IICShenzhen2026

Overview

Organized by AspenCore, a leading global technical media institution in electronic engineering, International IC & Component Exhibition and Conference (IIC Shenzhen 2026) will be held on December 2–3, 2026, in Shenzhen. This premier event serves as a high-level, global, and forward-looking industry platform dedicated to integrated circuits, electronic components, and supply chain ecosystems.

The conference will dive deeply into key technology sectors including IC design, EDA/IP, AI, power management, smart manufacturing, and automotive electronics. A series of featured events will be held alongside, such as the Global CEO Summit，2026 World Electronics Achievement Awards Ceremony， Global Distribution & Supply Chain Leaders Summit，2026 Global Electronic Component Distributor Awards Ceremony， AI + Consumer Electronics Applications Forum， The 32nd High Efficiency Power Management and Power Devices Conference，International Industry 4.0 and Technology and Application Forum. By gathering leading enterprises and innovative players from around the world, IIC Shenzhen 2026 aims to build a full chain collaboration bridge for technology demonstration, idea exchange, strategic partnership, and ecosystem co creation, thereby accelerating innovation and global synergy in China’s integrated circuit industry.

Highlights

Spotlight on Cutting-Edge Tech

Showcase IC design, EDA/IP, AI, power management, smart manufacturing, and automotive electronics, and other emerging technology and products, gather China’s largest electronics community, and provide applied innovations and solutions to design challenges.
Technical Exchange & Partnership Opportunities

A professional networking platform driving technical collaboration and resource sharing and helping unlock new partnerships and market opportunities.
High-profile Industry Dialogues

Global CEO Summit, Global Distributions & Supply Chain Leaders Summit, and other technical forums gather industry leaders to exchange insights that drive innovation breakthroughs.
High-value Networking

Engage face-to-face with industry elites to build high-value connections through World Electronics Achievement Award (WEAA) ceremony and Global Electronic Component Distributor Awards ceremony.
One Stop Shop of Global Resources

Display area features global tech giants and local pioneers, presenting frontier technologies while consolidating quality industry resources.

Content

12.02

2026 Global CEO Summit
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AI is fundamentally rewriting the DNA of the semiconductor and electronics industries. We are witnessing a profound structural shift—one driven by application-specific demands and system-level integration. The “permeation” of AI extends beyond isolated innovations. It spans computing architectures, memory systems, power, and manufacturing, while also reaching into end-device intelligence and industrial ecosystem collaboration. This influence is now systematically reshaping technology roadmaps, engineering frameworks, and industrial division of labor.

Looking ahead to 2027, this CEO Summit addresses a pivotal question: Amid current technological and market dynamics, which global semiconductor trends offer long-term certainty? Where do the critical divergences remain? Centered on six domains—computing power & chips, memory systems, automotive/industrial intelligence, power and energy architecture, manufacturing & advanced packaging, and industrial ecosystems—the summit convenes global CEOs, technology pioneers, and industry decision-makers. Through in-depth discussions on consensus foundations, non-consensus opportunities and strategic choices in the context of AI penetration, the summit aims to provide enterprises with more forward-looking and actionable insights for mid-to-long-term planning.
2026 World Electronics Achievement Awards
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AI + Consumer Electronics Application Forum
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The consumer electronics industry is moving decisively from standalone smart features to context-aware intelligence. Empowered by on-device AI and large model technologies, end-user devices are increasingly capable of autonomous decision-making and delivering personalized services. Centered on "AI + Consumer Electronics," this forum focuses on how terminals can evolve from tools into "contextual partners." By exploring key pathways such as device-cloud collaboration, interaction innovation, and ecosystem co-building, the forum aims to propel the industry's shift from a hardware-centric to a scene-value-driven model and to collectively define the next value vision for intelligent terminals.

12.03

2026Global Distribution & Supply Chain Leaders Summit
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Centered on the theme "Smart Symbiosis · The Future of Resilient Networks," this summit addresses a pivotal challenge: Amidst regional restructuring and deepening industrial specialization, how can enterprises leverage intelligent solutions to build more collaborative, resilient, and sustainably evolving global distribution and supply networks? Against a backdrop of profound global industrial realignment and accelerating supply chain regionalization and specialization, distribution and supply chain systems are shifting from efficiency-driven models to a new era prioritizing resilience and collaboration. Uncertainty is no longer a short-term disruption but a long-term structural force, compelling companies to rethink their supply networks’ design logic, partnership models, and capability boundaries. The Summit will bring together leading figures from global distributors, supply chain service providers, industry platforms, and manufacturers to explore critical topics including global distribution network restructuring, regional configuration, specialized division of labor, dital-itelligent epowerment, collaborative mechanisms, and risk response. By sharing real-world case studies and visionary foresight, participants will discuss how the distribution and supply chain system can evolve from merely "responding to uncertainty" toward achieving systemic symbiosis and capability advancement.
2026 Global Electronic Component Distributor Awards
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The 32nd High Efficiency Power Management and Wide Bandgap Semiconductor Technology Application Forum
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Amidst the global energy transition and the dual carbon goals，efficient energy conversion and management have become central to technological innovation. Wide bandgap semiconductor technologies, represented by Silicon Carbide (SiC) and Gallium Nitride (GaN), are profoundly reshaping the landscape of power electronics with their outstanding advantages of high efficiency, high frequency and high power density. They are driving breakthroughs in energy efficiency everywhere, from data centers and electric vehicles to renewable energy generation and industrial automation. Seizing this moment, AspenCore cordially invites you to the 32nd Efficient Power Management and Wide Bandgap Semiconductor Technology Application Forum. This forum aims to create a platform for in-depth exchange among industry engineers, technical experts, and business leaders. It will focus on key topics such as the disruptive demands for power systems driven by the surging AI computing power, the maturity and market applications of SiC and GaN technologies, the development trends of intelligent PMIC, as well as system-level reliability and thermal management solutions.

The forum will bring together top-tier semiconductor manufacturers, power solution providers, testing and measurement experts, and industry users from around the world. Through a series of compelling presentations and in-depth dialogues, participants will jointly explore cutting-edge technologies, share success stories, and gain insights into market trends. Concurrent events, including the Global CEO Summit and the International Industry 4.0 Technology & Application Forum, will offer a comprehensive view of the latest dynamics in the electronics industry. Let us gather to discuss the future of high-efficiency power and jointly open a new chapter in green energy.
International Industry 4.0 and Technology and Application Forum
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The deep integration of generative AI, industrial large models, edge computing, and low-carbon technologies is accelerating the evolution of manufacturing systems into intelligent agents with cognitive capabilities, automation, and autonomous collaboration. Virtual factories built through digital twin technology, combined with real-time quality inspection powered by edge AI, are driving the industrial chain‘s transition from linear manufacturing to a data-driven circular manufacturing model. At this critical juncture where global manufacturing is advancing towards automation, green practices, and enhanced flexibility, the International Industry 4.0 Technology & Application Forum, a key concurrent event of IIC Shenzhen 2026 , is committed to establishing a forward-looking platform for dialogue. It will convene leading global enterprises and experts from fields such as smart chips, industrial software, automation equipment, the Industrial Internet, and green manufacturing to jointly explore future industry trends and directions for technological innovation.