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杭州地芯科技有限公司

Hangzhou Geo-chip Technology Co., Ltd.

展位号: 1E17

杭州地芯科技有限公司,成立于2018年,总部位于中国杭州,并在上海、深圳设有公司分部。公司研发方向包括5G无线通信高端射频芯片、低功耗高性能的物联网射频芯片、高端工业电子模拟射频芯片以及无线通信解决方案等产品;横跨信号链、监测链、时钟链等多类型芯片;终端应用场景覆盖无线通信、消费电子、工业控制、医疗器械等多种领域。作为国家高新技术企业,地芯致力于成为全球领先的5G、物联网以及工业电子的高端模拟射频芯片的设计者。

Founded in 2018, Hangzhou Geo-chip Technology Co., Ltd. is headquartered in Hangzhou, China, branched in Shanghai and Shenzhen.
The development direction includes high-end RF chips for 5G wireless communication, low power consumption and high performance Internet of Things RF chips, high-end industrial electronics analog RF chips and wireless communication solutions and other products. Terminal application scenarios cover wireless communication, consumer electronics, industrial control, medical devices and other fields.

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