AspenCore is committed to creating the most influential system design event in China.
Forward-looking innovative technology, industry information exchange and comprehensive coverage
of industrial opportunities, International IC & Component Exhibition and Conference (Abbr.: IIC)
is committed to creating an efficient and authoritative communication platform for the
AspenCore is taking a global perspective and enthusiasm to serve local industries, assist local enterprises to communicate deeply with the world's leading technology manufacturers, quickly grasp the industry development trend, inspire innovative design ideas, assist Chinese engineers to complete emerging breakthrough technologies required for innovative design, and continue to promote China's integrated circuit technology innovation and industrial coordinated development.
IIC Shenzhen 2023 combines industry exchanges, multi-channel interaction, and resources aggregation, and brings together annual innovative product display, technology exchange, high-end forum, and industry summit. The exhibition sets up high-end exhibition areas such as IC design and application area, distributor area, and semiconductor comprehensive exhibition area, etc., to display IC design, EDA\IP, Internet of Things, AI, automotive electronics, green energy, smart industry, wireless technology, and other major emerging technologies and products.
Global CEO Summit, Global Distributions & Supply Chain Leaders Summit, the 26th High Efficiency Power Management and Devices Seminar, EDA/IP and IC Design Forum,Wireless Connection Technology and Application Forum, AI Chip Technology and Application Forum, and IIC Shenzhen Autumn “Chip” Product Launch Conference will be held during IIC Shenzhen 2023. Leaders of electronics industry at home and abroad, managements, design elites and decision makers will be brought together to discuss and exchange the latest trends of the electronics industry and technology, which encourages more inspiration to the industry, building a bridge and bond for global technology enterprises to share development opportunity.
Impact the technical decision-making of Chinese engineers when they develop products.
Accurately publicize your information to China’s largest electronics community.
Meet the technical needs of engineers for designing next-generation electronic products.
Display your designs and solutions and ensure that engineers adopt your latest technology.
Ignite the inspiration of engineers for innovative design, influence their technical choices and increase your market share.
Assist engineers in solving design problems and establishing an image of technology leader.
Help engineering designers learn more about innovative applications and solutions.
Global CEO Summit
Global Distribution & Supply Chain Leaders Summit
2023 World Electronics Achievement Awards CeremonyMore
2023 Global Electronic Component Distributor Awards CeremonyMore
Wireless Connection Technology and Application Forum
The 26th High Efficiency Power Management and Power Devices Conference
EDA/IP and IC Design Forum
AI Chip Technology and Application Forum
By Metro: Metro Line 1/Line 4 Convention and Exhibition Center Station, Exit A1
By taxi/car: It takes around 10 minutes from the Futian or Huanggang Check Point, 20 minutes from the Luohu or Shenzhen North Railway Station, 30 minutes from the Shenzhen Bao'an International Airport (SZX), and one hour from the Hong Kong International Airport (HKG) to get to the hotel.
Exhibition&Speech reservation contact:Angel He
Media contact:Jasmine Yang
Audience contact:Lisa Ling