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OVERVIEW

Emerging technologies such as the Internet, AI, smart devices, new energy vehicles, and autonomous driving are continuously improving people's life and improving the global environment of human beings.

The driving force behind all of this is "chips". Semiconductors are replacing oil and becoming the "strategic resource base" that the world's major economies are vying for. With the theme of " Semiconductor for Better Life", the 2023 “Global CEO Summit” will invite global leaders in the semiconductor industry to share with the audience the impact of semiconductors on technology and economic development, envision future technology trends and emerging application opportunities, and discuss how to achieve win-win cooperation under the complex and ever-changing geo-political situation, so that the semiconductor industry will sustain healthy development.

SPEAKERS
  • Dr. Wei Shaojun
    President, IC Design Branch of CSIA, Professor of TsingHua University

  • Dr. Ahmad Bahai
    Texas Instruments CTO

  • Lianfeng Yang
    President, Primarius Technologies, Co., Ltd.

  • Markus Mosen
    WeEn Semiconductors CEO

    Markus Maria Mosen, born in 1959 in Germany, holds his master's degree from the University of Cologne, Germany. From 1992 to 1998, he served as senior analyst and manager of Strategy and Business Development department of Siemens, Germany. From 1999 to 2007,he was Vice President of Infineon Technologies. From 2007 to 2015, he was VP of NXP Semiconductors Ltd. Since 2016, he has been the general manager of WeEn Semiconductor. Mr. Markus has participated in and witnessed the major milestone of the global semiconductor industry. His rich experience and diversified international perspective make him have strong foresight and execution ability in the fields of enterprise management and industrial investment and he has made outstanding contributions to promoting the development of the global intelligent manufacturing industry.

  • Dr Robert Bi
    CTO of Fortior Technology

  • Aaron Wang
    CEO and Founder ,ASL Xiamen Technology CO.,LTD

  • Min Chen
    Vice President, Technical Field Operations of AP, Cadence Design Systems, Inc

    Mr. Min Chen is the Vice President Technical Field Operations of Cadence, fully responsible for the technical operation of Cadence in the Asia-Pacific region, and leads the technical team to support industry customers and industrial development in the Asia-Pacific region. Min Chen joined Cadence in 2012 and successively held senior management positions such as Cadence China Technical Senior Director and AP Technical Senior Group Director. Adhering to the concept of customer first, he is committed to building a service system of quality first and customer first, providing high-quality service and support for every customer, which has been highly recognized by the industry. Mr. Min Chen graduated from Tsinghua University and has rich experience in Semiconductor and EDA industry for nearly 30 years. Before joining Cadence, he worked in Magma Design Automation and Beijing Institute of Microelectronics Technology.

  • Wang Hongyu
    Bosch Sensortec Regional President APAC

    Hongyu Wang was appointed as regional president Asia Pacific of Bosch Sensortec in July 2020. He has been in the sensor and semiconductor industry for nearly 17 years. Hongyu joined the Bosch Group in 2006 and held various positions across various business units and regions. His Bosch career started at Bosch Central Research Institute in Stuttgart. As a scientific research engineer, he was mainly responsible for the development and design of sensor-related digital signal processing hardware and algorithms. In 2009, he transferred to Bosch Automotive in Suzhou as the electronic system development manager. Since 2010, he joined Bosch Sensortec in Shanghai as ASIC project manager and department head. At the beginning of 2018, he joined BSH Home Appliances in Nanjing and was responsible for electronic system and software development. He was appointed as the head of BSH Home Appliances Global Electronics and Motors Division for Greater China region at the end of 2019. Wang Hongyu obtained his bachelor's degree in electrical engineering from Zhejiang University, China and master's degree in electronic information technology from the University of Stuttgart, Germany.

  • Dr. Xiaoxin Qiu
    Founder and CEO of Axera Semiconductor (Ningbo) Co., Ltd

  • Daniel Cooley
    Chief Technology Officer and Senior Vice President, Technology and Product Development, Silicon Labs

    Daniel Cooley serves as Chief Technology Officer and Senior Vice President Technology and Product Development, where he is responsible for the company’s overall research and development strategy and execution. Cooley is a respected IoT industry visionary and has been instrumental in building the unmatched breadth and depth of the company’s wireless connectivity portfolio. Previously, Daniel served as Senior Vice President and Chief Strategy Officer, where he led Silicon Labs’ overall strategy, corporate development, M&A, emerging markets, and security. Prior to that, Daniel led Silicon Labs’ IoT business as Senior Vice President and General Manager. Since 2005, Cooley has served in a variety of engineering and business leadership positions at Silicon Labs in the US, Asia and Europe. He has an M.S. in Electrical Engineering from Stanford University and a B.S. in Electrical Engineering from The University of Texas at Austin and holds four patents in radio and low-power technology. Daniel currently serves on the board of directors for the Thinkery, Texas 4000, and the Austin Symphony Orchestra.

  • Nitin Dahad
    Correspondent of EE Times, EE Times Europe, Editor-in-Chief of embedded.com

    Nitin Dahad is Editor in Chief of embedded.com, as well as a correspondent for EE Times. An electronic engineering graduate from City University, he’s been an engineer, journalist and entrepreneur. He was part of ARC International’s startup team and took it public, and he co-founded a publication called The Chilli in the early 2000s. Nitin has also worked with National Semiconductor, GEC Plessey Semiconductors, Dialog Semiconductor, Marconi Instruments, Coresonic, Center for Integrated Photonics, IDENT Technology and Jennic. Nitin also held a role with government promoting U.K. technology globally in the U.S., Brazil, Middle East and Africa, and India. 

  • James Liu
    Vice president and general manager China of Imagination Technologies

  • Shengxi Chen
    CEO of Shearwater Greater China

  • Lei Chen
    Vice general manager

    Lei Chen graduated from Wuhan University of technology, who has more than 20 years of experience in sales and product market in the semiconductor industry. He has a keen industry thinking. He has held important positions in many semiconductor enterprises and achieved good results. He has successively served in STMicroelectronics, Freescale™ Semiconductor, Western digital and Macronix. He have made achievements in NOR flash market promotion, MCU product definition and storage market development. In 2019, he joined Dosilicon and led the team to build the memory ecosystem at home and abroad. With many years of experience, he led the team to explore the product market and bring Dosilicon's storage products into a wider field.

  • Xiong Wen
    Vice President of EnnoCAD

AGENDA
  • Time
  • Agenda

08:30-09:20

Registration & Display

09:20-09:30

Welcome Remarks

09:30-09:55

Semiconductor — the power to change the world

  • Dr. Wei Shaojun, President, IC Design Branch of CSIA, Professor of TsingHua University

09:55-10:20

The Value of Semiconductors in Improving the Global economy and quality of life

  • Dr. Ahmad Bahai, Texas Instruments CTO

10:20-10:45

Integrated Innovation, EDA Empowered full Custom Memory IC Design

  • Lianfeng Yang President, Primarius Technologies, Co., Ltd.

10:45-11:10

Power Semiconductors Contribute to a Cooler Planet

  • Markus Mosen, WeEn Semiconductors CEO
Markus Maria Mosen, born in 1959 in Germany, holds his master's degree from the University of Cologne, Germany. From 1992 to 1998, he served as senior analyst and manager of Strategy and Business Development department of Siemens, Germany. From 1999 to 2007,he was Vice President of Infineon Technologies. From 2007 to 2015, he was VP of NXP Semiconductors Ltd. Since 2016, he has been the general manager of WeEn Semiconductor. Mr. Markus has participated in and witnessed the major milestone of the global semiconductor industry. His rich experience and diversified international perspective make him have strong foresight and execution ability in the fields of enterprise management and industrial investment and he has made outstanding contributions to promoting the development of the global intelligent manufacturing industry.

11:10-11:35

Multi-core Architecture for High-performance Motor Control Chips

  • Dr Robert Bi,CTO of Fortior Technology
Multi-core processors have been widely used in many traditional application domains. Such industry shift to multi-core architecture arouses great interest in motor control applications. The increasingly developed modern industrial electronics and household appliances, especially AI-based products, communication devices and automotive electronics, propose higher and higher requirements for motor controls in order to implement more and more complicated tasks. Meanwhile, multicore processing is increasing rapidly as the single-core processors are already unable to meet the demands of highly advanced time critical applications and the highly complex motor system requires the control chips to appear attractive cost-performance ratio. Fortior Technology has already adopted dual-core architecture in its motor control chips and is developing various control chips with multi-core architecture to cover the demands for motor efficiency, communication, protection features and prognostics and health management as required in the newly updated control systems.

11:35-12:00

Present and Future of High-Speed interface and display ICs

  • Aaron Wang, CEO and Founder ,ASL Xiamen Technology CO.,LTD
#1 Interface trend introduction USB, Thunderbolt, PCI Express, HDMI and DisplayPort, Ethernet ;#2 Future Trends and Developments: Higher Data Transfer Speeds , Integration of More Features ,Smaller Form Factors ;#3 ASL Technology and product roadmap

12:00-14:00

Lunch Break

14:00-14:25

Pervasive AI acceleration , new era of EDA evolution

  • Min Chen, Vice President, Technical Field Operations of AP, Cadence Design Systems, Inc
Mr. Min Chen is the Vice President Technical Field Operations of Cadence, fully responsible for the technical operation of Cadence in the Asia-Pacific region, and leads the technical team to support industry customers and industrial development in the Asia-Pacific region. Min Chen joined Cadence in 2012 and successively held senior management positions such as Cadence China Technical Senior Director and AP Technical Senior Group Director. Adhering to the concept of customer first, he is committed to building a service system of quality first and customer first, providing high-quality service and support for every customer, which has been highly recognized by the industry. Mr. Min Chen graduated from Tsinghua University and has rich experience in Semiconductor and EDA industry for nearly 30 years. Before joining Cadence, he worked in Magma Design Automation and Beijing Institute of Microelectronics Technology.

14:25-14:50

Perceiving the future with embedded AI and MEMS sensors

  • Wang Hongyu, Bosch Sensortec Regional President APAC
The expansion of emerging applications of IoT is inseparable from the drive of new technologies. Thanks to the fusion of edge AI and sensors, various innovative applications in the field of consumer electronics have been implemented, and user experience optimization has been achieved. Mr. Wang Hongyu, Regional President APAC of Bosch Sensortec, will introduce the latest solutions at different complexity levels of how new technological developments enrich sensor related use cases for consumer electronics and IoT devices., and enable improvement of well-being and lifestyle.
Hongyu Wang was appointed as regional president Asia Pacific of Bosch Sensortec in July 2020. He has been in the sensor and semiconductor industry for nearly 17 years. Hongyu joined the Bosch Group in 2006 and held various positions across various business units and regions. His Bosch career started at Bosch Central Research Institute in Stuttgart. As a scientific research engineer, he was mainly responsible for the development and design of sensor-related digital signal processing hardware and algorithms. In 2009, he transferred to Bosch Automotive in Suzhou as the electronic system development manager. Since 2010, he joined Bosch Sensortec in Shanghai as ASIC project manager and department head. At the beginning of 2018, he joined BSH Home Appliances in Nanjing and was responsible for electronic system and software development. He was appointed as the head of BSH Home Appliances Global Electronics and Motors Division for Greater China region at the end of 2019. Wang Hongyu obtained his bachelor's degree in electrical engineering from Zhejiang University, China and master's degree in electronic information technology from the University of Stuttgart, Germany.

14:50-15:15

Edge Intelligence: Embarking on the Journey of Inclusive AI

  • Dr. Xiaoxin Qiu, founder and CEO of Axera Semiconductor (Ningbo) Co., Ltd
Artificial intelligence has entered a new era, and the semiconductor industry is also embracing new development opportunities. The deployment of intelligent edge and end devices, closer-to-the-user, is becoming an inevitable trend. As a platform chip company supporting edge intelligence, Axera focuses on perception and computation, with "Smart Cities + Smart Driving" as its two main stratagems. At the same time, Axera is also strategically positioning itself in the large markets of robotics and smart IoT, aiming to facilitate inclusive AI for the general population.

15:15-15:40

Charting the Connected Future

  • Daniel Cooley, Chief Technology Officer and Senior Vice President, Technology and Product Development, Silicon Labs
Silicon Labs will discuss the final steps needed to achieve the full potential of cloud-connected embedded computing, and how unifying the cloud and embedded will truly build a smarter, more connected world.
Daniel Cooley serves as Chief Technology Officer and Senior Vice President Technology and Product Development, where he is responsible for the company’s overall research and development strategy and execution. Cooley is a respected IoT industry visionary and has been instrumental in building the unmatched breadth and depth of the company’s wireless connectivity portfolio. Previously, Daniel served as Senior Vice President and Chief Strategy Officer, where he led Silicon Labs’ overall strategy, corporate development, M&A, emerging markets, and security. Prior to that, Daniel led Silicon Labs’ IoT business as Senior Vice President and General Manager. Since 2005, Cooley has served in a variety of engineering and business leadership positions at Silicon Labs in the US, Asia and Europe. He has an M.S. in Electrical Engineering from Stanford University and a B.S. in Electrical Engineering from The University of Texas at Austin and holds four patents in radio and low-power technology. Daniel currently serves on the board of directors for the Thinkery, Texas 4000, and the Austin Symphony Orchestra.

15:40-16:05

A Global Perspective on the Semiconductor Industry

  • Nitin Dahad, Correspondent, EE Times, EE Times Europe Editor-in-Chief, embedded.com
As an editor at large covering many conferences, events, and individual briefings over the last year, Nitin Dahad provides an outline of the key trends in the global semiconductor industry, as viewed through his conversations and stories.
Nitin Dahad has diverse experience spanning almost 40 years in the electronics industry. In the 1990s, Nitin was part of the startup team at Arc International that took it to the USA and also to a billion-dollar IPO. He then supported several startups with growth culminating in acquisition by blue chip names in tech. He founded a number of media startups including The Chilli, a pioneering publication for tech entrepreneurs and investors, and The Next Silicon Valley, covering innovation ecosystems around the world. He mentored with various accelerators and is currently an entrepreneurship school mentor at London Business School. As UK government advisor, he helped promote tech industry alliances with the USA, Brazil, Middle East, Africa and India.

16:05-17:10

Roundtable Topic: Executive Foresee: The Next big thing

  • Host:Steve Gu, AspenCore Senior Industry Analyst James Liu, Vice president and general manager China of Imagination Technologies Wang Hongyu, Bosch Sensortec Regional President APAC Shengxi Chen,CEO of Shearwater Greater China Lei Chen,vice general manager Dr. Robert Bi,CTO of Fortior Technology Xiong Wen, Vice President of EnnoCAD