolar device. During the switching process, the device has no reverse recovery time and reverse recovery loss. Only the capacitor generated by its junction capacitance stores charge, and its charge value is very small. Therefore, KS10120A has the advantages of high frequency, high speed and low switching loss during the switching process. At the same time, KA10120A has good reliability. Our HTRB test has passed the verification of 960V 150C 1000h, and also passed the automobile level HTRB certification of 1200V 175C 1000h. After HTRB, the parameters of the product are not degraded, and there is no device failure. The reliability advantage of the product is obvious. KS10120A can reach the surge capacity of 8 times the rated current, and the surge reliability of the device is very excellent. It can be applied more confidently in the power application field. Compared with its competitors, SGKS adopts independent and innovative patented technology and cooperates with internationally renowned wafer foundry enterprises to conduct wafer casting. Our product performance parameters are superior and the supply chain is stable. In terms of parameters, compared with other manufacturers, KS10120A has many advantages such as very low forward conduction voltage drop, high surge capacity and high reliability.

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Leadtrend Technology Corporation

LD6617X

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The LD6617 is a highly integrated USB Power Delivery (USB PD) controller that supports USB PD 3.1 SPR & EPR 28V/36V specification. The LD6617 is a specially designed IC for USB Type-C power source applications such as power adapters, wall chargers, car chargers, etc. An 8-bit MCU is embedded to handle PD protocol and device manager with built-in Bi-phase Mark Coding (BMC) PHY for USB PD 3.1 SPR & EPR 28V/36V specification or other proprietary protocols (e.g.QC2.0/QC3.0). As expected, the power noise will be increase, when a device will provide more high power due to the support of USB PD 3.1. The LD6617 has an optimized BMC physical (PHY) which can implement communication by differential signal to efficaciously prevent power noise. To minimize external components, the LD6617 integrates optimized BMC PHY, blocking N-MOSFET driver, a voltage/current monitor, and controller. The 3.3V to 45V wide operation voltage makes LD6617 can supports USB PD 3.1 SPR & EPR 28V/36V specification.

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WeEn Semiconductors Co.Ltd

Gen2 1700V SiC MOSFET Technology

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onsemi

Automotive Traction SiC Power Module VE-Trac Direct SiC

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VE-Trac™ Direct SiC family from onsemi is highly integrated Silicon Carbide (SiC) power module, with industry-standard footprints for Hybrid and Electric Vehicle (HEV) traction inverter application. The module integrates the second generation of 900V SiC MOSFET technology from onsemi in a 6-pack configuration, with a low turn on resistance (1.7 mΩ), to achieve new levels of performance, efficiency, and quality. For assembly ease and reliability, a new generation of press-fit pins is integrated into the power module signal terminals. In addition, it also integrates an optimized pin−fin heatsink in the baseplate. To enhance reliability and thermal performance, sintering technology is applied for die attach. Unique strengths: • 6-Pack for Cost efficient system integration • SiC MOSFET for high Inverter Peak Output Power, High Efficiency and reliability • Direct cooling with integrated Pin-fin heatsink, and sintering technology, further improving thermal performance and reliability Application VE-Trac Direct SiC is designed for EV/HEV traction inverter to convert battery energy into large amounts of torque and acceleration. The SiC-based power modules enable longer range, higher efficiency and faster acceleration for EVs. Prospects The VE-Trac offerings, including previously introduced VE-Trac Dual and VE-Trac Direct platforms, are available in silicon-based IGBT and in SiC with various voltages, and for traction inverter power ranging from 100 to 250 kW. With its standardized mechanical footprints and expanded power ratings, the VE-Trac product family is designed to effortlessly scale EV power outputs, accelerating the adoption of EV/HEVs.

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UnitedSiC (Qorvo)

6m ohm 750v Gen 4 SiC FET.

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The industry’s best 750V, 6mohm device. At a RDS(on) value of less than half the nearest SiC MOSFET competitor with a robust short-circuit withstand time rating of 5μs. The advantages are quantified by Figures of Merit (FoMs) such as RDS(on) x A, a measure of conduction losses per unit die area. Gen 4 SiC FETs achieve the lowest values in the market at both high and low die temperatures. FoM RDS(on) x EOSS/QOSS is important in hard-switching applications and is half the nearest competitor value. FoM RDS(on) x COSS(tr) is critical in soft-switching applications and UnitedSiC device values are around 30% less than competitor parts, rated at 650V compared with UnitedSiC’s at 750V. For hard switching applications, the integral body diode of SiC FETs is superior in recovery speed and forward voltage drop to competing Si MOSFET or SiC MOSFET technologies. Other advantages incorporated into the Gen 4 technology are reduced thermal resistance from die to case by advanced wafer thinning techniques and silver-sinter die-attach. These features enable maximum power output for low die temperature rise in demanding applications.

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JieJie Microelectronics (Shanghai) Technology Co., Ltd.

JMSL030SAG

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Power Integrations

1700V InnoSwitch3-AQ SiC Automotive-Qualified power supply IC

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InnoSwitch3-AQ 1700V ICs are industry’s first automotive-qualified switching power supply ICs to incorporate a silicon carbide primary switching MOSFET. Delivering up to 70W of output power, the ICs are targeted for use in 600V and 800V electric passenger vehicles, as well as electric buses, trucks and a wide range of industrial applications. Highly integrated InnoSwitch ICs reduce the number of components required to implement a power supply by as much as 50 percent, saving significant PCB space, enhancing system reliability and mitigating component sourcing challenges. 800V batteries are becoming standard for EVs. Multiple vehicle systems are connected to this powerful electrical source, yet delicate electronic control circuits require just a few volts for operation and communication. InnoSwitch devices allow the electronics to safely sip from the energy available on the main bus, without wasting energy. Most exciting is the simplification of the emergency power supply for the main traction inverter, which may be called upon at a moment’s notice to operate from any voltage between 30V and 1000V. InnoSwitch3-AQ ICs use a FluxLink™ feedback link, providing reinforced isolation up to 5000 VRMS for secondary-side control. FluxLink technology enables direct sensing of the output voltage, providing benefits such as accurate regulation and extremely fast transient response. The circuit will start from 30V without external circuitry – critical for functional safety. Additional protection features include input under-voltage, output over-voltage and over-current limiting. The inclusion of synchronous rectification and a quasi-resonant / CCM flyback controller achieves greater than 90% efficiency. Parts consume less than 15 mW at no-load - ideal for reducing self-discharge in battery management systems. InnoSwitch3-AQ 1700V parts are also suitable for markets such as renewables, industrial motor drives, battery storage and metering, where the integrated solution replaces discrete controller-plus-MOSFET designs, saving space, time and cost while increasing reliability.

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Power Integrations

SCALE™ EV family of gate-driver boards for IGBT modules

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SCALE EV family gate-driver boards are dual-channel plug-and-play drivers for both silicon carbide MOSFETs and silicon IGBTs. The driver targets high-power automotive and traction inverters for EV, hybrid and fuel-cell vehicles including buses and trucks as well as construction, mining and agricultural equipment. SCALE EV board-level gate drivers incorporate two reinforced gate-drive channels, associated power supplies and monitoring telemetry. The new boards are automotive-qualified and ASIL B certified, enabling implementation of ASIL C traction inverter designs. The first family member is designed for the EconoDUAL 900 A 1200-volt IGBT half-bridge module. By offering a product where the development, testing and qualification plus ASIL certification have already been done, Power Integrations is dramatically reducing development time and cost. The high level of integration provided by SCALE EV driver ICs enables the entire driver board, including gate power, to fit onto the outline of the power module, while still providing the spacing necessary for reinforced isolation according to the IEC 60664 standard. The ASIC package provides 11.4 mm of creepage and clearance, specifically designed to meet the requirements for 800V vehicle system voltages. Input and output lines to the system microcontroller are connected via two independent on-board connectors to meet functional safety requirements. The SCALE EV gate-driver family is rated at 1200 V for 400V and 800V systems and supports both SiC MOSFETs and silicon IGBTs. The design carries a 5500 meter altitude rating and is optionally available with conformal coating for technical cleanliness requirements. The design includes a wide range of protection provisions, including active short-circuit, active discharge of connected DC-link capacitor, overvoltage limitation via active gate control, diagnostic function such as gate monitoring, signal transmission monitoring and on-chip temperature monitoring, and short-circuit and over-current response of less than one microsecond for SiC MOSFETs and less than 3µs for IGBTs. SCALE EV系列门驱动板是适用于碳化硅(SiC) MOSFET和硅IGBT的双通道即插即用型驱动器。这些驱动器适合于电动汽车、混合动力和燃料电池汽车（包括巴士和卡车）以及建筑、采矿和农用设备的大功率汽车和牵引逆变器。 SCALE EV板级门极驱动器内部集成了两个增强型门极驱动通道、相关供电电源和监控遥测电路。新驱动板已通过汽车级认证和ASIL B认证，可实现ASIL C牵引逆变器设计。第一个发布的SCALE EV系列成员专为EconoDUAL 900A 1200V IGBT半桥模块而设计。 Power Integrations推出的这款新产品已完成开发、测试和验证以及ASIL认证，将大幅缩减系统开发时间和成本。 SCALE EV驱动器IC具有非常高的集成度，可使整个驱动板（包括门极电源）的尺寸大小完全适合于功率模块，同时仍能提供符合IEC 60664标准的加强绝缘所需的间距。ASIC封装可提供11.4mm的爬电距离和电气间隙，安全满足800V汽车系统电压的要求。系统微控制器的输入和输出线路通过两个独立的板载连接器连接，以满足功能安全要求。 SCALE EV门极驱动器产品系列具有1200V的额定耐压，适用于400V和800V系统，同时支持SiC MOSFET和硅基IGBT开关。其设计符合5500米海拔要求，并且提供三防漆服务选项以满足技术上的洁净度要求。新产品在设计上优势明显，具备完善的保护措施，集成了主动短路、对所连接直流母线电容的主动放电、通过主动门极控制实现过压限制，以及门极监测、信号传输监测和芯片内温度监测等诊断功能，对于SiC MOSFET开关的短路和过流响应时间小于1µs，而IGBT开关的短路和过流响应时间小于3µs。

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Infineon Technologies China Co., Ltd

OptiMOS™ 5 power MOSFETs 80V and 100V in TOLT package

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Key features/Key benefits/Key applications • Low RDS(on) • High current rating >300A • Top-side cooling • Negative stand-off • Sn-free exposed pad • Increased system efficiency enabling extended battery life time • High power density • Superior thermal performance • Saving in cooling system • Minimized thermal resistance to heatsink • E-scooter • Light electric vehicles • Power tools • Battery management system

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Chipone Technology （Beijing）Co., Ltd.

OLED on Silicon display driver chip

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This product uses monocrystalline Silicon as the driving backplane IC, and then directly vapor-deposits OLED on the IC to produce an active organic light-emitting diode display. It has many advantages such as high resolution, high integration, low power consumption, small size, light weight, and wide temperature range. A very high-density display can be produced; coupled with the need to have the same integrated functions as a small-size driver IC, its chip area is the largest among all types of display driver ICs. With the increasing demand for silicon-based OLED display panels such as AR glasses, VR helmets, infrared detectors, and 3D medical equipment, the market prospects for silicon-based OLEDs are widely optimistic. International consulting firm IDC predicts that the market size is expected to reach 12 billion yuan in 2021. The sudden outbreak of the new crown epidemic in 2020 has unexpectedly boosted AR and VR-related industries. Major system manufacturers have launched AR/VR-related plans and products, and application content has continued to introduce new ones. Compared with the traditional LCoS (Liquid Crystal on Silicon), this OLED on Silicon has the advantages of high contrast, high dynamic range, wide application temperature and low latency.

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Wayon Electronics Co.,Ltd.

WMZ53N60F2

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WMZ53N60F2,which features 600V Withstanding voltage, 65mΩ on-state resistance Rdson and 160ns reverse recovery time trr, improves the efficiency across the entire load range by balancing several key parameters. Particularly suitable for applications in server power supplies such as 1 to 2KW data centres. Responding to the requirements of high silicon content in downstream applications for volume and functionality, etc, WMZ53N60F2 offers higher power, smaller size, lower losses, a better price/performance ratio and better delivery than ST, Infineon and other brands. In terms of localization, the market for high-end products such as data centres has not yet been fully developed. WMZ53N60F2 has achieved greater growth and a rapid jump in market volume by virtue of its geographical advantages, excellent product performance and cost.

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PANJIT International Inc

PANJIT SGT MV MOSFET Gen.2

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PANJIT MV MOSFET Gen.2 adopted Shielding Gate Trench (SGT) structure which has Switching performance over Standard Trench & Planar structure while maintaining stable Electrical Field. 強茂第二代SGT MV MOSFET與一般標準溝槽/平面型結構比較有著優越開關特性及穩定電場性能。 Another key feature of PANJIT MV MOSFET Gen.2 is optimized FOM (Rdson * Qg & Rdson * Qoss) . So, it would reduce switching loss and conduction loss while getting excellent efficiency performance and easy to reach save energy goal. 另一個特色為極低FOM，透過降低開關及導通損耗提供極佳效率表現達到節能的目標。 PANJIT has released MV MOSFET Gen.2 by 100V/ 4.4 mΩ~5 mΩ, and other products will be released in 2022. (Total 45 devices) SGT MV MOSFET Gen2已經公布新產品為100V/4.4 mΩ~5 mΩ,下半年共有45個產品陸續發表 100V: Rdson: 1.5mΩ to 44mΩ by Different packages (DFN5060/3333 / TO packages) 80V: Rdson: 1.2mΩ to 11mΩ by Different packages (DFN5060/3333 / TO packages) 60V: Rdson: 0.8mΩ to 10mΩ by Different packages (DFN5060/3333 / TO packages) PANJIT MV MOSFET Gen.2 are recommended for high efficiency power conversion system such as Server Power, Telecom Power(Brick Power) , Automotive applications (such as 48V DC/DC converter/ BCM/ Lighting) &Gaming PC Power. Below is the system level efficiency test result compared with Tier one competitor. SGT MV MOSFET Gen2主要應用於高效能電源轉換系統如伺服器電源、通訊電源(磚形電源)、車用電子(48V直流電源轉換/高電壓匯流排轉換器/車燈)及遊戲機電源。如下為與競業效率比較資訊 System: 48Vin to 14Vo, 15A (210W) DC/DC converter Target Device: PANJIT PSMQC038N10LS2 (100V / 3.8mΩ) Competitor O-xxxxx3D6N10MCL (100V / 3.6mΩ) Efficiency: PANJIT PSMQC038N10LS2 showed 0.5% higher efficiency at 210W Thermal: PANJIT PSMQC038N10LS2 showed 10℃ lower than competitor at 210W 系統: Vin 48V to Vout 14V, 15A (210W) DC/DC converter 比較元器件: PANJIT PSMQC038N10LS2(100V/ 3.8 mΩ) 競業O-xxxx3D6N10MCL(100V/3.6 mΩ) 效率: PANJIT PSMQC038N10LS2在210W效率比競業高0.5% 熱傳導: PANJIT PSMQC038N10LS2在210W比競業低10℃

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PANJIT International Inc

PANJIT SiC SBD (Schottky Barrier Diode)

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PANJIT SiC SBD adopted Merged PN Schottky (MPS) structure which has better surge current capability over JBS structure while maintaining lower leakage current at high temperature operation. 強茂碳化硅二極管使用MPS設計結構對比JBS擁有更好浪湧能力並且在高溫狀態下維持低漏電流性能。 Another key feature of PANJIT SiC SBD is optimized temperature coefficient of Vf parameter. So, it would have compressed conduction losses under high temperature operating condition of a system, which is beneficial to achieve higher efficiency. 另外一個優越的性能是順向壓降在溫度係數的呈現，高溫系統操作下，低順向導通損耗達到更高效率的轉換。 PANJIT has released SiC Diode Gen.1 line-up as below. (Total 45 devices) 650V: 4A ~ 40A in TO-220AC, TO-263, TO-252, TO-247 packages 1200V: 5A ~ 40A in TO-220AC, TO-263, TO-252, TO-247 packages 強茂第一代碳化硅二極管系列產品共有45個如下 650V: 4A ~ 40A in TO-220AC, TO-263, TO-252, TO-247 封裝 1200V: 5A ~ 40A in TO-220AC, TO-263, TO-252, TO-247 封裝 PANJIT SiC SBDs are recommended for high efficiency power conversion system such as Server Power, Gaming PC Power, PV Inverter, ESS and Home Appliances. Below is PANJIT SiC SBD system level efficiency test result compared with PANJIT FRED. 強茂碳化硅二極管主要應用於高效率能源轉換系統如伺服器電源、遊戲機電源、光伏逆變器、能源儲存系統及家用電源等。如下是強茂碳化硅二極管與FRED續流二極管性能比較結果 TEST #1 System: 800W CCM Boost PFC Target Device: SiC SBD PCDP1065G1 (650V / 10A) FRED PSDP3060S1 (600V / 30A) Efficiency: PCDP1065G1 showed 0.6% higher peak efficiency at 500W 測試一系統: 800W CCM Boost PFC 選用元器件: 碳化硅二極管 PCDP1065G1(650V/10A) 續流二極管 PSDP3060S1(650V/10A) 效率: PCDP1065G1在500W時高於0.6%峰值效率 TEST #2 System: 1200W Vienna PFC Target Device: SiC SBD PCDP10120G1 (1200V / 10A) FRED PSDP30120S1 (1200V / 30A) Efficiency: PCDP10120G1 showed 0.8% higher peak efficiency at 800W 測試二系統: 1200W Vienna PFC 選用元器件: 碳化硅二極管 PCDP10120G1(1200V/10A) 續流二極管 PSDP30120S1(1200V/30A) 效率: PCDP10120G1在800W時高於0.8%峰值效率

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NIKO Semiconductor CO.,LTD

NIKOSEM SMRT Pack SiC Power Module

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Niko Semiconductor utilizes the new generation process of SiC chip for SMRT Pack power module. It has not only low conduction resistance, brilliant high operation frequency, high operation temperature, but also high breakdown voltage characteristics. Because of these characteristics, using SiC power modules would have better temperature control and power transfer efficiency. Low conduction resistance of SiC power modules effectively declines the power loss from the system, which could decrease the generation of CO2 by design of eco-friendly products and systems. There are lots of advantage by utilizing power modules. Power modules can effectively decrease the parasitic inductance induced by copper wire on printed circuit board (PCB) which can be lowering the switching loss and improve the circuit oscillation phenomenon and enhance the system reliability. When system designers need more electric power, the first solution hitting them would be using more MOSFETs in parallel to reduce the conduction resistance. However, utilizing more MOSFETs in parallel in general PCB might lead to the current density unbalance issue, which would shorten the life time of the MOSFETs. The worst case would be directly burn down. Therefore, NIKOSEM’s design, SMRT Pack, SiC power modules take all the pervious issues into consideration and make the improvement, and also using smaller package size to achieve higher power density. Power modules can operate with cooling fins to effectively dissipate the heat in practical cases. If more electric power is needed, we can upgrade the cooling systems to gain more electric power. It is a very flexible design. When the power module is in design stage, accurate arranging the heat dissipation route is a must, so the system power loss can be controlled better than the conventional way which could make the operation power higher.

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Wolfspeed

C3M0060065L

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Wolfspeed’s 650 V Silicon Carbide MOSFET is optimized for high-performance power electronics applications, including enterprise, server and telecom power supplies, energy storage systems, electric vehicle charging systems, battery management systems, solar power inverters and motor drives. Wolfspeed® Silicon Carbide MOSFETs have a much lower on-state resistance temperature dependence than silicon MOSFETs, resulting in superior switching speeds and low conduction loss, which is critical to achieve high efficiency at high power for next generation power supplies. For the new 650 V SiC MOSFET C3M0060065L, it has passed industrial qualification with 60 mΩ RDS(ON) and 36 A current rating. The new MOSFET come in a TOLL package, will has 25% smaller footprint as compared to standard TO-263-7L Package. A larger back metal tab translates into lower device temperature and further reducing system level cooling requirements. As meanwhile, low lead inductance will bring lower switching losses – on top of the system efficiency advantages you can expect when transitioning your system to Silicon Carbide. The compact footprint, lower losses and high power dissipation capability of TOLL package enable high-power density designs.

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2Pai Semiconductor Co.,Limited

Single Channel Isolated Gate Driver Pai8211A(Q)

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Single Channel Isolated Gate Driver Pai8211x(Q) There is a series of single channel isolated gate drivers developed by 2Pai Semi, including the separation output type Pai8211A, Miller clamp protection type Pai8211C and negative output power supply type Pai8211D, etc. They have the performance advantages of low transmission delay (51ns), strong driving capacity (6A-6A), high CMTI resistance (150kV/ us) and so on. And three levels undervoltage power supply protection including 8V, 12V, 13V are provided with two kinds of package NB SOIC-8, WB SOIC-8. Thus, it is very convenient for customers to choose and use. It is mainly used for motor power device driving, such as electric vehicle PTC heater applications. The competitive advantages include high CMTI, high driving current capacity.

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2Pai Semiconductor Co.,Limited

Dual Channel Isolated Gate Driver Pai8233C(Q)

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Dual Channel Isolated Gate Driver Pai8233x(Q) 2Pai Semi dual channel isolated gate driver Pai8233x(Q) has the characteristics of adjustable dead zone (0~ 5US), short signal transmission delay (19ns), low pulse width distortion (1ns), good channel matching (1ns), strong driving capacity (4A/8A), high resistance to CMTI (200kV/us), etc., which can meet various application requirements of customers. They are available in three package options: WB SOIC-14, SOIC-16, and LGA13, with high integration and low transmission delay, contributing to the design of efficient, reliable, and power-intensive systems. The dual channel isolated gate driver Pai8233x(Q) is mainly used in power solutions, such as the on-board Charger for electric vehicles.

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Microchip Technology Inc.

3.3 kV silicon carbide (SiC) MOSFETs

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Microchip’s 3.3 kV SiC power devices are the industry’s lowest on-resistance [RDS(on)] 3.3 kV SiC MOSFETs and highest current-rated SiC SBDs available in the market, enabling designers to eliminate design compromises, reduce design complexity and lower system costs while increasing efficiency, reliability and performance of their systems. With these products, designers are equipped with the tools to develop smaller, lighter and more efficient solutions for electrified transportation, medical, renewable energy, pulsed-power, aerospace and industrial applications. Many silicon-based designs have reached their limits in efficiency improvements, system cost reduction and application innovation. While high-voltage SiC provides a proven alternative to achieve these results, until now, the availability of 3.3 kV SiC power devices was limited. Microchip’s 3.3 kV MOSFETs and SBDs join the company’s comprehensive portfolio of SiC solutions that include 700V, 1200V and 1700V die, discretes, modules and digital gate drivers. Microchip’s 3.3 kV SiC power devices include MOSFETs with the industry’s lowest RDS(on) of 25 mOhm and SBDs with the industry’s highest current rating of 90 amps. Both MOSFETs and SBDs are available in die or package form. These new levels of performance enable designers to simplify their designs and rapidly create higher-power systems that use fewer components for smaller, lighter and more efficient power solutions with higher reliability. The new family of 3.3 kV SiC power products allows customers to move to high-voltage SiC with ease, speed and confidence and benefit from the many advantages of this exciting technology over silicon-based designs.

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Shenzhen Longsys Electronics Co.,Ltd.

FORESEE Automotive eMMC (Grade 2)

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1. Automotive eMMC is strictly verified for reliability in accordance with AEC-Q100 due to its continuous supply of materials and stable quality based on strictly-screened NAND flash resources. 2. Its complete manufacturing control system based on self-designed firmware ensures test coverage and integrity. 3. Based on independently developed and designed software and hardware, it can be customized to match hardware solutions and software systems according to the needs of clients, meeting automotive applications under different scenarios and different environmental requirements. 4. Its high reliability and long service life ensures that the device can operate around the clock for extended periods, with a mean time between failures (MTBF) of over 20 million hours. 5. It not only has good read/write performance and reliability, but also helps to reduce platform development difficulties. 6. It works around the clock for extended periods in harsh environments such as those with fluctuations between high and low temperatures, static electricity, and electromagnetic interference. 7. It complies with JEDEC standards and is RoHS-certified. 8. It comes in sizes of 4GB, 8GB, 16GB, 32GB and 64GB, meeting the different requirements of customers. 9. Software/hardware customization, full pre-sales/after-sales services, and customized verification testing services.

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GigaDevice Semiconductor Inc.

GigaDevice 24nm 1Gb SPI NAND Flash GD5F1GM7 Series

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GD5F1GM7 series is 1Gb SPI NAND Flash. As an innovative product, it allows designers to take advantage of advanced 24nm NAND flash SLC technology. This series features high reliability with 10-year data retention and 50,000 program/erase cycles. What’s more, as advanced NAND function, GD5F1GM7 has an internal 8bit ECC algorithm to improve reliability and extend product lifespan. Available in 1.8V/3.3V, with clock frequency up to 133MHZ/104MHZ, GD5F1GM7 series also supports the industry's smallest package options – WSON8 6x5 – in similar products, committed to providing high-density, cost-effective solution for IoT, network, security and consumer application scenarios that include wearable devices.  24nm SPI NAND Flash, industrial leading technology  3.3V/1.8V 1Gb  10-year data retention and 50,000 program/erase cycles  Internal 8bit ECC  Industrial temperature range of -40℃~85℃  WSON8 6x5mm / WSON8 8x6mm

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GigaDevice Semiconductor Inc.

GigaDevice High Performance SPI NOR Flash GD25LF Series

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GD25LF is the first ultra high speed Quad SPI NOR Flash in mid density, with single and double transfer rate (STR/DTR) up to 166MHz and 104MHz respectively, data throughput up to 104MB/s. It is the industry’s highest performance NOR flash solution in medium density. GD25LF has benchmarked power consumption of 7mA, at read rates of 166 MHz Quad mode, which is the lowest power performance that can be achieved in the industry. GD25LF series support the smallest chip size solution WLCSP, which provides a more comprehensive solution for the needs of high performance, low consumption and small package. It is mainly aimed at applications that require fast R/W rate, quick response, low consumption and small package, such as AI, IoT wearable industries.  1.8V 8Mb~256Mb  Quad DTR SPI interface, compatible with Single, Dual and Quad SPI command set  The highest performance Quad SPI NOR Flash in mid density, with data throughput up to 104MB/s  Support XIP (Execute-In-Place)  The lowest power consumption while the highest performance  KGD, WLCSP, USON8, WSON8, SOP8 packages

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YEESTOR Microelectronics Co., Ltd.

Automotive-grade eMMC SGM8005x series

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Dosilicon Co., Ltd

SPI NAND Flash -- DS35X4GM-IB

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DS35X4GM-IB is the 4GB SPI NAND Flash launched by Dosilicon in 2021. It fully owns independent intellectual property rights. It is the first 2xnm SPI NAND flash product in China. Its leading process and large capacity fill the market gap, making it a new flagship product of the company. It has attracted wide attention since its launch. This product can not only be used in traditional network communication, consumer electronics and other fields, but also suitable for high-definition video monitoring, 5G base station and server markets with certain capacity requirements. The 4Gb SPI NAND flash is a serial peripheral interface SLC NAND Flash which the memory array and controller are integrated on one cell, with an internal ECC module. It not only offers satisfactory data transmission efficiency, but also saves space , simplifies customer design and enhances stability. Now it is suitable for two voltages(3.3V/1.8V). Although it needs to be distinguished in the later stage of production, it greatly improves the reusability of the design link, shortens the R & D cycle of the same series of products, and greatly reduces the cost. In addition to providing 1.8v/3.3v voltage, it also has SPI/D-SPI/Q-SPI transmission mode compatible with international companies' products, as well as traditional WSON8x6 and BGA24 packaging methods, making it fully adaptable to domestic alternative projects.

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Western Digital

Ultrastar DC HC570 & Ultrastar DC HC670

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KOWIN TECHNOLOGY CO.,LTD

Small PKG eMMC KASM31S1

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I the main characteristics 1.Compatible with JEDEC eMMC5.1 specification and support HS400 high-speed mode 2.9x7.5mm small size and 153 Ball package, reduce the space occupied by PCB board, suitable for smart wearable products with limited space 3. Low power consumption, facilitate the design and application of terminal products with long standby II the specification Memory: 4 GB/ 8 GB Package Category: 153FBGA Size: 9.0 x 7.5 x 0.8mm III Application field Smart wearable, small consumer electronics and other terminal equipment IV the major advantages 1.Sufficient funds State-owned enterprise background, Konka Group holding 2.Own OSAT Yancheng Konka Semiconductor sealing packaging test industrial Park 3.Stable Supply The company has rich and deep supply chain resources, and the formation of strategic cooperation with domestic and foreign industrial factories Stable storage resources and high quality packaging test capability 4.Brand value Konka Group 42 years of electronic industry foundation 5.Talent team Several experts with more than 20 years of storage industry experience 6.Technology mastery Development and quality management Closed test and autonomous control solutions

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Micron Technology

7450 SSD with NVMe (176-layer NAND data center SSD)

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Data centers and cloud environments have an insatiable need for fast, consistent data. Whether running real-time analytics, processing online transactions or streaming media, the infrastructure must be high-performing, responsive and flexible. The Micron 7450 SSD with NVMe addresses these challenges. It is the world's most advanced 176-layer NAND data center SSD. It uses replacement-gate technology, which provides greater power efficiency and places the CMOS under the array, saving critical layout space. Delivering 1M IOPS for random reads, the 7450 brings new performance and flexibility to data centers with a broad array of form factors and enhanced security features. The Micron 7450 SSD delivers a significant reduction in read/write latency: it crosses the sub-2ms latency barrier for 99.9999% quality of service (QoS) of random read and write workloads. This is a necessity in enabling responsiveness in a range of database-driven services that underlay everything from AI to streaming media. Designed specifically for the data center and cloud, it offers a wide variety of form factors ranging from 400GB to 15.36TB capacities. The Micron 7450 SSD enables flexible cloud and data center designs to support a wide variety of workloads. These include applications where latency is a major concern to system designers. • Real-Time Analytics and AI: These workloads require a lot of data to generate insights; however, delivering more data to complex algorithms remains a challenge. Whether on-prem or in the cloud, the ability to optimize resources by reducing latency means faster time-to-insight, but there is greater efficiency in the use of infrastructure. • Content Streaming: Latency, buffering delays and lost frames can all contribute to a poor live user experience. Those challenges may start to alter consumers’ choices in streaming providers. Latency and delay have real consequences for media companies. • Cloud Environments: In virtualized and containerized cloud environments, the ability to dynamically share resources is key. For cloud service providers, the faster they can reuse resources, the better they can monetize their infrastructure.

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Micron Technology

Micron Technology LPDDR5X mobile memory

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The market delivery and validation of Micron’s industry-leading 1α-based LPDDR5X solidifies its product innovation and leadership in the mobile ecosystem, following industry-first launches for LPDDR5, 1α-based LPDDR4X, 176-layer NAND-based UFS 3.1 and uMCP5 solutions. This most recent milestone follows quickly on the heels of JEDEC’s July release of the LPDDR5X extension to LPDDR5, created to offer higher bandwidth and memory speed for enhanced 5G communication and performance while still conserving power. Micron has validated samples supporting data rates up to 7.5 Gb/s, with samples supporting data rates up to 8.533 Gb/s to follow. Peak LPDDR5X speeds of 8.533 Gb/s deliver up to 33% faster performance1 than previous-generation LPDDR5.

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Beijing Zettastone Technology Co., Ltd.

IP100X PCIe/NVMe SSD series

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Silicon Motion, Inc.

Ferri-UFS 3.1

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"Ferri-UFS expand its product portfolio with SM672 UFS 3.1 solution. With a high-speed serial-link-based MIPI M-PHY HS-Gear4 x 2-lane, the SM672 enables high performance, high capacity and lower power embedded storage to meet the most stringent quality and reliability demands from industrial and automotive applications. The new features of UFS 3.1 include: 1. Write Booster：Designed to increase write speeds by using a pseudo-SLC cache. 2. Deep Sleep：The UFS 3.1 will consume lesser power thanks to voltage regulators that are used for both storage and other functions. 3. Performance Throttling Notification：Enable the UFS device to inform the host about performance throttling. The new automobiles are increasingly incorporating advanced driver assistance and infotainment features that require highly reliable, high speed storage solutions. Ferri-UFS is ideally suited to enable high-performance, high reliability storage and better power efficiency embedded storage for Automotive. Ferri-UFS undergo rigorous testing to meet the qualifications that the industry and our customers demand, including AEC-Q100 compliance, ISO 26262, supplier chain certification by IATF 16949 certification, and ASPICE compliance SW development process. In addition, Silicon Motion provides product supply longevity to reduce costs for additional qualifications. "

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BIWIN STORAGE TECHNOLOGY CO., LTD.

BIWIN SS321 2.5" SATA SSD

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BIWIN Server System SSD adopts SATA 6Gbps interface and homemade 128-layer 3D NAND flash memory and external DDR4 DRAM, bringing out its high read/write performance, great reliability, security and low power consumption. It is available in 240GB, 480GB and 960GB capacities, providing fast, efficient and professional localized services. The product meet the business needs to build powerful cloud computing centers, server systems, network security devices, etc. Tailored to server system SSD applications, BIWIN’s product has undergone rigorous tests for high reliability and stability, bringing out superb random read and write performance that meets the operating requirements.

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Infineon Technologies China Co., Ltd

256Mbit x16 HYPERRAM™ 3.0

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As computing capability moves towards the edge, many devices now require additional external memory to run machine learning algorithms on the edge to preprocess and synthesize information. These require memory solutions that are optimized for size as well as power without sacrificing on throughput. Traditional DRAM and PSRAM solutions are based on high pin count interfaces to achieve high data throughputs. HYPERRAM 3.0 is Infineon’s 3rd generation of HYPERRAM™ products that based on the efficient HYPERBUS™ interface. HYPERRAM™ products are low-pin count PSRAM memories offering high-bandwidth while optimized for power consumption. HYPERRAM™ 3.0 devices are offered in 256Mb and can achieve a throughput of 800MBps. They are available as a 8mmx 8mm BGA-49 package. HYPERRAM™ 3.0 is built for systems requiring expansion RAM memory for data/image buffering as well as applications requiring scratch-pad memory for intense mathematical calculations. These products are targeted for Industrial Automation, AIoT devices and Automotive V2X applications. By utilizing a 16-bit data interface running at DDR (double data rate) speed, HYPERRAM 3.0 manages to achieve a far higher throughput-per-pin than existing technologies in the market such as PSRAMs and SDR DRAMs.

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SHENZHEN SHICHUANGYI ELECTRONICS CO.,LTD

SCY eMMC E256CSAG4ABE00

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1. Following JEDEC eMMC 5.0/5.1 standard, with MMC interface, the flash memory and main controller are integrated in a small BGA package. 2. With fast and scalable performance, and can significantly reduce the storage management load on the host processor; The interface voltage can be 1.8V or 3.3V. 3. The products are suitable for embedded storage products and storage solutions for Internet of Things applications, which are widely used in various fields such as set-top boxes, smart TVS，mobile phones, tablets, wearable devices, video surveillance, on-board equipment and industrial control equipment. 4. Provide cost-effective storage solutions with high reliability; Optimize system design to effectively shorten the time to market.

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Western Digital

OptiNAND

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Eyang Technology Development Co., Ltd.

MLCC 008004series

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Vishay Intertechnology, Inc

SMDY1 Series Surface-Mount Ceramic Disc Capacitors for EMI Suppression

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For EMI / RFI filtering in power supplies, solar inverters, smart meters, and LED drivers, Vishay’s SMDY1 series surface-mount ceramic disc capacitors are the industry’s first such devices to offer a Y1 rating of 500 VAC and 1500 VDC. Other surface-mount capacitors for EMI suppression only provide Y1 ratings to 300 VAC, with no DC rating. In addition, the SMDY1 series offers industry-high capacitance to 4.7 nF — the closest competing devices only provide capacitance up to 1.5 nF — and higher humidity robustness with a Class IIB humidity grade (in accordance with IEC60384-14 annex I) and a moisture sensitivity level of 2a.

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Bourns Inc.

Bourns® IsoMOV™ Series Hybrid Protection Component

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Bourns is pleased to announce its groundbreaking lineup of IsoMOV™ hybrid protection components. By combining the best features of the breakthrough surge performance EdgMOV™ technology with an integrated Gas Discharge Tube (GDT) isolation structure, the IsoMOV™ protector offers high reliability and long life including in certain harsh environments. The IsoMOV™ protector fully integrates the classic GDT and MOV in a symbiotic relationship, enhancing reliability and performance. In this configuration, the GDT blocks leakage currents through the MOV that would otherwise lead to premature failure of the MOV device, while the MOV prevents the follow-on current (after a surge) that might damage the GDT. The IsoMOV™ hybrid protector provides robust protection for operational circuits rated to 125 °C making it a good overvoltage protector for a wide variety of AC power, DC power, and other electronic circuits. Adding to its rugged performance, the IsoMOV™ surge protector has zero standby energy consumption and lower capacitance than MOVs. Bourns® IsoMOV™ components offer exceptional protection against common system threats including transients due to environmental factors. Bourns is committed to continued technology advancements that address circuit protection needs in a range of applications. Serving diverse markets, Bourns has demonstrated its leadership in defining future circuit protection solutions with proven excellence in design backed by superior customer service. FEATURES : • AC voltage ratings: 175 V - 555 V • Nominal surge ratings: 3 kA – 5 kA – 8 kA • -40 °C to +125 °C operation • Low leakage current • Low capacitance • Stable performance over life • UL 1449 Type 4 CA listed • RoHS compliant* BENEFITS : Enhanced reliability • Long service life • Improved surge ratings • Suitable for exposed circuits • Increased voltage protection • Ring wave tolerant • Reduced down time/service costs FEATURES B

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Molex LLC.

NearStack PCIe Connector System and Cable Jumper Assemblies

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NearStack PCIe Connector System and Cable Jumper Assemblies create a direct connection from anywhere in the system to near the ASIC, using twinax cables to deliver a PCB alternative while improving signal integrity, lowering insertion loss and reducing signal latency. Being optimized for height they come with a low profile mated height of 11.10mm (R/A cable) to reduce airflow interference and allow for placement in tighter spaces within the system alternative. The unique contact interface with flexing beams on the NearStack cable receptacle affords no chance for preloaded beam relaxation through reflow on the PCB side. NearStack PCIe is capable of PCIe Gen-5 32-Gbps performance supporting PCIe Gen-5 requirements, with regards to both signal speed (32 Gbps NRZ) and number of pins for a x8 channel. Built with direct-to-contact twinax termination it eliminates the PCB paddle card from the cable assembly, improving manufacturing efficiencies, repeatability, and signal integrity. NearStack PCIe is officially included in the OCP “DC-MHS” and “M-XIO” specifications and will be the recommended technology moving forward for the internal High Speed IO. Available in right-angle, angle-exit, and vertical cable assemblies NearStack PCIe provides design flexibility with more options for cable routing.

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C&B ELECTRONICS (SHENZHEN) CO., LTD.

Trimming Free precision metal alloy current sensor

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Metal alloy current sensor developed and produced by C&B RESI adopt the technology of trimming free, to achieve ultra-low resistance while having the characteristics of high precision and low TCR. This type of current sensor is suitable for all application scenarios requiring precise current sensing, such as new energy vehicles, power tools, instrumentation, semiconductor ATE, precision power supplies, medical equipment, etc. In 2021, C&B RESI mainly launched two types of resistors, one is molded version PCSR series, another is without molded version, such as SEWF, EBWK, EBWM,PEWK,PEWM, etc. PCSR series values range is from 10mohm to 100mohm, can achieve 0.1% accuracy and less than 15ppm. Two sizes available: 2512 and 3637. Compared with overseas competitive products with the same specifications, the price of this series is far lower, and the delivery time can be shortened by 2/3. At the same time, the series has been exported to many overseas countries, highly recognized by overseas customers.

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TDK (SHANGHAI) INVESTMENT LTD.

ThermoFuse® Varistor

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The new ThermoFuse varistors are specially developed quadratic disk varistors, which are connected in series with a patented thermal protective component design. In the case of a persistent overvoltage and therefore heating of the varistor, the fuse is activated and separates the varistor from the circuit with a high level of reliability, preventing potential damage to the PCB or the components installed in the varistor’s vicinity. What’s more, disconnection from the mains protects against a thermal runaway.Thanks to their high thermal resistance and use of flame retardant materials for the housing, the ThermoFuse MT25 and MT30 series varistors meet the requirements of flammability rating UL 94 V-0. They are listed in the UL 1449 standard 4th Edition. These varistors’ main applications include photovoltaic inverters, powerful industrial power supplies and inverters, as well as power supplies for lighting systems and telecommunications systems.

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TAITIEN ELECTRONICS CO.,LTD

Ultra-High Precision Disciplined Crystal Oscillator DT-5151

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Today’s communication systems require more precise network synchronization and holdover performance. With the transition to 5G and beyond, packet-based networks makes sync technology more challenging as they do not naturally deliver synchronization. Similarly, with the development of today’s smart power grid, network synchronization precision is playing an ever-increasing important role calling for ultra-high precision timing synchronization and holdover capability. The network’s ability to maintain time or holdover is critical so selecting a well thought out strategy is the first step. Taitien’s brand new ultra-high precision DT-5151 Disciplined Crystal Oscillator will be an ideal solution. By combining the best of class precision oscillators with a proprietary adaptive algorithm, Taitien’s DT-5151 series achieve the standard of atomic-based oscillator performance. This series is engineered to control its internal phase error to within 1 ns (RMS) through disciplining to an external one pulse per second (1PPS) signal broadcast by GPS.It offers an excellent frequency output with an accuracy reaching < ±10-12 and its holdover ability reaching < ±1.5 us within 24 hours. Key Features： • 24 hours Holdover < ±1.5 us, ±10˚C temperature change • 1 pps input and 1 pps output for 1 pps synchronization • 1 ns RMS in phase and < 10-12 in frequency • 1 second continuous phase measurement and report system with high resolution ≦ 1ns • Time of Day (ToD) • RS232 digital interface • 5 MHz / 10 MHz / HCMOS outputs • Operating temperature from -20˚C to 70˚C • Proprietary adaptive algorithm • 51 x 51 x 24 mm Applications： • Radar • Broadcast • IoT Master clock • Smart power grid • Clock reference • High precise sever • Telecommunication base stations • Test and measurement equipment

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Primarius Technologies Co., Ltd.

NanoDesigner- Full Custom Design Platform

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NanoDesigner is a highly flexible and extendable design environment that supports full custom memory, analog and mixed-signal designs. Integrated with industry's leading circuit simulation products, it covers the entire spectrum of circuit simulation capabilities, from high-performance parallel SPICE to a unique Adaptive Dual-Simulation Engine that delivers accurate results much faster. It have high Integrated circuit analysis environment, easy GUI operations and various commands for the experienced user, powerful automatic connection, intelligent analysis and learning, Schematic & layout design, circuit simulation and analysis, physical verification and design automation in one platform. fully compatible with Open Access database, EDIF file, GDS file, Netlist file, etc.

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Codasip GmbH

Codasip L31 customizable RISC-V processor core

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Codasip’s L31 customizable RISC-V processor core is a small, efficient 32-bit embedded RISC-V processor core aimed at embedded systems with more modest processing requirements. The core includes optional L1 data and instruction caches, optional instruction, and data TCM, optional 8 or 16 PMP regions, an interrupt controller and RISC-V Debug module optionally with PC trace. It has a 3-stage pipeline and 32 general-purpose registers. Custom instructions can be created using Codasip Studio to extend the L31 and to generate corresponding hardware and software development kits, The L31 core also supports Tensor Flow Lite Micro for developing embedded AI applications such as neural networks. The L31 was announced in the beginning of 2022, is the latest in the company’s range of low-power embedded RISC-V processor cores optimized for customization. The cores enable customers to easily customize processor designs to support challenging tasks such as neural networks (AI/ML) even in the smallest, power-constrained applications – such as IoT edge. In June 2022, Codasip’s L31 core was awarded as “best product in show” during the Embedded World Germany 2022, chosen by Embedded Computing Design as a winner in the Processor & IP category, the award is based on Design Excellence, Relative Performance, and Market Impact/Disruption. etc.

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Arm Technology (China) Co., Ltd.

Arm China STAR-MC2

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S2C Limited’

Prodigy Logic Matrix

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Prodigy™ Logic Matrix is a high-density FPGA prototyping platform architected from the ground up to meet today's needs for both large design scale and operation performance. Optimized for space and connectivity, Logic Matrix is designed for multi-system expansion to support billions of ASIC gate capacity. This platform is ideal for addressing the ever-increasing complexity and performance requirements in large-scale SoC designs for applications such as 5G, data center, AI/ML, and autonomous driving. 1. Industry leading density and capacity-up to 3.136 billion ASIC gates in single standard server rack 2.Hierarchical connectivity to support ¬flexible topology and hyperscale design at prototyping performance 3.Highly modular design to simplify deployment, maintenance, and expansion in standard server racks 4.Multi-usages: early software development, full system prototyping, high performance regression

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Cadence Design Systems, Inc.

Cadence Integrity 3D-IC Platform

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In October 2021, Cadence introduced the Integrity 3D-IC platform, the industry’s first comprehensive, high-capacity 3D-IC platform that integrates 3D design planning, implementation and system analysis in a single, unified cockpit. The platform underpins Cadence’s third-generation 3D-IC solution, providing customers with system-driven power, performance and area (PPA) for individual chiplets through integrated thermal, power and static timing analysis capabilities. Chip designers creating hyperscale computing, consumer, 5G communications, mobile and automotive applications can achieve greater productivity with the Integrity 3D-IC platform versus a disjointed die-by-die implementation approach. The platform uniquely provides system planning, integrated electrothermal, static timing analysis (STA) and physical verification flows, enabling faster, high-quality 3D design closure. It incorporates 3D exploration flows, which take 2D design netlists to create multiple 3D stacking scenarios based on user input, automatically selecting the optimal, final 3D stacked configuration. The platform database supports all 3D design types, letting engineers create designs at multiple process nodes simultaneously and perform seamless co-design with package design teams and outsourced semiconductor assembly and test companies that use Cadence Allegro® packaging technologies. The platform offers the following features and benefits: • Common cockpit and database: Lets SoC and package design teams co-optimize the complete system concurrently, allowing system-level feedback to be incorporated efficiently. • Complete planning system: Incorporates a complete 3D-IC stack planning system for all types of 3D designs, enabling customers to manage and implement native 3D stacking. • Seamless implementation tool integration: Provides ease of use through direct script-based integration with the Cadence Innovus Implementation System for high-capacity digital designs. • Integrated system-level analysis capabilities: Enables robust 3D-IC design through early electrothermal and cross-die STA, which allows early system-level feedback for system-driven PPA. • Easy-to-use interface: Includes a powerful user cockpit with a flow manager that provides designers with a uniform, interactive way to run relevant system-level 3D system analysis flows.

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CEVA, Inc

PentaG2

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PentaG2 platforms offered in the following configurations:  PentaG2-Max – targeting eMBB use cases in handsets and CPE/FWA Terminals and mmWave, NR-Sidelink and cellular V2X (C-V2X), as well as URLLC enabled AR/VR use cases. PentaG2-Max is the world’s only complete IP offering able to efficiently process the immense workloads required for 3GPP releases 16 and 17, looking forward to 5G advanced, for both Sub-6 and mmWave 5G broadband, with a 4X performance/area improvement in data-path processing.  PentaG2-Lite – supports a range of reduced capacity use cases, including LTE Cat1 and future 3GPP Rel-17/18 NR RedCap (Reduced Capacity, aka NR-Lite). PentaG2-Lite is an extremely efficient and lean baseband implementation with complete processing chain acceleration and utilizing a small footprint DSP controller, to meet the most stringent power budgets. Both configurations offer the flexibility to allow customers combine their own proprietary algorithms and IP, such as channel estimation or advanced equalization with the PentaG2 platform via standard interfaces. The PentaG2 platform architecture builds on the success of the first-generation platform, which has shipped in millions of 5G NR smartphones and mobile broadband devices to date, includes a complete set of programmable accelerators and coprocessors, constituting end-to-end in-line signal processing chains. Accelerators introduced for the first time as part of the PentaG2 platform include:  Bit Demodulation Unit, supporting entire Rx bit and LLR processing  Bit Modulation Unit for entire Tx bit processing  Equalizer and MAC engine co-processor Unit  5G LDPC Encoder / Decoder, and  5G Polar Encoder / Decoder The platform also includes a scalar DSP for PHY control, hardware acceleration scheduling, and running the protocol stack. The PentaG2-Max also features a vector DSP with 5G ISA extensions for handling workloads required for channel estimation, provides a complete L1 SW functional implementation of all 5G processing chains, running on the control DSP and utilizing all the platform’s hardware accelerators, including PDSCH, PUSCH, PDCCH and PUCCH.

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Oracle

Oracle NetSuite

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Innosilicon Technology

UCIe Chiplet（Innolink™）

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Synopsys Inc.

Synopsys DesignDash

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Synopsys DesignDash is the industry’s first big-data-driven design-analytics solution. It is the latest step in a multi-year, multi-disciplinary development effort to address the need for exponential gains in design productivity in the face of massive growth in system complexity, shrinking market windows and an increasingly challenging designer resource landscape. The cloud-optimized Synopsys DesignDash design optimization solution greatly enhances design productivity by: • Providing extensive real-time design status through powerful visualizations and interactive dashboards. • Deploying deep analytics and machine learning to extract and reveal actionable understanding from vast volumes of structured and unstructured EDA metrics and tool-flow data. • Quickly classifying design trends, identifying design limitations, providing guided root-cause analysis and delivering flow consumable, prescriptive resolutions. With deeper design insights, designers can achieve more effective debug and optimization workflows, realize improved quality of results (QoR) and significantly extend overall design- and project-flow efficiency and effectiveness. This extensive insight and real-time visibility additionally deliver comprehensive resource monitoring and tracking that spans all design activities, enabling more data-driven management and risk mitigation throughout the design process. Synopsys DesignDash is natively integrated with the Synopsys Digital Design family of products for seamless data capture, resulting in insights that further accelerate the path towards design closure. The solution complements the Synopsys SiliconDash product, part of the Synopsys Silicon Lifecycle Management Family, forming a pre-silicon to post-silicon data continuum, maximizing opportunities for valuable data analysis across the complete design-to-silicon lifecycle.

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Imagination Technologies

IMG RTXM-2200 CPU IP

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IMG RTXM-2200 is the first core from the Catapult product line based on the RISC-V ISA and using Imagination’s home grown micro-architecture. It is a highly scalable mid-range real-time, deterministic, 32-bit embedded CPU, that is feature-rich and flexible in design for mainstream devices. Featuring an in-order, dual-issue design with an 11-stage pipeline, it uses an AMBA bus architecture for SoC system compatibility. It implements fully ratified RISC-V extensions for software compatibility and offers memory protection and tightly-coupled memories for real-time determinism. The Catapult-architecture-based core can be configured with L1 cache sizes up to 128KB, I/D TCM sizes up to 128KB and with PMA regions. Optional features include a single-point floating-point (F) and BFloat16 for machine learning tasks and a Bit Manipulation(B) extension is implemented to help with code density. There is an optional interrupt module, debug module, breakpoint triggers and trace. The core is built to the highest industry standard of quality and is backed by a rich portfolio of over 850 fundamental CPU patents to provide the right levels of protection for our partners. It also leverages from over 20 yrs of experience in developing world class portfolio of other complementary IPs like GPU, NNA and EPP

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Imagination Technologies

IMG CXT GPU IP

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IMG CXT is our new flagship GPU IP. As well as outstanding performance for conventional rasterised graphics, IMG CXT introduces the revolutionary PowerVR Photon architecture, bringing high-performance, desktop-quality ray traced visuals to the palm of your hand. Delivering up to 1.3GRay/s, CXT-powered devices will bring features such as ray traced shadows, reflections, global illumination, and ambient occlusion with high frame rates to users on the go. Our Level 4 RTLS solution is possible thanks to a new GPU block called the Ray Acceleration Cluster (RAC), a new, low-power, dedicated hardware GPU block that accelerates and offloads more of the ray tracing computations from the shader cores compared to less-efficient Level 2 RTLS architectures. The RAC consists of the Ray Store, Ray Task Scheduler and Coherency Gatherer and is closely coupled to two 128-wide Unified Shading Clusters (USCs) featuring highspeed dedicated data paths for the most efficient and low-power ray traced deployment. • Brings desktop-quality ray traced visuals to mobile IP – for the first time • The first Level 4 RTLS • Up to 2.5x greater power efficiency than current shipping Level 2/3 RTLS solutions • Scalable to desktop and data centre (up to 9TFLOPS FP32 and over 7.2GRay/s) • 50% more compute and geometry performance than the previous generation

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Altium China

Altium Designer 22

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Global Unichip Corp.

GLink-2.5D (GUC mulit-die interLink) IP

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GLink-2.5D is GUC multi-die interLink IPs which can be used to provide die-to-die inter-connect using TSMC 2.5D advanced package technology (InFO_oS or CoWoS). Die edge is the scarcest resource and GLink-2.5D allows the most efficient use of it by transferring up to 2.5 Tbps of full duplex traffic per every mm of beachfront. GLink-2.5D’s power consumption is 5 times lower than alternative solution using ultra-short reach SerDes-based communication through package substrate. Lead AI & Networking customers apply GLink-2.5D for their advanced products which require multi-die integration meeting best PPA target. Key GLink-2.5D highlights:  Full duplex 2.5 Tbps traffic per 1 mm of beachfront  0.3 pJ/bit (i.e., 0.3W per 1 Tbps of full duplex traffic)  Error-free operation in all PVT corners, changing voltage and temperature, high voltage noise  PPA advantage over SerDes links using package substrate  5 times lower power consumption  2 times smaller silicon area and beachfront  Error-free, no BER, no FEC, no Link and Transaction Layers  2-3 times lower end to end latency  Supports InFO_oS and all CoWoS types (both silicon and organic interposers)  Low area/power overhead for high throughput interconnect enables efficient multi-die CoWoS and InFO_oS solutions up to 2500 mm2 Recently announced UCIe was very similar to GLink-2.5D. GLink-2.5D already supports most of UCIe-1.0 digital and analog functionality. Converting GLink to support UCI is minor, low risk changes for GUC. GUC will fully leverage successful GLink-2.5D to come out UCIe compliant D2D solution in 2023.

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Andes Technology

Upgraded RISC-V superscalar multicore 45MP series

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The multiprocessor A(X)45MP, members of the highly successful 45-series processors, are welcomed by the market since introduced in 2021. A45MP (32-bit) and AX45MP (64-bit) multicore CPU IP are 8-stage superscalar processors based on AndeStar™ V5 architecture. Both support RISC-V standard “G (IMA-FD)” extensions, “C” 16-bit compression instructions, DSP/SIMD ‘P’ extension (draft), execution efficiency of branch prediction, plus Andes Custom Extension™ (ACE) to add user-defined instructions. In addition, both implement MMU (Memory Management Unit) for Linux based applications, and MemBoost with high volume of outstanding data accesses, I/D cache prefetches and data cache write optimization greatly boost the memory operation performance with higher bandwidth and lower latencies. The A(X)45MP symmetric multiprocessor supports up to 8 cores (AX45MP) and a level-2 cache controller with instruction and data prefetch. Coherence manger implements MESI protocol to manage level-1 cache coherence. Other features include ECC for level-1/2 memory soft error protection, Platform-Level Interrupt Controller (PLIC) with enhancements for vectored dispatch and priority-based preemption, CoDense™, StackSafe™ for software quality improvement, and QuickNap™, PowerBrake, and WFI for power management. A(X)45MP are adopted by industry leaders in diversified applications, ranging from high-end MCU, video processing, Wi-Fi 7, 5G base station, AI accelerators, to enterprise-grade storage devices. An example is the general-purpose MPU (Microprocessor Units) SoC from Renesas.

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Andes Technology

AndeSight™ IDE V5.1

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AndeSight™ IDE v5.1 brings the power of application development, debugging, and analysis to the heterogeneous RISC-V multiprocessors, including the cutting-edge Andes RISC-V Superscalar Multicore A(X)45MP and Andes RISC-V Vector Processor NX27V. To support OS with SMP (Symmetric Multiprocessing), besides Linux SMP which has been well supported in RISC-V upstream and Andes platforms, Andes offers the first RISC-V port for SMP Zephyr™ RTOS and Zephyr’s driver subsystem. It has been verified on Andes RISC-V multicore platform. Developers only need to focus on the applications themselves without worrying about the underlying system software. As to AMP (Asymmetric Multiprocessing) demands, AndeSight™ integrates the OpenAMP which provides communication infrastructure between heterogeneous systems and enables AMP applications to leverage parallelism offered by multiprocessor systems. AndeSight™ provides the user-friendly multicore debugging feature for both SMP and AMP systems in one IDE interface. To further enhance the ultimate debugging efficiency for multiprocessors, it offers a handy feature “Core Grouping” by sending debug commands to a set of cores in the same debug session. AndeSight™ also offers the record-and-replay scripting capability to save interactive steps for easy issue reproduction and automatic testing. To simplify the software development and unleash the potential of powerful ISA extensions, AndeSight™ offers full support from toolchains for RVP and RVV, their respective intrinsic functions, highly optimized DSP and Vector libraries, and sample codes to guide code optimization. AndeSight™ facilitates and streamlines the development of embedded systems and provides customers with a versatile integrated environment, including outstanding toolchains and libraries, scripting for automated operations, AndeSim™ near cycle simulator, handy analysis tools, and OS awareness development. Moreover, AndeSight™ provides abundant reference codes that enable developers to get started easily.

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XEPIC Corporation Limited

FusionVerify™ Platform

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FusionVerify Platform is natively built upon Intelligent Compiler, Intelligent Cockpit, Intelligent Debug and Intelligent Cloud Native. It can automatically generate rich test scenarios and support unified cloud-native software architecture. It can integrate different tool technologies to provide customized and comprehensive verification solutions for various designs and different scenarios requirements, solving the compatibility challenges faced by the current industry with separate tools and the verification efficiency challenges caused by data fragmentation.

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RIGOL TECHNOLOGIES CO., LTD.

HDO4000 Series High-resolution Digital Oscilloscopes

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RIGOL's new HDO4000 series high-resolution digital oscilloscope is equipped with the new generation oscilloscope dedicated chipset "Centauri" independently designed and developed by RIGOL. The maximum analog bandwidth reaches 800MHz, the highest real-time sampling rate is 4GSa/s, and the maximum storage depth is 500Mpts. At the same time, HDO4000 has 12bit vertical resolution and 4096-level quantization index, providing 16 times the observation experience of 8bit oscilloscope. HDO4000 is the first digital oscilloscope in the industry to achieve the maximum vertical sensitivity of 100uV/div with the new chipset. At the same time, the noise index of HDO4000 is also in a leading position in the industry. HDO4000 has the characteristics of high resolution and ultra-low noise, fully meet the requirements of small signal testing such as power ripple test, power rail test and low power consumption test. In addition, HDO4000 will also provide powerful test and measurement support in automotive bus, semiconductor testing, education and research.

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Keysight technologies

PCIE5.0 protocol analyzer

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PCIE5.0 protocol analyzer is composed of protocol analyzer board P5552A and test backplane P5563A. The product adopts distributed structure and can be flexibly inserted and removed without user calibration. P5552A protocol analyzer built 16GB storage space, support PCI 1.0-5.0 standard, support X4, X8, X16 different link width CEM physical layer interface. Protocol analysis includes logic sub-layer (TS1/TS2/Ordered sets), data link layer (ACK/NAK, Sequencing number, Replay, etc.) and transaction layer analysis (Memory, Config, I/O Read&Write, etc.). Standard CEM connector is supported for connecting the analyzer between the motherboard and the card. It is widely used in data centers and cloud computing industries to analyze protocols for PCIE interfaces such as servers and accelerators. Compared with other manufacturers, P5552A protocol analyzer is small in size, its physical size is full height/half length; Good scalability, supporting 2.5GT/s, 5GT/s, 8GT/s, 16GT/s, 32GT, S rate and NRZ modulation format, can be extended to PCIE6.0/PAM4 modulation format; Good signal integrity, signal compensation, acquisition and processing are realized in the board, without the need to transmit data to external analysis equipment through long cables.

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Tektronix(China)Co.,Ltd.

IsoVu Isolated Probes

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IsoVu probe technology delivers accurate differential measurements up to ±2500 V on reference voltages slewing ±60 kV at 100 V/ns or faster. With the IsoVu Generation 2 design, you get all the benefits of IsoVu technology at 1/5 of the size of first generation probes. With versatile MMCX connectors and an unmatched combination of bandwidth, dynamic range, and common mode rejection, IsoVu Gen 2 probes are setting new standards for isolated probe technology and enabling wide bandgap power designs using SiC and GaN. IsoVu technology uses power-over-fiber and an optical analog signal path for complete galvanic isolation between the measurement system and your DUT. By allowing the probe to float independently at the common mode voltage, isolation provides important advantages. • 160 dB (100 million to 1) CMRR at DC • Up to 120 dB (1 million to 1) CMRR at 100 MHz • Up to 80 dB (10,000 to 1) CMRR at 1 GHz • ±60 kV Common Mode Voltage range • Up to ±2500 V differential input Voltage range • Up to ±2500 V offset range

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SIGLENT TECHNOLOGIES CO., LTD

SDS6000L Series Digital Storage Oscilloscope

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TE Connectivity

TE SFP-DD Cages and Connectors

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TE SFP-DD (small form-factor pluggable double density) cages and connectors provide two lanes of PAM-4 56 Gbps speeds to address higher demand for port density and scalability in next generation networking, data center and wireless infrastructure applications. Benefits: • 2-lane interconnect with higher density and better signal integrity than SFP28/56 • Backward-compatibility • Space savings as compared to QSFP28/QSFP56 solution • Industry leading thermal management • Offer system design flexibility

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ERS electronic GmbH

AC3 Fusion

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In April this year, ERS introduced AC3 Fusion, a new series of high-performance chillers that have three default on-site configurable modes, and a Fusion mode that allows the key parameters to be defined by the user. As an extension of ERS AC3 thermal chuck system, AC3 Fusion retains the patented high efficient heat exchanging technology (ACP) introduced in 2015, which has gained a reputation for being one of the most cost-efficient and resource-friendly thermal chuck systems in the industry due to its recycling of the air three times: for pre-cooling, cooling, and purging. To further minimize costs and energy consumed during temperature tests, the AC3 Fusion offers the ECO mode, which can save up to 65% energy during ambient and hot tests. Compared with competitive products, ERS's AC3 Fusion thermal chuck system is one of the most energy- and resource-efficient wafer probing solutions, aiding the development of a sustainable economy.

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Rohde & Schwarz(China)Technology Co., Ltd

R&S®AREG800A Automotive Radar Echo Generator

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The R&S®AREG800A automotive radar echo generator is an innovative and versatile solution for testing automo¬tive radar sensors. It not only supports traditional single antenna frontends, innovatively adds support of advanced antenna array with multiple integrated antennas, all test requirements for the most advanced radar scenario simu¬lations are covered. The AREG800A is the key enabler for testing automo¬tive radar sensors and ADAS/AD features. Complex artifi¬cial objects can be generated with variable distance, radial velocity, size (RCS) and azimuth angle. With an instanta¬neous bandwidth of 4 GHz ranging anywhere between 76 GHz and 81 GHz, the typical frequency range of today’s and future automotive radar sensors is covered. Being able to simultaneously generate up to 32 dynamic artificial objects makes it possible for the first time to run realistic and reproducible tests in lab environments. The AREG800A meets all requirements for demand¬ing automotive radar echo generation applications:  Simulation of objects with dynamic distance variation during early R&D, chipset development and radar sensor validation  Hardware-in-the-loop (HiL) test cases during ADAS/AD feature and algorithm development  Vehicle-in-the-loop (ViL) test cases with realistic driving scenarios on the roller dyno for vehicle certification and homologation  Production of state-of-the-art 4D imaging radar sensors with high demands on the radar test equipment  Simulation of angular echo distribution or multiple echoes from a single direction The AREG800A enables users to tackle major autonomous driving challenges. Driving tests for ADAS/ AD feature development and validation can be transferred from the road to the test rig in a realistic manner. This streamlines R&D, testing and validation times, optimizes time to market for new radar sensors and ADAS/AD func¬tions, and reduces R&D and test costs

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Chengdu KSW Technologies Co.,Ltd.

KSW-VSG02 Vector Signal Generator

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Main Features: Covering the frequency range of 100KHz ~ 44GHz, it has excellent vector modulation performance. Its built-in baseband signal generator is simple to set, flexible in functions, and has many modulation formats. It can also edit and download the customized waveform to simulate various complex signals. With the maximum 2GHz RF bandwidth, it can meet the need of wide bandwidth signal simulation. Whether analog or vector modulation signal, the signal quality is excellent, which is not only an ideal local oscillator and clock source, but also a high performance complex vector modulation signal generator. Application field: 1) The workflow of semiconductor design and packaging test need to use vector signal generator to characterize the chip. 2) Vehicle production, supply of electronic components, semiconductor chipset manufacturing, battery and charging infrastructure all require the use of vector generator. 3) The standard setting, R&D, production and volume manufacturing of 5G are highly dependent on vector signal generator. At the same time, the research, development and technology upgrade of the Internet of things need to be based on electronic measurement technology. 4) Vector signal source is a basic tool for engineering majors. The investment in higher education continues to increase, and the demand for vector signal generator is expected to increase further in the future. Key strengths and competitors: 1) Modulation bandwidth up to 2GHz, more than other domestic signal generator, and R&S (Germany) and Keysight (United States) the same index. 2) Modulation bandwidth up to 2GHz, while the frequency up to 44GHz signal generator, with competitive advantages. The foreign products with the same bandwidth and frequency are subject to export licensing restrictions. 3) Waveform file storage depth is large, can be used for a long time waveform playback. It is an important index in the application of acquisition and playback of electromagnetic environment, GNSS receiver test, electronic countermeasure scene simulation and so on. 4) The performance of phase noise and EVM accuracy exceed domestic peers, on par with the global top product performance. 5) Built-in channel fading simulator, make full use of the company's technology accumulation in wireless channel simulator. 6) Support real-time Pulse Description Word (PDW), can be used for radar receiver electromagnetic environment simulation.

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