In 2025, as digital transformation and intelligent technologies integrate deeply, “Digital Embodiment”, the core interface for AI to interact with the physical world, is becoming a strategic focus of global technological competition. Building intelligent embodied systems capable of autonomous environmental sensing, real-time decision-making, and physical interaction marks a paradigm shift in artificial intelligence—from “disembodied intelligence” (purely data-driven) to “embodied intelligence” (interaction grounded in the physical world). From industrial manufacturing and healthcare to home services and consumer electronics, embodied AI combines physical devices with large AI models to close the loop between perception and action. Its applications have already penetrated numerous fields.

As a foundational pillar of the digital era, the semiconductor industry stands at the heart of this transformation. It faces unprecedented opportunities as the wave of “Digital Embodiment” reshapes innovation trajectories across chip design, materials science, and system integration. This summit will bring together global leaders from the semiconductor sector to explore the challenges and opportunities of the Digital Embodiment era, driving the industry toward the forefront of innovation in "silicon-based lifeforms."

Roundtable Forum Theme：Digital and Analog Chips: New Paradigms in the Age of Intelligence